Search 978-568-1330 HOME ABOUT PRODUCTS CAPABILITIES TECHNICAL DATA NEWS REQUEST A QUOTE CONTACT Request a Quote Technical Support Centerline News How should you specify camber and flatness to ensure the best results? What are the 7 main benefits of precision lapping? Did you know that Centerline now accepts credit cards? Be sure to subscribe to receive an email update when we post new articles! Click here to visit the News page. Centerline's Surface Finish Capabilities Centerline provides the standard services listed below in order to give substrates the required attributes. In addition to these common processes, we also accept unique or challenging requests. Lapping Customizable processes to meet specific needs. We use both single sided polishing and double sided applications. Polishing Centerline provides both mechanical and CMP (chemical mechanical process) polishing techniques depending on the customer’s requirements. Filled Via Planarity Centerline can make filled vias co-planar with the surface of the substrate using either a one or two step process. Wafer Dicing Centerline Technologies is capable of scribing or dicing a variety of shaped parts and finishing with diamond machined edges, bevels and chamfers. Laser Machining Centerline's laser machining services size the jobs according to specifications. Specialty Processes For all unique or difficult projects, Centerline works to find the right processes. Products Alumina BeO Aluminum Nitride Fused Silica/Quartz Sapphire Shop Our Store Capabilities Lapping Polishing Filled Via Planarity Diamond Sawing Laser Machining Specialty Processes Quality Control Small Quantities Technical Data Conversion Tool About Us Why Polish Substrates? Customers News Quality Control Careers Contact Centerline Technologies, LLC 577 Main Street Suite 270 Hudson, MA 01749 Call: 978-568-1330 Fax: 978-568-1334 End-to-End Encryption, Powered by Worldpay © 2021 Centerline Technologies