Input: Article: Capacitors may catastrophically fail when subjected to voltages or currents beyond their rating, or as they reach their normal end of life. Dielectric or metal interconnection failures may create arcing that vaporizes the dielectric fluid, resulting in case bulging, rupture, or even an explosion. Capacitors used in RF or sustained high-current applications can overheat, especially in the center of the capacitor rolls. Capacitors used within high-energy capacitor banks can violently explode when a short in one capacitor causes sudden dumping of energy stored in the rest of the bank into the failing unit. High voltage vacuum capacitors can generate soft X-rays even during normal operation. Proper containment, fusing, and preventive maintenance can help to minimize these hazards.

Now answer this question: What can happen to capacitors used in high current applications?

Output: overheat

Input: Article: Zhejiang is mountainous and has therefore fostered the development of many distinct local cultures. Linguistically speaking, Zhejiang is extremely diverse. Most inhabitants of Zhejiang speak Wu, but the Wu dialects are very diverse, especially in the south, where one valley may speak a dialect completely unintelligible to the next valley a few kilometers away. Other varieties of Chinese are spoken as well, mostly along the borders; Mandarin and Huizhou dialects are spoken on the border with Anhui, while Min dialects are spoken on the border with Fujian. (See Hangzhou dialect, Shaoxing dialect, Ningbo dialect, Wenzhou dialect, Taizhou dialect, Jinhua dialect, and Quzhou dialect for more information).

Now answer this question: Mandarin and Huizhou dialects are spoken on the border where?

Output: with Anhui

Input: Article: USB 2.0 High-Speed Inter-Chip (HSIC) is a chip-to-chip variant of USB 2.0 that eliminates the conventional analog transceivers found in normal USB. It was adopted as a standard by the USB Implementers Forum in 2007. The HSIC physical layer uses about 50% less power and 75% less board area compared to traditional USB 2.0. HSIC uses two signals at 1.2 V and has a throughput of 480 Mbit/s. Maximum PCB trace length for HSIC is 10 cm. It does not have low enough latency to support RAM memory sharing between two chips.

Now answer this question: What does USB 2.0 High-Speed Inter-Chip eliminate?

Output:
the conventional analog transceivers found in normal USB