Working With Jobs & Internships Contact, Directions, Travel Customer Info Vision, Mission, Quality About (651) 789-9000 Contact Us PRODUCTS SERVICES FACILITIES PARTNERS COMMUNITY OUTREACH Quick Links 3D Devices Apertures FC150 SiC Vacuum Chucks MEMS Devices Semiconductor Tooling Thin Film Deposition Ultra Machining Fab Wafer Back End Wafer Chucks X-ray Windows SEMICONDUCTORS Wafer Back End, Bare Die, Back Grinding, Metallization 3D Chip Stacking, Indium Bumping and Packaging Focal Plane Arrays, Laser Die Attach Thermal Management R&D and Manufacturing Services from Semiconductors to Scientific Instruments to Medical Devices Contract Manufacturing for High Mix, Low Volume High Precision Critical Components and Systems Engineering • Contract Engineering Solutions • Project Management • Modeling Software: Magnetics, Electrostatics, Heat Transfer and Convection • Prototype development • Final Product development • SBIR/STTR: DoD, NASA, NIST, NIH & DOE Micro-Nano Fab • Thin Film Process Development • Design & Manufacturing of chip scale devices e.g. MEMS • Wafer front end to back end services • Hybridization services Ultra Machining Fab • Ultra-high precision machining services • Tight tolerances • Hard steels, ceramics, glasses, and plastics • Exotic materials • Low to moderate volume Analytical Lab • SEM, EDS, FIB, XRF, AFM, MFM, TEM • Tropel Flatmaster Science and Engineering Physics Modeling, CAD Design, Finite Element Analysis, SBIR Partnering, STTR Partnering, Government Contracting, Sub-Contracting for Mil/Aero Primes Wafer Fab Products and Services Wafer Scale Fabrication: MEMs, Sensors, Devices Thin Film Deposition: Sputtering, Evaporation, CVD, ALD, Plating Patterning: Mask Design, GDS2 Format, Suss Front Side Back Side Mask Aligner, Canon Stepper, Heidelberg Direct Write Etching: Wet Etch, Ion Milling, RIE, DRIE, Ion Milling Wafer to Package Back End: BEOL, Chip Stacking; 2.5D, 3D Devices, Flip Chip, Laser Die Attach to Heat Sink, Photonic and Opto-Electronic Devices Wafer Back End Bare Die: Wafer Thinning, Dicing, Pick Out to Tape or Chip Tray Ultra High Precision Machining Services CNC 3 Axis and 5 Axis Milling, Wire EDM, Micro EDM, Grinding, Lapping, CMP Typical materials include Hard Steels, Ceramics, Titanium, Molybdenum, Tungsten, Tantalum, and More Analytical Services SEM, EDS, XRF, FIB, AFM, MFM, TEM Contact ARC Sales sales at arcnano com FIB Aperture Strips www.arcapertures.com 4459 White Bear Parkway White Bear Lake, MN 55110 Copyright 2017 ARC.