CVE-2023-21671 (published 2023-11-07T05:26:28.659Z)
Memory Corruption in Core during syscall for Sectools Fuse comparison feature.
Affected products: Vendor: Qualcomm, Inc.
Product: Snapdragon
Versions: FastConnect 6700, FastConnect 6900, QCA6391, QCM6490, QCS6490, QSM8350, Qualcomm Video Collaboration VC3 Platform, SD888, SM7315, SM7325P, Snapdragon 778G 5G Mobile Platform, Snapdragon 778G+ 5G Mobile Platform (SM7325-AE), Snapdragon 780G 5G Mobile Platform, Snapdragon 782G Mobile Platform (SM7325-AF), Snapdragon 7c+ Gen 3 Compute, Snapdragon 888 5G Mobile Platform, Snapdragon 888+ 5G Mobile Platform (SM8350-AC), WCD9370, WCD9375, WCD9380, WCD9385, WCN6740, WSA8830, WSA8835