CS-FLUX reballing Low viscosity liquid flux for BGA component rework reflow 15g . Ideal for VGA GPU repairs CS-FLUX when heated at around 150 degrees (Celsius) turns into liquid and covers the small gap between the BGA component and the PCB complitelly. This way all solder balls are covered with CS-FLUX and durring reflow or removal of the BGA componets all PCB and componet pads and balls are protected. CS-FLUX is no clean flux but if needed it can be cleaned very easily with alcohol. It causes no corossion on the PCB or components. Thank's to it's liquid nature, a very small amount of CS-FLUX is needed for each repair resulting in a much cleaner work enviroment.CS-FLUX is also Lead Free CS-FLUX is very sticky and specially designed to keep the solder balls inside the stencil durring the reballing proccess. It is also ideal for reflow of BGA components (with heatgun) when needed equipment for reballing is not avaliable. CS-FLUX is produced in EU (Greece) and will be shipped to your workshop very fast.