English Worldwide Technologies & Applications Solutions & Platforms News & Events Company & Corporate ficonTEC Insider Welcome to ficonTEC’s blog page, a magazine-style approach to news and stories that is designed to keep our valuable customers, partners and followers better informed of important developments & changes, and of current topics and their relevance, as well as providing an educational ‘inside line’ to applications capability and skilled system usage. Please feel free to provide feedback on the content. Alternatively, ficonTEC can be reached using the ‘Contact us’ button present for each blog entry. BROWSE CATEGORIES Assembly Blog Corporate Events News Partner & References Posts Process Development Projects & Initiatives R&D Service & Support Testing RECENT TAGS access applications artificial intelligence China collaboration custom downtime electro-optical EPIC Europe ficontec global growth high volume hybrid integration integrated integrated photonics intelligent data Ireland lidar machine learning manufacturing micro-assembly mixed-signal partner performance phix photonics PIC PIC design pilot line PIXAPP process monitoring R&D service specials strategic support testing Tyndall USA VCSEL wafer level yield ´ Service & Support GERMANY T +49 4202 51160-0 info@ficontec.com USA T +1 949 388 5800 usa@ficontec.com CHINA T +86 21 527 309 85 china@ficontec.com THAILAND T +66 (2) 050-7772 thailand@ficontec.com IRELAND T +49 152 546 715 51 ireland@ficontec.com ESTONIA T +49 4202 511 60-240 estonia@ficontec.com INITIATIVES & ASSOCIATIONS German Engineering 2021 Twitter Linkedin Terms Imprint Sitemap Datenschutz Privacy Preference We use cookies on our website. Some of them are essential, while others help us to improve this website and your experience. Essential Statistics External Media Accept all Save Individual Privacy Preferences Cookie Details Privacy Policy Imprint