Contact Us News Blog Join MyCML Login Search for: Products Applications Technologies About Us How To Buy Restriction of Hazardous Substances (RoHS) Compliance Download: RoHS Compliance Ordering of Lead-free IC Products CML is committed to providing RoHS compliant IC products suitable for its customers’ requirements. When placing orders, please ask specifically for RoHS compliant products if you require a full Pb-free compatible processing capability. CML’s Lead Free Production Policy CML is committed to providing Pb-free products suitable for its customers’ requirements. In line with the requirements of the Waste Electrical and Electronic Equipment (WEEE) and Restriction of Hazardous Substances (RoHS) directives, and its commitment to obtaining ISO14001, CML announces that, as from January 1st 2005 it will not guarantee that parts use Pb in the lead-plating finish. Current Pb-inclusive lead plating will be phased-out and replaced mainly by a pure Matte Sn finish*. This decision relates purely to the removal of Pb from lead finish. Pure Matte Sn has been chosen by CML due to its history of reliable performance in Sn-Pb lead soldering processes and its compatibility with Pb-free soldering. CML has carried out extensive research to determine that our Pb-free devices perform at standard Sn-Pb reflow temperatures. CML has an on-going testing programme to evaluate its product range at the higher reflow soldering temperatures associated with full Pb-free assembly. Download: Lead Free Policy RoHS and Pb-free FAQs Ordering of Lead-free IC Products CML is committed to providing RoHS compliant IC products suitable for its customers’ requirements. When placing orders, please ask specifically for RoHS compliant products if you require a full Pb-free compatible processing capability. This will continue to apply after July 1st 2006. Q. I have just received devices in a Moisture Barrier Bag (MBB) and note that there is air trapped within the sealed container; do I need to be concerned about this? A. To reduce the risk of device damage the CML packaging procedure is not to fully evacuate the air from the MBB before sealing. This process does not affect the MBB’s resistance to moisture ingress. CML’s procedure is based on the JEDEC recommendation, J-STD-033C section 3.3.5.3 Q. Why is CML transitioning to RoHS (Pb-free) components and assemblies? A. CML has introduced a RoHS Compliant, Lead-free (Pb-free) Program in response to legislation calling for companies to utilise Pb-free manufacturing processes and components. Also, many of our customers are requesting products that utilize Pb-free manufacturing processes and components. Q. What legislation or directives have been established by the various regulatory groups? A. In December 2002, the European Union Parliament approved the content of two directives to better control the management of waste electronic equipment. The two directives are the Waste from Electrical and Electronic Equipment (WEEE) and the Reduction of Hazardous substances (RoHS). The WEEE addresses the collection and treatment requirements of waste electronic equipment for the member countries. The RoHS sets phase-out dates for the use of Pb and several other materials contained in electronic products. The RoHS requires that on July 1, 2006, the targeted materials shall no longer be contained in the electronic products above certain limits unless there is an exemption provided in the rule. Q. Is CML working in conjunction with the electronics industry to reduce the use of Pb? A. CML is working together with several industry consortia and forums to offer RoHS compliant (Pb-free) product alternatives. CML is working with its suppliers and customers to offer RoHS Compliant (Pb-free) products. Q. What are the various world standards and organisations that address the Pb-free issue? A. There are many standards and organisations that address the Pb-free issue. Here are some of the key organisations: o ANSI – The American National Standards Institute o EIA – Electronic Industries Association (http://www.eia.org/ and http://www.jedec.org/) o IEEE – The Institute of Electrical and Electronics Engineers o IPC – Association Connecting Electronics Industries o SMTA – The Surface Mount Technology Association o NCMS – National Centre for Manufacturing Sciences o NEMI – National Electronics Manufacturing Initiative o EICTA – European Information, Communications and Consumer Electronics Industry Technology Association o JGPSSI – Japanese Green Procurement Supply Survey Initiative o