CVE-2023-21672 (published 2023-07-04T04:46:37.961Z)
Memory corruption in Audio while running concurrent tunnel playback or during concurrent audio tunnel recording sessions.
Affected products: Vendor: Qualcomm, Inc.
Product: Snapdragon
Versions: FastConnect 6700, FastConnect 6900, FastConnect 7800, QAM8255P, QAM8295P, QAM8650P, QAM8775P, QCA6574, QCA6574A, QCA6574AU, QCA6595, QCA6595AU, QCA6696, QCA6698AQ, QCA6797AQ, QCM4325, SA4150P, SA4155P, SA6145P, SA6150P, SA6155P, SA8145P, SA8150P, SA8155P, SA8195P, SA8255P, SA8295P, SD 8 Gen1 5G, SD865 5G, SG4150P, Snapdragon 4 Gen 2 Mobile Platform, Snapdragon 680 4G Mobile Platform, Snapdragon 685 4G Mobile Platform (SM6225-AD), Snapdragon 8 Gen 1 Mobile Platform, Snapdragon 8+ Gen 1 Mobile Platform, Snapdragon AR2 Gen 1 Platform, Snapdragon W5+ Gen 1 Wearable Platform, Snapdragon XR2 5G Platform, SSG2115P, SSG2125P, SW5100, SW5100P, SXR1230P, SXR2230P, WCD9370, WCD9375, WCD9380, WCD9385, WCN3950, WCN3980, WCN3988, WCN6740, WSA8810, WSA8815, WSA8830, WSA8832, WSA8835