PsmGoods Solderless BreadBoard BB830,4 Power lanes,830 tie-points,16.5 x 5.5 x 0.9cm (1PCS) 830 tie points total: 630 tie-point IC-circuit area plus two 100 tie-point distribution strips providing 4 power rails Insertion Wire Size is 21 to 26 AWG, 0.016 to 0.028 inches diameter (0.4 to 0.7mm diameter) BB830 has a 630 tie-point IC-circuit area plus four 50 tie-point power rails BB830 is made of white ABS plastic, with a printed legend giving numbers and letters for columns and rows Size: 6.5 x 2.2 x 0.3in (16.5 x 5.5 x 0.9cm),