EN Home Products Electronics Electrolytic plating Electrolytic plating Integrated wet chemical process and equipment solutions for package substrates and printed circuit boards (HDI/MLB and Flex/Flex-Rigid) Quick facts Electrolytic plating for the highest requirements in reliability and productivity Solutions for various equipment types: Uniplate® IP2, vertical conveyorised lines, conventional hoist type Market leading Uniplate® IP2 equipment for horizontal conveyorized production Applications Conformal plating BMV filling TH filling Pretreatment Metal resist, electrolytic final finishes Product portfolio Conformal copper plating Panel 2.4 mm thickness incl. flash copper, hole diameter 0.2 mm, aspect ratio: 12:1, throwing power: > 85% High volume conformal plating production in Uniplate® InPulse2 equipment: Inpulse® 2HFU2 is masking drilling defects and provides reliable coverage of wedge voids thanks to its superior throwing power in BMVs. The process is the ideal solution for reliable mSAP flash plating. Inpulse® 2HT2 assures best plating uniformity in through holes with significantly improved surface plated copper distribution, comparing high and low hole density areas. The latest version of Atotech’s Cupracid® TP series: Cupracid® TP3. This is an electrolytic copper plating process for conventional hoist type DC equipment using soluble anodes. It provides outstanding throwing power at high current densities and low surface tension for the comprehensive wetting of BMVs and through holes. Cupracid® TP3 offers excellent reliability results. It is a very robust process with stable plating performance after idle time. Cupracid® AC5 is our next generation process for conformal copper plating with soluble anodes. It provides even improved throwing power in both BMVs and Through Holes at high current densities. It is compatible to a wide range of metallisation processes on the market and ideally suited for Automotive production. Cupracid® AC5 is compatible with a wide range of vertical conveyorised systems with sparger electrolyte agitation as well as hoist type equipment with air agitation. Cuprapulse® XP7 for soluble anode systems is our pulse plating solution for high aspect ratio conformal copper plating. DC technology does not even come close to the throwing power performance achieved with Cuprapulse® XP7. High current density pulse plating allows for increased productivity with simultaneous quality improvements such as better surface distribution and line shape. Cuprapulse® IN is our answer to the increasing market demand for vertical pulse plating with insoluble anodes in VCP and hoist type systems. It provides more uniform copper appearance in comparison to standard pulse plating processes with soluble anodes. It can be operated under turbulent flow conditions without oiling-out or two-tone effect. Pulse plating allows for superior throwing power in shortest plating time for high throughput in your plating equipment. Especially for the requirements of the flex/ rigid-flex market, we have developed InPro® FLEX2 / Cupracid® FLEX2. Both processes target conformal copper plating at high current densities and provide excellent throwing power in Through Holes. The deposits plated with both processes exhibit excellent crystal structure, ductility and flexibility for the highest reliability in flex application. InPro® FLEX2 is for use with insoluble anodes, Cupracid® FLEX2 operates with soluble anodes. Copper BMV filling Copper through hole filling Electroytic finish RDL and Pillar plating Pretreatment InPro® THF / InPro® THF2 Panel/pattern via filling in VCP using insoluble anodes for (a)mSAP Read more InPro® MVF / InPro® MVF2 Excellent filling results for next gen. HDI, flex and Automotive production Read more Inpulse® 2THF2 Inclusion-free through hole filling with horizontal equipment Read more Cupracid® AC5 High throw conformal copper plating for MLB and HDI production Read more Uniplate® InPulse2 Atotech’s leading integrated horizontal system for electrolytic copper deposition The unique Uniplate® InPulse2 System and processes are ideally suited to meet all demands for high end production using pulse plating at high effective current densities with insoluble anodes. Inpulse® 2HF9 – Atotech’s SuperFilling technology allows reliable high volume HDI production of stacked via technology Inpulse® 2THF2 – a unique process enabling inclusion-free through hole filling with minimum surface plated copper Inpulse® 2HFU2 – best BMV preparation for subsequent lamination and copper filling within mSAP production processes Read more Multiplate® P Atotech’s solution for next generation packaging technologies MultiPlate® is the ECD tool that offers the versatility and multifunctionality