For the given job description <<#Dynamics365 #ERP # Dynamics365ERP #SupplyChain
Company: Enterprise Level ClientJob Title: Software Engineering Supervisor (Lead Dynamics 365 Developer - ERP) - W2Duration: Full-TimeLocation: Issaquah, WA - Hybrid - 3 days onsite - OPEN to seeing out of state candidates.Salary: 120-150k + bonus up to 10% of salaryAdditional Benefits: PTO, 7 paid holidays, 1 paid family day off.Comprehensive medical, dental, and vision benefits401k plan and matches $1 for $1 up to 4% of earnings, matched & vested at every pay cycleLife insuranceShortlong-term disability coveragePaid maternitypaternity leavePet insurance



What's the Short Version?The Supervisor, Software Developer is responsible for overseeing the technical design, development, and deployment of D365 solutions. They utilize a deep technical knowledge of the Dynamics 365 platform, while leading a team of developers. They constantly look to improve the solutions and processes within SanMar ensuring consistency, continuity, and scalability. The role is also responsible for ideating, designing, documenting, and assisting with the implementation of technologies that meet the current and future needs of our business.




What Will You Be Doing?Oversee the technical aspects of D365 projects, including the design of custom entities, workflows, and integrations.Lead a team of developers and engineers, provide guidance and support as they work to build and deploy D365 solutions; responsible for assigning tasks, monitoring progress, and providing feedback.Ensure that all D365 solutions meet the highest quality standards, including proper testing and debugging.May conduct code reviews to ensure that development meetings quality standards and best practices.Communicate effectively with stakeholders to ensure that projects are delivered on time and to the satisfaction of all parties involved.Maintain a deep understanding of D365 and the broader Dynamics platform and stay up to date with new developments and trends in the industry.Work closely with other teams within the organization, including project managers, business analysts, and quality assurance specialists.




