CVE-2023-21639 (published 2023-07-04T04:46:35.233Z)
Memory corruption in Audio while processing sva_model_serializer using memory size passed by HIDL client.
Affected products: Vendor: Qualcomm, Inc.
Product: Snapdragon
Versions: AQT1000, FastConnect 6200, QCA6420, QCA6430, SA4150P, SA4155P, SA6155P, SA8155P, SA8195P, SD855, Snapdragon 855 Mobile Platform, Snapdragon 855+/860 Mobile Platform (SM8150-AC), Snapdragon W5+ Gen 1 Wearable Platform, SW5100, SW5100P, WCD9341, WCN3980, WCN3988, WSA8810, WSA8815, WSA8830, WSA8835