CVE-2023-24853 (published 2023-10-03T05:00:33.133Z)
Memory Corruption in HLOS while registering for key provisioning notify.
Affected products: Vendor: Qualcomm, Inc.
Product: Snapdragon
Versions: AR8035, FastConnect 6200, FastConnect 6700, FastConnect 6800, FastConnect 6900, FastConnect 7800, FSM10056, QAM8255P, QAM8295P, QAM8650P, QAM8775P, QAMSRV1H, QCA6391, QCA6421, QCA6426, QCA6431, QCA6436, QCA6564, QCA6564A, QCA6564AU, QCA6574, QCA6574A, QCA6574AU, QCA6595, QCA6595AU, QCA6696, QCA6698AQ, QCA6797AQ, QCA8081, QCA8337, QCC710, QCM4490, QCM8550, QCN6224, QCN6274, QCS4490, QCS8155, QCS8550, QDU1000, QDU1010, QDU1110, QDU1210, QDX1010, QDX1011, QFW7114, QFW7124, QRU1032, QRU1052, QRU1062, QSM8350, SA4150P, SA4155P, SA6145P, SA6150P, SA6155, SA6155P, SA8145P, SA8150P, SA8155, SA8155P, SA8195P, SA8255P, SA8295P, SA8540P, SA8650P, SA9000P, SD 8 Gen1 5G, SD865 5G, SG8275P, SM7250P, SM8550P, Snapdragon 4 Gen 2 Mobile Platform, Snapdragon 765 5G Mobile Platform (SM7250-AA), Snapdragon 765G 5G Mobile Platform (SM7250-AB), Snapdragon 768G 5G Mobile Platform (SM7250-AC), Snapdragon 8 Gen 1 Mobile Platform, Snapdragon 8 Gen 2 Mobile Platform, Snapdragon 8+ Gen 1 Mobile Platform, Snapdragon 8+ Gen 2 Mobile Platform, Snapdragon 865 5G Mobile Platform, Snapdragon 865+ 5G Mobile Platform (SM8250-AB), Snapdragon 870 5G Mobile Platform (SM8250-AC), Snapdragon 888 5G Mobile Platform, Snapdragon 888+ 5G Mobile Platform (SM8350-AC), Snapdragon 8cx Gen 3 Compute Platform (SC8280XP-AB, BB), Snapdragon AR2 Gen 1 Platform, Snapdragon X55 5G Modem-RF System, Snapdragon X65 5G Modem-RF System, Snapdragon X75 5G Modem-RF System, Snapdragon XR2 5G Platform, SRV1H, SSG2115P, SSG2125P, SXR1230P, SXR2130, SXR2230P, WCD9340, WCD9370, WCD9380, WCD9385, WCD9390, WCD9395, WCN3950, WCN3988, WSA8810, WSA8815, WSA8830, WSA8832, WSA8835, WSA8840, WSA8845, WSA8845H