What Are We Looking For?4-6 years experience working with the Dynamics 365 platformExperience leading teams of developers and software engineersHave an understanding of Supply Chain business processes, able to partner with stakeholders to understand ERP system and business architecture.Familiarity in code languages: X++, C++, SQL, ADOExperience in information technology, computer science, software engineering, or related fieldExperience with all phases of the software development lifecycle, including SCRUM and AgileDeep understanding of Azure and DynamicsStrong communication skills, written and verbal, allowing you to build rapport with people at all levels of responsibility and articulate solutions to technical and non-technical peopleAbility to work on concurrent projects, meet business expectations, influence outcomes, and meet timelinesA curious mind, strong critical thinking skills, and a continuous drive to expand and learn for the futureExcellent technical, communication, and leadership skills, and be comfortable working in a fast-paced and dynamic environment.A bias for action with the ability to adapt quickly, with a positive attitude toward changeDemonstrated long-term, strategic thinking with the ability to recognize and help others understand what must be done now and what can be improved later>> the resume: <<Summary*11 years analog/digital circuit design experience*11 years embedded firmware programming  experience*Solid background in RF and electromagnetic, Expert in EMI/EMC
HighlightsEmbedded System Program  - Texas Instruments ARM, MSP430, C2000 MCU and C6000 DSP.Real Time Operating System - FreeRTOS, SafeRTOS, SYSBIOS, VxWorksProgram Language - Embedded C/C++, Assembly, MatLab, Labview and VHDLCommunication Protocol Driver -  SPI, UART, I2C, CAN, McASP and EthernetMotor Control - FOC Sensored and Sensorless Control, PMSM and BLDC MotorsPCB Schematic and Layout - Pads, OrCad, Cadence, AltiumCircuit Simulation Tools - Allegro PCB SI, HSPICE and HyperLynxADC Characterization/Debugging - INL/DNL/SNR/ENOB/Offset/Gain/Absolute ErrorEMI/EMC/ESD Compliance standard/Characterization/TroubleshootingPCB/Package Numerical Modeling Tools - Ansoft HFSS, EZ-FDTD, Apache PakSi-E, and FLO/EMCRF Instruments - Oscilloscope, Spectrum Analyzer, Network Analyzer, TDR, LCR MeterEnvironmental Chamber - Temperature Chamber, Thermal Steam, Semi-Anechoic Chamber
Experience04/2014toPresentElectrical EngineerAmentum–Jbphh,HI,Design, develop and verify data acquisition and sensor interface circuits, primarily for the high temperature environment in downhole Oil & Gas wells, from concept development all the way through manufacturing release.Design/Simulated (in Spice) a 600Watt precision current amplifier.Design a downhole LOGIQ to DITS (Digital Interface Telemetry System) Adapter Sub.Experience includes Propose the electronics block diagram and signal flow.Draw the wiring diagram.Design (in Pads)/Simulate (in Spice) the isolated 200VDC to 120VAC current fed resonant inverter.Implement the communication and control firmware using C for MSP430 MCU.Develop a Seismic While Drilling tool.Experience includes Concept development such as the top level functional signal flow and block diagram.Design the Hardware (Power Supply, Clock Electronic and Processor/ADC boards using Pads.Analyze the analog front end signal to noise ratio and dynamic range for Hydrophone and Geophone.Design the Pre-Amplifier circuit, select the ADC.Select the key components such as the FPGA, DSP, and MCU, perform the power analysis and VREG simulation, design the circuit in Pads.Implement a decimation digital filter (one stage in FPGA and the other two stages in TMS320C6745 DSP) to improve the S/N ratio and dynamic range.Design the Test System for the Next Generation Sonic Tool.Experience includes Design the hardware (Schematic, Layout and BOM), draw the wiring diagram using Pads.Develop the firmware using C/C++ for TMS320C6745 DSP and MSP430 MCU.Emulate McASP, SPI, UART and a customized LVDS communication using FPGA.Build a standard 3U, two 1.25U 19-inch rack mount test boxes using Front Panel Express.Phase 0 and 1 study of a 500KHz/2MHz induction resistivity tool.Experience includes block diagram, component selection and preliminary schematic/placement in Pads.Phase 0 and 1 study of a Fluid identification tool (density, mud resistivity and capacitance), experience includes circuit design, analog circuit simulation (in Spice) and FPGA programming (SPI, ADC interface).Phase 0 and 1 study of a 75V BLDC sensorless motor control.06/2006to03/2014Application EngineerTiaa–San Antonio,TX,In charge of Hercules MCU Motorware and PMIC driver library, build motor related reference design and demos, solve customer EMC/EMI problems, deeply involved in on-chip ADC characterization and improvement, served as the device owner of TMS470M series and TMS570LS2x MCUs, and worked as a core member to complete the 1st safety certification (IEC61508 SIL3) of TMS570LS2x MCU.Hercules is a 32-bit ARM based microcontroller used in safety applications such as ABS, airbag, chassis control, and EPS.Hercules BLDC/PMSM motor control.Experience includes Design the hardware (Schematic, Layout and BOM) using Cadence.Implement the floating point/fixed point Motorware using C/C++ for ARM CortexR4TM MCU.Implement the 2 phase interleaved PFC using C/assembly for ARM CortexR4TM MCU.Hand-assemble critical fixed point math function in IQmath library.Develop the Power Management IC (TPS65381) drivers using C/C++ with CCS IDE and RTOS.Characterize and analyze the 12bit on-chip ADC.Verify the ADC wrapper logic using FPGA and the 12bit ADC test chip.Build the system with Embedded C and Labview to characterize the MCU 12bit ADC INL/DNL/SNR/ENOB, write guideline to achieve the best performance.Deal with the ADC performance in noisy environment (e.g.during radiated immunity test).Expert in EMI/EMC/ESD area.Experience includes In charge of IC level Electromagnetic Interface (EMI) design improvement.Build/validate the IC level EMC simulation models in SPICE for Hercules MCU.Responsible for EMI/EMC/ESD related compliance testing.Design EMI test boards using Orcad, write Embedded C test software, and Matlab, labview GUI to acquire data.Design the high voltage motor drive for the SPS-IPC show using C2000 DSP and ARM MCU, experience include PCB design using Altium, Embedded C programming and RTOS.Develop an EPS (Electric power steering) reference design with C2000 DSP and ARM MCU, experience include PCB design, Embedded C programming, resolver sensored PMSM Motor drive, digit filter design, Matlab Simulink simulation and PID Control.Develop development kits (e.g.launchpad, USB stick), experience include PCB design and Embedded C programming.Technical Support for ARM7, CortexM3, CortexR4 series MCUs.In charge of production cycle of TMS470M(ARM CortexM3TM) and TMS570LS2x ARM CortexR4TM ICs.Experience includes Write requirements and the specification, Datasheet, TRM, Application Reports.Develop silicon validation test case/ peripheral driver (SPI, UART, I2C and CAN) in C/C++.Design and develop soft error rate (SER) system to test hard radiation effect on IC.Experience includes PCB design, Embedded C programming, Matlab to acquire and analyze data.08/2002to06/2006Research AssistantProvidence Health & Services–Mill Creek,WA,Develop/integrate the impressed magnetic/Electric current sources into EZ-FTDT software using visual C++.Develop a procedure to calibrate/simulate near-filed probe/antenna, estimate high frequency current from the near-field measurements, and predict far-field from near-field measurement;.Develop vehicle EMC expert system, General Motors Corporation.07/2000to07/2002Electrical EngineerAmentum–Johnston,,ChinaDesign hardware (schematic and layout) of routers and switches with Freescale MPC;.Develop network device drivers with Vxworks (Embedded C).
EducationExpected in06/2006totoPh.D.:Electrical EngineeringUniversity of Missouri-Rolla,MOGPA:Electrical EngineeringExpected in07/2000totoM.S:Electrical EngineeringTsinghua University-Beijing,GPA:Electrical EngineeringExpected in07/1998totoB.S:Electrical EngineeringTsinghua University-Beijing,GPA:Electrical Engineering
SkillsDigital/Analog Circuit Design, SPICE simulation, HFSS, Firmware development C/ C++,  Labview, RTOS, EMI/EMC/ESD, FPGA VHDL>>. The result is, No Fit

Fit assessment: No Fit