HOME ABOUT US TECHNOLOGY CUSTOMER SUPPORT CAREERS CONTACT US Mature Products Aspen™ III Based on proprietary ICP source design with grounded Faraday shield, Aspen III delivers production proven and cost-effective strip and etch solutions to semiconductor manufacturers worldwide. The Aspen III’s exceptional platform design can handle both 200 mm and 300 mm wafers, and supports special wafer handling including warped and translucent wafers. The unique process chamber architecture can accommodate technical requirements across multiple technology nodes for the most demanding device manufacturers in the industry. Aspen™ II First introduced in 1990, the Aspen II is based on a highly reliable and productive system design. It provides proven process capabilities and cost of ownership benefits in high volume manufacturing to chipmakers worldwide. Alpine® Alpine is a cost effective, technology platform for both advanced plasma strip and semi-critical etch applications. Based on proprietary Faraday shield inductively coupled plasma (ICP) source design, Alpine incorporates an electrostatic chuck with bias capability to provide independent control of ion energy and ion density. Developed on a production proven platform, Alpine delivers superior productivity and cost of ownership. Print Technology TECHNOLOGY OVERVIEW DRY STRIP PLASMA ETCH SURFACE TREATMENT & ULTRA-SELECTIVE MATERIALS REMOVAL RAPID THERMAL PROCESSING MILLISECOND ANNEAL MATURE PRODUCTS HOME ABOUT US TECHNOLOGY CUSTOMER SUPPORT CAREERS CONTACT US Copyright © 2018–2021 Mattson Technology. All Rights Reserved. - Privacy Policy

HOME ABOUT US TECHNOLOGY CUSTOMER SUPPORT CAREERS CONTACT US TECHNOLOGY Dry Strip Plasma ETCH Surface Treatment and Ultra-Selective Materials Removal Rapid Thermal Processing Millisecond Anneal OVERVIEW We design and manufacture wafer processing equipment used in the fabrication of integrated circuits (ICs). Our manufacturing equipment utilizes innovative technologies to deliver advanced processing capabilities and high productivity for the fabrication of current- and next-generation ICs in the following product sectors: Dry Strip, Plasma Etch, Surface Treatment and Ultra-Selective Materials Removal, Rapid Thermal Processing (RTP), and Millisecond Anneal. PRODUCTS Our products deliver leading-edge wafer processing at high productivity levels which provide our customers with the most cost-effective manufacturing solution. Our tools are used by leading technology companies and are in full production at advanced semiconductor manufacturing, including DRAM, NAND and foundry/logic manufacturing companies. Print Technology TECHNOLOGY OVERVIEW DRY STRIP PLASMA ETCH SURFACE TREATMENT & ULTRA-SELECTIVE MATERIALS REMOVAL RAPID THERMAL PROCESSING MILLISECOND ANNEAL MATURE PRODUCTS HOME ABOUT US TECHNOLOGY CUSTOMER SUPPORT CAREERS CONTACT US Copyright © 2018–2021 Mattson Technology. All Rights Reserved. - Privacy Policy