California Code of Regulations › Title 17 - Public Health › Division 3 - Air Resources › Chapter 1 - Air Resources Board › Subchapter 10 - Climate Change › Article 4 - Regulations to Achieve Greenhouse Gas Emission Reductions › Subarticle 2 - Semiconductors and Related Devices › Section 95322 - Definitions

Current through Register 2024 Notice Reg. No. 28, July 12, 2024
(a) For the
						purposes of this article, the following definitions apply:
(1) "Alternative Chemistries" means the
						substitution of a fluorinated gas in the chamber cleaning or etching process to
						increase utilization efficiency and reduce the carbon dioxide equivalent
						emissions.
(2) "Calendar Year"
						means the time period from January 1 through December 31.
(3) "Carbon Dioxide Equivalent" or
						"CO2e" means a measure for comparing carbon dioxide with
						other greenhouse gases, based on the quantity of those gases multiplied by the
						appropriate global warming potential (GWP) factor.
(4) "CO2e Emissions
						Limit" means the maximum allowable kilograms of CO2e
						emissions per square centimeter of wafers processed in a calendar
						year.
(5) "Chamber Cleaning" means
						the process of using fluorinated gases to remove excess materials from chemical
						vapor deposition chamber walls to prevent contamination of wafers to be
						processed.
(6) "Chemical Vapor
						Deposition (CVD)" means deposition of thin films on wafers by placing the
						wafers in a mixture of gases, including nitrogen or another gas used as a
						carrier, which react at the surface of the wafers.
(7) "Equipment" means any article, machine,
						or other contrivance, or combination thereof, which may cause the issuance or
						control the issuance of fluorinated gas emissions in etching or CVD chamber
						cleaning processes.
(8) "Etching"
						means a chemical reactive process for selectively removing material on a wafer
						using fluorinated, ionized gases.
(9) "Fluorinated Gases" means a compound that
						contains fluorine and exists in a gaseous state at 25 degrees Celsius and 1
						atmosphere of pressure. Fluorinated gases include, but are not limited to:
(A) hexafluoroethane
						(C2F6),
(B) octafluoropropane
						(C3F8),
(C) octafluorocyclopentene
						(C5F8),
(D) tetrafluoromethane
						(CF4),
(E)
						trifluoromethane (CHF3),
(F) difluoromethane
						(CH2F2),
(G) octafluorocyclobutane
						(c-C4F8),
(H) octafluorotetrahydrofuran
						(C4F8O),
(I) hexafluoro-1,3-butadiene
						(C4F6),
(J) carbon fluoride oxide
						(COF2),
(K)
						nitrogen trifluoride (NF3), and
(L) sulfur hexafluoride
						(SF6).
(10) "Global Warming Potential (GWP)" means
						the radiative forcing impact of one mass-based unit of a given greenhouse gas
						relative to an equivalent unit of carbon dioxide over a given period of
						time.
(11) "Global Warming
						Potential Value" or "GWP Value" means the global warming potential value of a
						chemical or compound as specified in the IPCC: 1996 Second Assessment Report
						(SAR), Table 2.14, in Climate Change 2007: The Physical Sciences Basis,
						Contribution of Working Group I to the Fourth Assessment Report of the
						Intergovernmental Panel on Climate Change, which is incorporated by reference
						herein.
If Table 2.14 does not contain a SAR 100-year GWP Value
						  for a specific chemical or compound, then the 100-year GWP Value in Table 2.14
						  for that chemical or compound must be used.
(12) "Heat Transfer Fluid" means a
						fluorinated fluid which prevents a device, such as a semiconductor, from
						overheating by removing excess heat produced during a manufacturing
						process.
(13) "Permitting Agency"
						means any air pollution control district or air quality management
						district.
(14) "Process
						Optimization" means the practice of using end-point detectors and/or process
						parameter variation to achieve optimum gas usage to reduce excess fluorinated
						gas emissions.
(15) "Semiconductor
						Operation" means an operation performed to process semiconductor devices or
						related solid state devices. It may include, but is not limited to, the
						processing of diodes, zeners, stacks, rectifiers, integrated microcircuits,
						transistors, solar cells, light-sensing devices, and light-emitting
						devices.
(16) "Wafer" means a thin,
						usually round, slice of a material from which integrated circuits, or chips,
						are made.
(17) "Wafer Surface Area"
						means the entire surface area of one side of a wafer, or multiple wafers, and
						includes wafers that do not pass owner or operator
						inspection.