English (EN) Services Contact Menu Metrology EV Group Technologies Metrology Metrology Process control and optimization for lithography and bonding Introduction Features Figures Introduction To complete EVG’s lithography and bonding portfolio, sufficient metrology is necessary to ensure process control and (in combination with feedback loops) also allow for process parameter optimization like bond alignment. Versatile measurement options are available to meet the metrology requirements for a wide variety of applications. These tools can fit in HVM and R&D environments. Metrology is essential to control, optimize and ensure the highest yield in semiconductor manufacturing processes. Advanced packaging, MEMS and photonic applications are gaining importance, very often lacking suitable metrology solutions for essential processing steps. Furthermore, overall performance of the device is determined by packaging and back-end-of-line processes; hence, process requirements are getting tighter and need further metrology. EVG’s metrology solutions for wafer inspection and evaluation are optimized for lithography and all types of bonding applications. As one example, metrology prior to non-reworkable processes like wafer thinning after temporary bonding directly leads to increased yield and process security, where an integrated feedback loop results in a reduction of high-cost wafer scrap. Features Adaptiveness Multi-sensor measurement mount for highest metrology flexibility Sensor set available for multiple measurement ranges and materials Self-calibration of measurement units for minimum service and maintenance Integration in stand-alone or production tool Handling Handling and metrology of various substrates materials, shapes, stress, bow or warp Bridge capability for different substrate sizes and carrier mounted wafers Available with multiple load port options and combinations Control Feedback loop for correction of process parameters Customized Pass/Fail criteria for automated processing decisions Fully integrated SECS/GEM interface Figures Overview of EVG’s metrology systems to support lithography and bonding process control. Correction cycle and alignment improvement by sufficient metrology in combination with a production feedback loop. Events SEMICON Europa 2021 MESSE MÜNCHEN | Co-located with Productronica 16.11. - 19.11.2021 Munich, Germany SEMICON Japan 2021 Venue: Tokyo Big Sight/Online 15.12. - 17.12.2021 Tokyo, Japan Show all events Related downloads EVG Solutions for Metrology Brochure - 2.32 MB EVG Solutions for MEMS Brochure - 2.28 MB Talk to our EVG technology experts! Questions? Contact form Related products Metrology Systems Questions about our technologies? Contact the EVG experts Send us a message Related News EV Group Brings High-Speed High-Precision Metrology to 3D Heterogeneous Integration Nov, 2021 From wafers to power electronic applications: new consortium to create European supply chain for silicon carbide semiconductors Oct, 2021 EV Group Celebrates “40+1 Year” Anniversary with Exciting Live Event at Corporate Headquarters Sep, 2021 Explore our products and technologies Metrology Systems Explore now EVG Products Explore now EV Group Products Technologies Company Careers Social Media LinkedIn Facebook Twitter YouTube Join our newsletter We will send you updates on new products and technologies. Your Email Subscribe © 2021, EV Group (EVG) Imprint Privacy Policy Terms of use