CVE-2023-33085 (published 2024-01-02T05:38:37.667Z)
Memory corruption in wearables while processing data from AON.
Affected products: Vendor: Qualcomm, Inc.
Product: Snapdragon
Versions: AR8035, FastConnect 6200, FastConnect 6700, FastConnect 6900, FastConnect 7800, Flight RB5 5G Platform, QAM8255P, QAM8295P, QAM8650P, QAM8775P, QCA6174A, QCA6391, QCA6574, QCA6574A, QCA6574AU, QCA6595, QCA6595AU, QCA6696, QCA6698AQ, QCA6797AQ, QCA8081, QCA8337, QCA9377, QCM4325, QCM6490, QCN6024, QCN9011, QCN9012, QCN9024, QCS410, QCS610, QCS6490, QCS8550, QDU1000, QDU1010, QDU1110, QDU1210, QDX1010, QDX1011, QRB5165M, QRB5165N, QRU1032, QRU1052, QRU1062, Qualcomm Video Collaboration VC1 Platform, Qualcomm Video Collaboration VC3 Platform, Robotics RB5 Platform, SA4150P, SA4155P, SA6145P, SA6150P, SA6155P, SA8145P, SA8150P, SA8155P, SA8195P, SA8255P, SA8295P, SD888, SDX55, SG8275P, SM7315, SM7325P, Snapdragon 4 Gen 1 Mobile Platform, Snapdragon 480 5G Mobile Platform, Snapdragon 480+ 5G Mobile Platform (SM4350-AC), Snapdragon 680 4G Mobile Platform, Snapdragon 685 4G Mobile Platform (SM6225-AD), Snapdragon 695 5G Mobile Platform, Snapdragon 778G 5G Mobile Platform, Snapdragon 778G+ 5G Mobile Platform (SM7325-AE), Snapdragon 780G 5G Mobile Platform, Snapdragon 782G Mobile Platform (SM7325-AF), Snapdragon 7c+ Gen 3 Compute, Snapdragon 8 Gen 1 Mobile Platform, Snapdragon 888 5G Mobile Platform, Snapdragon 888+ 5G Mobile Platform (SM8350-AC), Snapdragon Auto 5G Modem-RF, Snapdragon W5+ Gen 1 Wearable Platform, Snapdragon X12 LTE Modem, Snapdragon X65 5G Modem-RF System, SW5100, SW5100P, WCD9335, WCD9341, WCD9360, WCD9370, WCD9375, WCD9380, WCD9385, WCD9390, WCD9395, WCN3660B, WCN3680B, WCN3950, WCN3980, WCN3988, WCN6740, WSA8810, WSA8815, WSA8830, WSA8835, WSA8840, WSA8845, WSA8845H