CVE-2023-33087 (published 2023-12-05T03:04:20.279Z)
Memory corruption in Core while processing RX intent request.
Affected products: Vendor: Qualcomm, Inc.
Product: Snapdragon
Versions: AR8035, CSRA6620, CSRA6640, FastConnect 6200, FastConnect 6700, FastConnect 6900, FastConnect 7800, Flight RB5 5G Platform, QAM8255P, QAM8295P, QAM8650P, QAM8775P, QCA6391, QCA6574, QCA6574A, QCA6574AU, QCA6584AU, QCA6595, QCA6595AU, QCA6696, QCA6698AQ, QCA6797AQ, QCA8081, QCA8337, QCC710, QCM4325, QCM4490, QCM5430, QCM6490, QCM8550, QCN6224, QCN6274, QCN9011, QCN9012, QCS410, QCS4490, QCS5430, QCS610, QCS6490, QCS7230, QCS8250, QCS8550, QDU1000, QDU1010, QDU1110, QDU1210, QDX1010, QDX1011, QFW7114, QFW7124, QRB5165M, QRB5165N, QRU1032, QRU1052, QRU1062, Qualcomm Video Collaboration VC1 Platform, Qualcomm Video Collaboration VC3 Platform, Qualcomm Video Collaboration VC5 Platform, Robotics RB5 Platform, SA4150P, SA4155P, SA6145P, SA6150P, SA6155P, SA8145P, SA8150P, SA8155P, SA8195P, SA8255P, SA8295P, SA8770P, SA8775P, SA9000P, SD 8 Gen1 5G, SG4150P, SG8275P, SM8550P, Smart Audio 400 Platform, Snapdragon 4 Gen 2 Mobile Platform, Snapdragon 680 4G Mobile Platform, Snapdragon 685 4G Mobile Platform (SM6225-AD), Snapdragon 8 Gen 1 Mobile Platform, Snapdragon 8 Gen 2 Mobile Platform, Snapdragon 8+ Gen 1 Mobile Platform, Snapdragon 8+ Gen 2 Mobile Platform, Snapdragon AR2 Gen 1 Platform, Snapdragon Auto 5G Modem-RF, Snapdragon Auto 5G Modem-RF Gen 2, Snapdragon W5+ Gen 1 Wearable Platform, Snapdragon X75 5G Modem-RF System, SSG2115P, SSG2125P, SW5100, SW5100P, SXR1230P, SXR2230P, WCD9335, WCD9340, WCD9341, WCD9370, WCD9375, WCD9380, WCD9385, WCD9390, WCD9395, WCN3950, WCN3980, WCN3988, WSA8810, WSA8815, WSA8830, WSA8832, WSA8835, WSA8840, WSA8845, WSA8845H