Wafer-to-wafer bonding can reduce yields, since if any 1 of N chips in a 3D IC are defective, the entire 3D IC will be defective.
晶圓對晶圓鍵合，可以減少產量，因為如果在3D IC 1的N芯片是有缺陷的，整個3D IC將有缺陷。