English Worldwide Technologies & Applications Solutions & Platforms News & Events Company & Corporate Photonic Device Assembly Assembling the photonic devices that enable other industry sectors to move forward Although the lion’s share of photonic device assembly is still for discrete components and devices, the recent developments in photonics integration illustrate well the ensuing dramatic evolution of the photonics market. In transitioning from the use of bulky macro-systems to micro-optical components to integrated optics, the photonics sector is experiencing what has become true for the electronics market since the 1970’s. Irrespective of component size, the assembly of photonic devices still fundamentally depends upon precision positioning and alignment. Additionally, a high-precision and thermally capable bonding approach is key to the absolute performance and long-term reliability of the assembled component, as it directly affects lifetime (via heat dissipation) as well as operation and performance (via component temperature or residual stress). And by properly accounting for shrinkage during bond cooling or curing, maximum performance can be assured, thus maximizing yield. As the component density of optical modules and their complexity increases – a vital trend necessary to ensure the future competitiveness of photonic solutions – the need for advanced automation in assembly becomes increasingly obvious. And in particular when hybrid integration with semiconductor electronics is required – where electronics manufacture is already a highly automated technology – automation of photonic device assembly is the only real way forward. The photonic devices our machines assemble include silicon photonics components, (3D) sensor and LiDAR assemblies, photonics-enabled medtech devices, MEMS/MOEMS, miniature lasers, HPLDs and fiber pump modules, hybrid assemblies, LED print heads, high-power LEDs, optical communication devices, and many more. Have a device type that is not listed? Get in touch: Contact us Key features Passive/active high-precision alignment High-precision bonding accuracy Flip-chip position-&-attach Chip-on-Submount (CoS) Hybrid integration, fiber alignment & pigtailing Optical element assembly into packages Simultaneous alignment of two optical elements High-precision positioning systems Fast 6-axis dual align-&-attach In-package align-&-attach Rapid passive chip alignment Custom test probe heads Laser to waveguide using flip-chip assembly Pick-&-place & handling sub-systems Die sorting and component tracking Welding, soldering, or (UV) epoxy bonding Adjustable bond force Process parameter sequencing & tracking Acquisition of operating parameters into a database OCR for serial number tracking and component traceability Simultaneous alignment of two optical elements Fiber array attachment Complex micro-optical assembly Vacuum pick-up tools Relevant machine types: ASSEMBLYLINE, FIBERLINE, BONDLINE, CUSTOMLINE Photonic Device Assembly (in-line), A1200 ASSEMBLYLINE Fiber-Optic Assembly, incl. F300 F300 Photonic Device Assembly Cell (stand-alone), AL2000 More info Service & Support GERMANY T +49 4202 51160-0 info@ficontec.com USA T +1 949 388 5800 usa@ficontec.com CHINA T +86 21 527 309 85 china@ficontec.com THAILAND T +66 (2) 050-7772 thailand@ficontec.com IRELAND T +49 152 546 715 51 ireland@ficontec.com ESTONIA T +49 4202 511 60-240 estonia@ficontec.com INITIATIVES & ASSOCIATIONS German Engineering 2021 Twitter Linkedin Terms Imprint Sitemap Datenschutz Privacy Preference We use cookies on our website. Some of them are essential, while others help us to improve this website and your experience. Essential Statistics External Media Accept all Save Individual Privacy Preferences Cookie Details Privacy Policy Imprint