TECHNOLOGY ADVANCED PACKAGING Advanced Packaging Wafer-level optics TSV System in Package Sensing is Life Our vision is to create the uncontested leader in optical solutions through bold investments in disruptive innovation and continuous transformation delivering best-in-class profitability and growth. Visit our dedicated website Wafer-level optics ams wafer-level integration and process technologies enable high volume manufacturing of extremely precise, miniaturized optics, sensors and modules. By combining proprietary design technology and processes in the development of packaging solutions, we enable greater design flexibility, increased performance, reduced form factor, lower total system costs, and improved aesthetics in mobile devices. End-to-end supply chain control, from design to manufacturing, ensures that our products are manufactured in high volume with consistent quality. Through-Silicon-Via Through-Silicon-Via (TSV) packaging technology is a wafer packaging technology patented by ams which radically reduces the height of an optical IC package. Unlike traditional IC packages, which use wire bonds between the I/O wedge of a die and a package bond pad, a TSV does not use wire bonds but instead routes I/O signals through a tungsten deposited dedicated channel via (constructed during the silicon manufacturing process) to a solder ball through a PCB trace (called a reduced distribution trace layer). Key Features The industry’s lowest package height, just 320µm, enables the production of ultra low-profile devices. A TSV glassless package is handled like a Wafer-Level Chip-Scale Package (WL-CSP) but without the metal connection which is present on the side of a silicon type package. As a result, the TSV package offers superior Moisture Sensitivity Level-1 levels, Humidity Temperature-Cycling performance and corrosion resistivity. With no inductive wire bond connecting the IC to the package, wire-bond inductance is minimized, resulting in improved performance. Lower infra-red sensitivity helps improve optical accuracy in environments subject to high levels of IR ambient light. Multiple optical filters may be deposited, enabling a detector’s response to light to be customized. System in Package A system in package (SiP) integrates the sensor and associated external passive components into one small housing. This reduces the footprint, lowers system costs, and relieves the manufacturer of the cost and time involved in developing and assembling a PCB. A SiP is also far less sensitive to incorrect placement. Therefore, it provides more accurate and reliable sensor measurements. A SiP is flexible in its installation and orientation. Discover SiP technology @ Join our newsletter Subscribe now to the ams Sensing is Life newsletter Sign up ams AG Tobelbader Strasse 30 8141 Premstaetten Austria Phone +43 3136 500-0 Fax +43 3136 525-01 https://ams.com Back to top Sensing is life. ABOUT ams Investor Relations News Center Corporate Responsibility SERVICES Contact Us Sales & Distribution Subscribe ams sensor news QUICK LINKS Search Quality – Certificates Open Positions ams and OSRAM © 2021 ams AG. All rights reserved. Disclaimer Imprint Privacy Policy Cookie Policy Terms of Use .st0{fill:#B5B6B7;} .st0{fill:#5D6A7A;} Accept All Cookies (incl. US)