Products Applications Support News & Events Careers Corporate Contact Us 1 2 3 SET. The World’s Leading Supplier of High Accuracy Bonders. Learn more Press Releases [9/2016] MICRON D'OR More Headlines SET e-Newsletter Sign up Events SEMICON Japan, December 14-16, 2016, Tokyo Big Sight, Japan Show calendar SET’s team is pleased to launch two new equipment, ACCµRA OPTO and ACCµRA M. ACCµRA OPTO is perfectly adapted to optoelectronics applications, such as precise assembly of VECSEL, laser, diodes, lenses, prisms, requiring low bonding force. ACCµRA M is the perfect tool for flip-chip bonding applications for education and R&D. All axes are manual, except the vertical one allowing high repeatability and precise control in the assembly process. ACCµRA M ACCµRA OPTO Device Bonder line ACCμRATM100 Discover our brand new machine ! This table top machine guarantees ± 0.5 μm post-bonding accuracy. Very flexible, it is the perfect equipment for universities and R&D institutes. Watch the video Discover SET's bonders : ACCµRA M, ACCµRA OPTO, FC300, FC150, KADETT, LDP150 Spotlights NewFC150 Automated Die / Flip Chip Bonder[4/2016] SET Insights N°15 is available![3/2016] SET labeled BPI Excellence 2016[1/2016] On sale ! Kadett demo machine[6/2014] © Copyright 2011 SET - Smart Equipment Technology. All rights reserved. Site Map Legal Privacy Terms of Use Powered by siteo