California Code of Regulations › Title 17 - Public Health › Division 3 - Air Resources › Chapter 1 - Air Resources Board › Subchapter 10 - Climate Change › Article 4 - Regulations to Achieve Greenhouse Gas Emission Reductions › Subarticle 2 - Semiconductors and Related Devices › Section 95323 - Standards

Current through Register 2024 Notice Reg. No. 28, July 12, 2024
(a) Except as
						provided in section
						95323(b), an
						owner or operator of a semiconductor operation must meet the emission standards
						in Table 1 by January 1, 2012. An operation that is replacing CVD or etching
						tools that process 150 millimeter diameter wafers with tools that process 200
						millimeter diameter or larger wafers must comply with the Table 1 emission
						standards by January 1, 2014.
The Tier 1 emission standard shall apply to an owner or
						  operator of a semiconductor operation that processes more than 37.7 million
						  square centimeters of wafer surface area per calendar year. The Tier 1 emission
						  standard shall also apply to the owner or operator of a semiconductor operation
						  that begins operation after January 1, 2010.
(1) Emissions Calculation Method
An owner or operator must express fluorinated gas
						  emissions in CO2e units. The kilograms of fluorinated
						  gas emissions are determined using the Tier 2b calculation method in the 2006
						  Intergovernmental Panel on Climate Change (IPCC) Guidelines for National
						  Greenhouse Gas Inventories, incorporated by reference herein. The IPCC 1996
						  Second Assessment Report (SAR) provides the GWP values used to calculate
						  fluorinated gas emissions, with the exception of NF3
						  which is based on the GWP value from the IPCC Fourth Assessment Report.
An owner or operator of a semiconductor operation may
						  request that the permitting agency approve the use of an alternative
						  destruction removal efficiency (DRE) value that exceeds the default DRE value
						  in the Tier 2b calculation method. An alternative DRE must be based on
						  independent third party measured results for the emission control equipment
						  used by the operation.
The kilograms of fluorinated gas emissions from CVD
						  chamber cleaning and etching are converted to million metric tons of
						  CO2 equivalent (MMT CO2e ) using
						  the following formula:
Total Fluorinated Gas Emissions in MMT
						  CO2e = [SIGMA]
						  Ei(GWP100)i/109
						  Where:
E = the kilograms of fluorinated gas emitted using the
						  Tier 2b method
i = the fluorinated gas
GWP100 = the GWP of the
						  fluorinated gas
109 = the number of
						  kilograms per million metric ton
For an operation emitting more than 0.0008 MMT
						  CO2e per calendar year, total fluorinated gas emissions
						  in MMT CO2e are converted to kilograms of
						  CO2 equivalents per square centimeter (Kg
						  CO2e/cm2) using the following
						  formula:
Emissions in Kg
						  CO2e/cm2 = (MMT
						  CO2e)(109) /
						  [SIGMA][([PHI]rn2
						  Wfn)/100]
Where:
109 = the number of
						  kilograms per million metric ton
[PHI] = 3.1416
rn = one half the diameter in
						  millimeters of a given size wafer n = diameter of a wafer in millimeters
Wfn = the number of wafers of a
						  given size processed in the calendar year
100 = the number of square millimeters per square
						  centimeter
Table 1
Emission Standards for Semiconductor Operations
						  Effective January 1, 2012
CVD Chamber Cleaning and Etching
						  Processes
Wafer Surface Area
									 Processed (Million Square Centimeters Per Calendar
									 Year)
Maximum Emissions Limit
									 Per Square Centimeter for a Calendar Year (Kg
									 CO2e/cm2)
Tier 1: >37.7
0.2
Tier 2: >3.7 and [LESS THAN EQUAL
								  TO]37.7
0.3
Tier 3: [LESS THAN EQUAL TO]3.7
0.5