OUR MARKETS AUTOMOTIVE AEROSPACE ELECTRONICS HEALTHCARE ADVANCED COMPOSITES PACKAGING PAPER, NATURAL FIBRE,… TECHNICAL TEXTILES ADHESIVE BONDING IN ELECTRONICS Adhesive bonding of dissimilar substrates is a widely used joining technique in the electronics industry. Surface functionalization methods such as activation or chemical priming are often required to ensure a long-lasting bond. The technologies commonly used for this purpose have significant limitations. LIMITATIONS use of toxic solvents manual or semi-manual operation limited operating window due to time constraints limited repeatability and reliability due to difficulty to controlling processes impossibility to have in-line quality control and/or inspection insufficient performance on materials such as polyolefins and elastomers Our MolecularGrip™ helps manufacturers of electronic components, flexible electronics, 5G systems, etc. overcome a wide range of adhesion challenges. Because our technology operates at ambient temperature and no sparks are generated during the creation of the plasma, it is the ultimate reliable, safe, and easily scalable technology for the electronics industry. SEE SURFACE FUNCTIONALITIES FOR AN OVERVIEW OF THE SOLUTIONS WE CAN OFFER WITH OUR TECHNOLOGY. If you have any questions or require a specific surface functionality for any of your products, please contact us. OUR PRODUCTSCONTACT US Molecular Plasma Group SA Technoport Hall 4B Rue du Commerce L-3895 – Foetz Luxembourg +352 545 580 461 Molecular Plasma Group bv Bio-Incubator Gaston Geenslaan 1 B-3001 – Leuven Belgium +32 475 28 37 05 Molecular Plasma Group UK Westwood House Annie Med Lane South Cave HU15 2HG – UK +352 54 55 80 461 BOOK INNOVATION DAY CONTACT US Privacy policy © Molecular Plasma Group 2021 by cncpt