EN Home Products Electronics Equipment (Electronics) Our unique systems approach Inline processing for printed circuit boards (HDI/MLB and Flex/Flex-Rigid Boards), package substrates, and semiconductor applications Quick facts Unique systems approach: Supplying chemistry, equipment, process know-how, service and spare parts Leading sustainable solutions Two production sites in Germany and China Clean room production capabilities in Germany Applications Printed circuit boards (HDI, MLB, Flex / Flex rigid boards) IC substrates Semiconductor Advanced packaging Flat panel displays Product portfolio Permanganate desmear Atotech’s versatile desmear equipment Uniplate® P allows high throughput rates, from multilayers to thicker boards and HDI boards or bare laminate boards for semi additive processes, giving the best results with almost all available base material (except chemical non-resistant substrates and materials containing acrylic adhesives). More than 380 Uniplate® P lines have been installed for high volume production of MLBs, HDIs and IC substrates for high-end applications such as mSAP/amSAP. It provides the leading transportation capability for thinnest PBS boards going down to 25µm + 2×2µm Cu clad. Our Uniplate® P has a long successful tradition. Based on this Atotech has developed the next generation „New Uniplate“ design which is incorporating all the benefits and advantages of our traditional Uniplate® PLB platform. On top of this, the „New Uniplate“ features advances and benefits in reduced footprint, enhanced maintenance and user friendliness, energy consumption reductions, new pump technology and sustainable process control. Following the technology requirements, we improved the fine line capability by adding many sophisticated solutions for particle avoidance and particle reduction. Equipment highlights: High quality stainless steel sweller and permanganate modules ensure maximum process stability and low maintenance Integrated stainless steel filtration system for sweller and permanganate Designed to save resources – highly efficient chemical regeneration system for continuous production at stable process parameters (patented Oxamat® for permanganate regeneration) and sophisticated rinse concept High level of automation and process control combined with the smart use of production data ready for FAB 4.0 Strong process performance with with patented flood bar technology The Polygon P line is Atotech‘s new desmear equipment for printed circuit board manufacturers with high reliability and high performance demands in multilayer, rigid-flex and HDI panel processing. The new horizontal line is available in line speeds up to 3.5m/min with to different transportation systems for 24“ and 28,5“. Polygon Line series features all production-critical characteristics and applies them to a highly reliable, high-volume, and cost-effective machine. Equipment highlights: Equipped with technology to reduce consumption of water and chemistry (e.g. patented Oxamat for permanganate regeneration, encapsulated modules, minimal bath volumes, multi-stage cascade rinses and condenser units) Strong desmear performance with ultra sonic devices for sweller and permanganate The line is available with steam or hot water heating to use existing heat sources at customer site and save electrical energy consumption Strong process performance with patented flood bar technology Electroless copper process Direct plating Horizontal electrolytic copper process Vertical electrolytic copper process Surface treatment / Innerlayer bonding Final finishing Electrolytic plating for the semiconductor and advanced packaging industry Electroless metallization for displays Service and spare parts Featured products MultiPlate® Innovative electrochemical plating system for next generation packaging Read more Polygon PLB line® New cost-effective plating tool for highly reliable, high-volume PCB production Read more vPlate® New vertical continuous copper plating equipment Read more Uniplate® PLBCu6 Market leading hor. inline production equipment for mSAP technology Read more Transportation technology Universal transport system (UTS) – For ultra flex material processing (UTS-xs) Atotech’s Universal Transport System is designed to enable Atotech’s desmear, PTH and copper plating equipment to process a broad range of different panel thicknesses. The Universal transport system consists of UTS-XL, UTS-s, UTS-xs and the new UTS-xs+. It is the latest addition to the UTS that opens new possibilities for safe thin material transportation in our Uniplate® P and LB lines. Read more MultiPlate® An innovative electrochemical plating system for next generation packaging technologies Recent publications Automation and the intelligent use of production data in a smart PCB FAB Automation and the intelligent use of production data in a smart PCB FAB. More and more high-end PCB makers for process technology such as (a)mSAP are under increasing pressure to improve efficiency, yield and minimize the total cost of ownership, without compromising quality. With increased automation and communication capability comes the ability to collect more production and process data which is required for effective process management and traceability as well as meeting high quality standards. 2019, PDF, 2,339 KB Upscaling panel size for Cu plating on FOPLP (Fan Out Panel Level Packaging) applications to reduce manufacturing cost The ever increasing demand of higher performance, lower cost and thinner end user devices like smartphones require intense developments and innovation in all areas of the electronic component design including the substrate and chip packaging. Latest manufacturing technologies in both areas like fan-out wafer level packaging and advanced substrates are constantly emerging and promise to be a critical piece to meet these requirements. The paper presents latest studies and conclusions in critical performance areas of the plating process such as electrolyte fluid dynamics, impact of anode design, pulse reverse rectification and newly designed electrolytes on panel sizes of up to 600 mm. This article was originally published on IMAPS 2018, Pasadena. 2018, PDF, 900 KB A novel horizontal copper pattern plating system with high throughput Horizontal copper plating processes have been used in high volume production to produce PCB’s for MLB, Flex-rigid, IC substrates and HDI applications. As the lines and spaces (L/S) requirements have become more and more challenging over the years, panel plating technology has hit the barrier in the range of L/S 35/35 μm in combination with a request for rectangular shape of the traces. This paper will describe a new horizontal copper plating process especially designed to transport very thin panels with a thickness down to 30 μm (25 μm Substrate with 2×2 μm copper clad). This article was originally published on TPCA 2019, Taipei. 2019, PDF, 730 KB Electronics portfolio overview Surface treatment Desmear and metallization Electrolytic plating Final finishing Leadframe and connector Semiconductor Contact Us Country Name Email By entering your email address, you agree that we will answer your request via email. Your message I have read the privacy policy and I agree to the data storage and use as described there. Products Electronics General Metal Finishing About us Company Innovation Management History Sustainability Environmental Social Corporate governance Careers Why join Jobs Investor relations Stock information Financial information Investor resources Media Press releases Tradeshows Technology updates Videos Webinars Global TechCenters Production Contact Follow us Atotech 2021Legal information & privacy policy We use cookies to ensure that we give you the best experience on our website. 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