Home About Us Reach Us Contact Us Partners Services Staff Applications Products Devices Markets Home ›› AOI AOI MVP – Machine Vision Products MVP was founded in 1993 by Dr George Ayoub and a team of experienced engineers. Since then MVP has developed five generations of Optical Inspection Equipment and creating award-winning innovations. Some of these innovations include multiprocessor architecture, advanced solid-state lighting modules, “flying camera” inspection, parallel computing architecture for real-time image analysis, and multiple acquisition camera modules for high-speed in-line inspection. More impressive is the software power, flexibility and ease-of-use, permitting it to adapt to wide range of applications across many industries in SMT and Microelectronics. As a result, MVP’s AutoInspector Series is the fastest and most accurate inspection system available in today’s market. Other innovations include powerful inspection software, paste inspection, productivity tools such as off-line programming, database generation, in-line repair and laser pointers, and many more. The company continuously expands its R&D effort in the field of automated circuit board inspection in order to meet the future needs of its growing customer base in the US and international markets. MVP 850 Die and Wire Bond Inspection MVP’s 850G inspection techniques include high-resolution telecentric imaging, quad color lighting, and 3D techniques to provide the maximum defect, and measurement capabilities for Die and Wire Bond inspection. For in-line operations, single and dual lane options are also available to quickly process microelectronic assemblies. MVP also provide many material handling configurations for the 850G AOI system including magazine lifters, tray handling and other custom solutions. For in-line operations, single and dual lane options are also available to quickly process microelectronic assemblies. Download Brochure HOME | CONTACT US LEGAL DISCLAIMER | CREDITS Copyright © 2009 Electron-Mec s.r.l. All Rights Reserved. P.IVA: 01773040157

Home About Us Reach Us Contact Us Partners Services Staff Applications Products Devices Markets Home ›› Packaging/Die & Wire Bonding Packaging/Die & Wire Bonding TPT APPLICATION: BUMP BONDING Here we present a special bond application: bump bonding with & without tail. Bump bonding is used for flip-chip applications. For flip-chip assembly a chip is mounted top-sidedown directly on a substrate/chip. No wires are used. The contact is established by beforehand applied bumps. Click here to download pdf TPT APPLICATION: RIBBON BONDING Here we present a special bond application: bonding with ribbon wire. Advantages of ribbon connections are the low impedance and the considerable heat dissipation. Due to these characteristics ribbons are frequently used, for example in RF technology. Click here to download pdf HOME | CONTACT US LEGAL DISCLAIMER | CREDITS Copyright © 2009 Electron-Mec s.r.l. All Rights Reserved. P.IVA: 01773040157