Intel BXSTS100C Thermal Solution LGA1366 for 2-Socket Servers/Workstations - Combo Intel combo boxed thermal solution for 2-socket servers/workstations. Maximum CPU TDP: 130W. Combination heat sink with removable fan. For LGA1366, Nehalem Xeons. Design that delivers high availability, scalability, and for maximum flexibility and price/performance Made in United States Pedestal chassis with ducted airflow to heat sink 2U or larger rack chassis with ducted airflow to heat sink Fan & Heatsinks