necessary to tackle current and future challenges for optimal performance in advanced packaging technologies. The MultiPlate® P system is designed for Panel-Level-Packaging and capable of processing panels up to 650×610 mm. Innolyte® PLP – the RDL and via filling process offers excellent distribution and via filling capabilities in combination with an excellent line shape Innolyte® P – high purity copper pillar plating at current densities up to 20 A/dm² for best uniformity and no voiding in IMC. “We offer cost-efficient solutions to the PCB and FOPLP industry with the full spectrum of applications for electrolytic plating of Cu, Sn, Ni, Pd, Au and suitable pre-treatments. Our portfolio comprises of processes for all types of equipment from horizontal to VCP and hoist type systems.” Bert Reents Global Product Director Electrolytic Plating at Atotech Germany Recent publications InPulse 3 - A New Horizontal Cu Plating System for mSAP/amSAP Technology This paper describes a new horizontal copper plating process especially designed to transport very thin panels with a thickness down to 30 μm (25 μm Substrate with 2×2 μm copper clad). It also shows first plating results with the combination of this new equipment together with the new developed dedicated electrolyte. The new system is designed enable pattern plating and the use of (a)mSAP processes towards lines/ spaces in the range of 20/20 µm. The paper was first published during EIPC winter conference in February 2020. 2020, PDF, 1,119 KB Filling of Microvias and Through Holes by Electrolytic Copper Plating – Current Status and Future Outlook This article was created in cooperation with GreenSource Fabrication LLC., USA and was originally presented on IPC APEX EXPO 2019. The paper describes the reasons for development of copper via filling and a roadmap of dimensions for copper filled through holes, microvias and showing aspects of other copper plated structures on PCBs. Furthermore, it contains feasibility studies of new electroplated structures for future applications such as copper pillar plating on IC-substrates. 2019, PDF, 540 KB Enhancing Productivity for IC-substrate manufacturing by using a novel Copper Electrolyte for Semi Additive Plating The Semi Additive Process (SAP) has gained more attraction over the past years because it enables very fine lines and spaces for the production of IC-substrates. When operating with lines and spaces (L/S) of 10/10 μm and less, the copper thickness variation is one of the critical parameters which has to be controlled within a tight range in order to avoid reliability problems in assembly or during the lifetime. This paper contains the results of our investigations on our latest via filling process for IC-substrates with regards to copper thickness variation (WUD), dimple results, filling performance and microsection pictures. This article was originally published on EPTC 2018, Singapore. 2018, PDF, 320 KB Upscaling panel size for Cu plating on FOPLP (Fan Out Panel Level Packaging) applications to reduce manufacturing cost The ever increasing demand of higher performance, lower cost and thinner end user devices like smartphones require intense developments and innovation in all areas of the electronic component design including the substrate and chip packaging. Latest manufacturing technologies in both areas like fan-out wafer level packaging and advanced substrates are constantly emerging and promise to be a critical piece to meet these requirements. The paper presents latest studies and conclusions in critical performance areas of the plating process such as electrolyte fluid dynamics, impact of anode design, pulse reverse rectification and newly designed electrolytes on panel sizes of up to 600 mm. This article was originally published on IMAPS 2018, Pasadena. 2018, PDF, 900 KB Electronics portfolio overview Surface treatment Desmear and metallization Final finishing Leadframe and connector Semiconductor Equipment Contact Us Country Name Email By entering your email address, you agree that we will answer your request via email. Your message I have read the privacy policy and I agree to the data storage and use as described there. Products Electronics General Metal Finishing About us Company Innovation Management History Sustainability Environmental Social Corporate governance Careers Why join Jobs Investor relations Stock information Financial information Investor resources Media Press releases Tradeshows Technology updates Videos Webinars Global TechCenters Production Contact Follow us Atotech 2021Legal information & privacy policy We use cookies to ensure that we give you the best experience on our website. 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