EGC High-Performance Thermal Paste Compound for CPU Heatsinks - 4 Grams High-performance thermal compound maximizes thermal conductivity Easy to apply with the included application-stick Thermal conductivity: &gt; 5.15 W/mk Perfect for enthusiasts and system-builders looking looking for optimal cooling 45% Matal Oxide Compounds / 45% Carbon Compounds / 10% Silicone Compounds