JEITA – Japanese Electronics & Information Technology Industries Association o PCIF – Printed Circuits Interconnection Federation Q. What is CML’s definition of Pb-free content? A. A component or assembly shall be defined as containing no Pb when the Pb content of the device is less than 0.1% by weight and is not intentionally introduced. This definition is in accordance to IPC/EIA J-STD-006. Q. Is a Pb-free 260°C solder reflow profile recommended by CML for use with their components? A. A 260°C solder reflow profile can be used for all Pb-free devices please see attached link: Solder Profile Q. Is there a maximum number of allowed reflow cycles for Pb-free devices? A. CML recommends a maximum number of reflows to be 3 times when the recommended solder reflow profile is used. For example, reflow + removal + reflow would be 3 reflows. Q. Is there a Minimum Order Quantity (MOQ) of RoHS Compliant (Pb-free) products? A. No. Q. What is the external termination composition of RoHS Compliant (Pb-free) products? A. 100% Matte tin for all package styles except LS/L2 (PLCC24), which uses Sn96Ag4. Q. What is the chemical composition of CML products? A. Please contact your local representative for the appropriate Material Data Sheet for any CML package style. Q. I am moving to a fully Pb-free manufacturing process, who do I need to contact regarding supply of Pb-free versions of my current device? A. Your first contact point should be your local representative or distributor, their details are available elsewhere on this website. Please ensure the requirement for RoHS compliant (Pb-Free) products is detailed on all purchase order paperwork. RoHS Shipping Labels Q. Once my order is acknowledged and the delivery schedule confirmed how could I expect the devices to arrive in my stores? A. All RoHS compliant shipping materials will clearly be labelled with either e2 or e3 labels as shown in Figure 1 on the RoHS Shipping Labels Document. By definition enclosed devices will be lead free. In addition, if devices are shipped in moisture barrier bags a label disclosing the MSL level of the devices within the package will also be attached; please see Figure 2 on the RoHS Shipping Labels Document. Devices that are MSL level 1 will be shipped without this additional label. On Acknowledgments, Despatch Notes and Invoices, items will be marked as “Lead-Free Product” where appropriate. Q. How can a customer distinguish between a Pb-free product and a product that contains Pb? A. Pb-free products will have appropriately labelled packaging. Q. Will CML components and assemblies classified as RoHS compliant (Pb-free) work in a low temperature (220°C to 240°C) Pb process with typical Pb based solders? A. All RoHS compliant (Pb-free) products are backwards compatible and qualified for a lower temperature (220°C to 240°C) Pb process and solder. CML can provide solderability test results if required by the customer. CML can confirm that RoHS compliant devices can and have been successfully soldered with Pb- based solders. Pure matte Sn has been chosen by CML due to its history of reliable performance in Sn-Pb soldering processes and its compatibility with Pb-free soldering. CML has carried out research to determine that its Pb-free devices perform at standard Sn-Pb reflow temperatures. Q. What is the Pb-free solder composition qualified by CML? A. CML has qualified the following Pb-free composition: Sn 96%, Ag 3.5% and Cu0.5%. At this time, we have no specific plans to qualify any other solder types. Q. What qualification testing has been completed to evaluate and qualify Pb-free products? A. CML qualification testing of components and assemblies included the following areas: o 260°C Pb-free High Temperature Reflow o I/O Lead Solderability o Resistance to Soldering Heat o Temperature Cycle o PCT CML can provide technical information and reliability qualification data, as required, to assist customers with their concerns. Pb-free component and assembly test results can be obtained from your CML sales representative. Q. Do I need to make any process or material changes to my PCB assembly process to use CML Pb-free products? A. Pb-free components and assemblies manufactured by CML are qualified for use in PCB assembly processes using either SnPb or SnAgCu solders. CML qualification testing indicates that our Pb-free components and assemblies can be used interchangeably in either PCB assembly process. Site map Home Company Overview Global Sales Network Careers Contact Us Follow us Our worldwide offices