CVE-2023-21624 (published 2023-07-04T04:46:28.239Z)
Information disclosure in DSP Services while loading dynamic module.
Affected products: Vendor: Qualcomm, Inc.
Product: Snapdragon
Versions: FastConnect 6700, FastConnect 6800, FastConnect 6900, QAM8255P, QCA6310, QCA6320, QCA6391, QCA6426, QCA6436, QCA6574, QCA6574A, QCA6574AU, QCA6595AU, QCA6696, QCA6698AQ, QCA6797AQ, QCS8155, SA6145P, SA6150P, SA6155, SA6155P, SA8145P, SA8150P, SA8155, SA8155P, SA8195P, SA8255P, SD835, SD865 5G, SD888, SM7315, SM7325P, Snapdragon 778G 5G Mobile Platform, Snapdragon 778G+ 5G Mobile Platform (SM7325-AE), Snapdragon 780G 5G Mobile Platform, Snapdragon 782G Mobile Platform (SM7325-AF), Snapdragon 7c+ Gen 3 Compute, Snapdragon 835 Mobile PC Platform, Snapdragon 865 5G Mobile Platform, Snapdragon 865+ 5G Mobile Platform (SM8250-AB), Snapdragon 870 5G Mobile Platform (SM8250-AC), Snapdragon 888 5G Mobile Platform, Snapdragon 888+ 5G Mobile Platform (SM8350-AC), Snapdragon W5+ Gen 1 Wearable Platform, Snapdragon Wear 4100+ Platform, Snapdragon X55 5G Modem-RF System, Snapdragon XR2 5G Platform, SW5100, SW5100P, SXR2130, WCD9335, WCD9340, WCD9341, WCD9370, WCD9375, WCD9380, WCD9385, WCN3610, WCN3660B, WCN3680B, WCN3980, WCN3990, WCN6740, WSA8810, WSA8815, WSA8830, WSA8835