(5g) Thermal Conductive Heatsink Plaster Viscous Adhesive Compound Glue For PC GPU IC Thermal properties, strong adhesion. Melting capacity: 0 (200degree celsius/ 24Hours) Evaporation: 0.001% (200 degree celsius/ 24Hours) Thermal conductivity: &gt; 1.2W/m-K Thermal Impedance:&gt; 0.06