Washington Administrative Code › Title 296 - Labor and Industries, Department of › Chapter 296-850 - BERYLLIUM › Section 296-850-180 - Appendix A-Operations for establishing beryllium work areas

Current through Register Vol. 24-14, July 15, 2024
This standard defines a beryllium work area as any work area
				where materials that contain at least 0.1 percent beryllium by weight are
				processed (1) during any of the operations listed in Appendix A of this
				standard, or (2) where employees are, or can reasonably be expected to be,
				exposed to airborne beryllium at or above the action level. Table A.1 in this
				appendix sets forth the operations that, where performed under the
				circumstances described in the column heading above the particular operations,
				trigger the requirement for a beryllium work area.
Table A.1-Operations for Establishing Beryllium Work
				Areas Where Processing Materials Containing at Least 0.1 Percent Beryllium by
				Weight
Beryllium metal alloy operations (generally [LESS
						  THAN]10% beryllium by weight)
Beryllium composite operations (generally
						  [GREATER THAN]10% beryllium by weight) and beryllium metal
						  operations
Beryllium oxide operations
Abrasive Blasting.
Abrasive Blasting.
Abrasive Blasting.
Abrasive Processing.
Abrasive Processing.
Abrasive Processing.
Abrasive Sawing.
Abrasive Sawing.
Abrasive Sawing.
Annealing.
Annealing.
Boring.
Bright Cleaning.
Atomizing.
Brazing ([GREATER THAN]1,100°C).
Brushing.
Attritioning.
Broaching with green ceramic.
Buffing.
Blanking.
Brushing.
Burnishing.
Bonding.
Buffing.
Casting.
Boring.
Centerless Grinding.
Centerless Grinding.
Breaking.
Chemical Cleaning.
Chemical Cleaning.
Bright Cleaning.
Chemical Etching.
Chemical Etching.
Broaching.
CNC Machining.
Chemical Milling.
Brushing.
Cold Isostatic Pressing (CIP).
Dross Handling.
Buffing.
Crushing.
Deburring (grinding).
Burnishing.
Cutting.
Electrical Chemical Machining (ECM).
Casting.
Deburring (grinding).
Electrical Discharge Machining (EDM).
Centerless Grinding.
Deburring (nongrinding).
Extrusion.
Chemical Cleaning.
Destructive Testing.
Forging.
Chemical Etching
Dicing.
Grinding.
Chemical Milling.
Drilling.
Heat Treating (in air).
CNC Machining
Dry/Wet Tumbling.
High Speed Machining ([GREATER THAN]10,000 rpm).
Cold Isostatic Pressing.
Extrusion.
Hot Rolling.
Cold Pilger.
Filing by Hand.
Lapping.
Crushing.
Firing of Green Ceramic.
Laser Cutting.
Cutting.
Firing of Refractory Metallization ([GREATER
						  THAN]1,100°C).
Laser Machining.
Deburring.
Grinding.
Laser Scribing.
Dicing.
Honing.
Laser Marking.
Drawing.
Hot Isostatic Pressing (HIP).
Melting.
Drilling.
Lapping.
Photo-Etching.
Dross Handling.
Laser Cutting.
Pickling.
Electrical Chemical Machining (ECM).
Laser Machining.
Point and Chamfer.
Electrical Discharge Machining (EDM).
Laser Scribing.
Polishing.
Extrusion.
Laser Marking.
Torch Cutting (i.e., oxy-acetylene).
Filing by Hand.
Machining.
Tumbling.
Forging.
Milling.
Water-Jet Cutting.
Grinding.
Piercing.
Welding.
Heading.
Mixing.
Sanding.
Heat Treating.
Plasma Spray.
Slab Milling.
Honing.
Polishing.
Hot Isostatic Pressing (HIP).
Powder Handling.
Lapping.
Powder Pressing.
Laser Cutting.
Reaming.
Laser Machining.
Sanding.
Laser Scribing.
Sectioning.
Laser Marking.
Shearing.
Machining.
Sintering of Green Ceramic.
Melting.
Sintering of Refractory Metallization ([GREATER
						  THAN]1,100°C).
Milling.
Snapping.
Mixing.
Spray Drying.
Photo-Etching.
Tape Casting.
Pickling.
Turning.
Piercing.
Water-Jet Cutting.
Pilger.
Plasma Spray.
Point and Chamfer.
Polishing.
Powder Handling.
Powder Pressing.
Pressing.
Reaming.
Roll Bonding.
Rolling.
Sanding.
Sawing (tooth blade).
Shearing.
Sizing.
Skiving.
Slitting.
Snapping.
Sputtering.
Stamping.
Spray Drying.
Tapping.
Tensile Testing.
Torch Cutting (i.e., oxy-acetylene).
Trepanning.
Tumbling
Turning.
Vapor Deposition.
Water-Jet Cutting.
Welding.