CVE-2023-21634 (published 2023-12-05T03:03:43.564Z)
Memory Corruption in Radio Interface Layer while sending an SMS or writing an SMS to SIM.
Affected products: Vendor: Qualcomm, Inc.
Product: Snapdragon
Versions: AQT1000, FastConnect 6200, FastConnect 6800, FastConnect 6900, QCA6310, QCA6320, QCA6391, QCA6420, QCA6426, QCA6430, QCA6436, QCA6574AU, QCA6595AU, QCA6696, SA6145P, SA6150P, SA6155P, SA8145P, SA8150P, SA8155P, SA8195P, SD835, SD855, SD865 5G, Snapdragon 835 Mobile PC Platform, Snapdragon 855 Mobile Platform, Snapdragon 855+/860 Mobile Platform (SM8150-AC), Snapdragon 865 5G Mobile Platform, Snapdragon 865+ 5G Mobile Platform (SM8250-AB), Snapdragon 870 5G Mobile Platform (SM8250-AC), Snapdragon W5+ Gen 1 Wearable Platform, Snapdragon Wear 4100+ Platform, Snapdragon X55 5G Modem-RF System, Snapdragon XR2 5G Platform, SW5100, SW5100P, SXR2130, WCD9335, WCD9340, WCD9341, WCD9380, WCN3610, WCN3660B, WCN3680B, WCN3980, WCN3988, WCN3990, WSA8810, WSA8815, WSA8830, WSA8835