Search 978-568-1330 HOME ABOUT PRODUCTS CAPABILITIES TECHNICAL DATA NEWS REQUEST A QUOTE CONTACT Request a Quote Technical Support Looking to buy from a selection of in-stock, finished materials? Shop Our Store View our ISO Certification: Centerline's CAGE Code: 6JYX8 Lapping and Polishing, and Ultra-Precision Surface Finishing Centerline Technologies provides ultra-precision services for grinding, lapping, polishing, diamond sawing and laser machining of metals, ceramic, sapphire and other materials — for the telecommunication, semiconductor, communication, test & measurement, micro-electronic, defense and security industries. Lapping The lapping process is used to provide flatness, parallelism, thickness identity, and surface finishes to extremely demanding tolerances. Polishing Centerline uses both mechanical and chemical mechanical process (CMP) to meet the polishing needs of our customers. Filled Via Planarity We specialize in making filled via's co-planar with surface substrate. Wafer Dicing / Diamond Sawing Centerline offers diamond machined edges, bevels, V grooves and chamfers per your specifications. Laser Machining Centerline can laser drill, scribe or cut a variety of substrates to your specifications. Specialty Processes Centerline develops processes for different materials, such as ferrites and glass interposers. Products Centerline sells a variety of materials in different sizes. If we don't have what you need we're willing to help you find it! Technical Data We have compiled many useful resources to help answer your difficult questions! We take pride in seeing our customers accomplish great things and we recognize that it can’t be done without great parts. At Centerline, we dedicate ourselves to your success by providing the best services possible. Products Alumina BeO Aluminum Nitride Fused Silica/Quartz Sapphire Shop Our Store Capabilities Lapping Polishing Filled Via Planarity Diamond Sawing Laser Machining Specialty Processes Quality Control Small Quantities Technical Data Conversion Tool About Us Why Polish Substrates? Customers News Quality Control Careers Contact Centerline Technologies, LLC 577 Main Street Suite 270 Hudson, MA 01749 Call: 978-568-1330 Fax: 978-568-1334 End-to-End Encryption, Powered by Worldpay © 2021 Centerline Technologies