Cooler Master TPC 812 - Overclocking CPU Cooler with Dual Cooling Technology - 2 Vapor Chambers and 6 Heatpipes The TPC 812 uses 2 separate cooling technologies to transfer heat - heatpipes and vertical vapor chambers Ready for overclocking, benchmarking and silent cooling The first ever CPU heatsink to use vertical vapor chamber technology 100% pure polished copper base - combined with improved soldering technologies for the best thermal transfer Special fin design - heatsink receives concentrated cold airflow Compatible CPU Sockets - Intel: LGA 2011/1366/1156/1155/775 and AMD: FM1/FM2/AM3+/AM3/AM2+/AM2 Improved air pressure design and fan mounting system