CVE-2023-24855 (published 2023-10-03T05:00:34.243Z)
Memory corruption in Modem while processing security related configuration before AS Security Exchange.
Affected products: Vendor: Qualcomm, Inc.
Product: Snapdragon
Versions: AR8035, FastConnect 6200, FastConnect 6700, FastConnect 6900, FastConnect 7800, QCA6391, QCA8081, QCA8337, QCC710, QCM4490, QCM6490, QCM8550, QCN6024, QCN6224, QCN6274, QCN9024, QCS4490, QCS6490, QCS8550, QFW7114, QFW7124, Qualcomm Video Collaboration VC3 Platform, SDX57M, SG8275P, SM7325P, SM8550P, Snapdragon 4 Gen 1 Mobile Platform, Snapdragon 4 Gen 2 Mobile Platform, Snapdragon 480 5G Mobile Platform, Snapdragon 480+ 5G Mobile Platform (SM4350-AC), Snapdragon 695 5G Mobile Platform, Snapdragon 778G 5G Mobile Platform, Snapdragon 778G+ 5G Mobile Platform (SM7325-AE), Snapdragon 780G 5G Mobile Platform, Snapdragon 782G Mobile Platform (SM7325-AF), Snapdragon 7c+ Gen 3 Compute, Snapdragon 8 Gen 1 Mobile Platform, Snapdragon 8 Gen 2 Mobile Platform, Snapdragon 8+ Gen 1 Mobile Platform, Snapdragon 8+ Gen 2 Mobile Platform, Snapdragon 888 5G Mobile Platform, Snapdragon 888+ 5G Mobile Platform (SM8350-AC), Snapdragon X65 5G Modem-RF System, Snapdragon X70 Modem-RF System, Snapdragon X75 5G Modem-RF System, WCD9340, WCD9370, WCD9375, WCD9380, WCD9385, WCD9390, WCD9395, WCN3950, WCN3988, WCN6740, WSA8810, WSA8815, WSA8830, WSA8832, WSA8835, WSA8840, WSA8845, WSA8845H