Home About Us Products Packaging News Resources Contact Flame-Retardant Request Information Flame-Retardant Epoxyset offers a variety of flame-retardant potting and encapsulating compounds including epoxies, urethanes, and silicones. All of our flame retardant potting compounds bromine free, halogen-free, and RoHS and REACH compliant. Several have undergone stringent 3rd party testing and are listed as UL-94V0 approved. Product Viscosity (cPs) Pot Life Service Temperature Hardness Datasheet EC-1006M-4 6,000-8,000 5-6 hrs -55°C-120°C A-85 Download EC-1207 9,000-12,000 2-3 hrs -55°C-125°C D-76 Download EC-1012M 3,000-6,000 4-5 hrs -55°C-160°C D-91 Download EC-1012MFR-HT 15,000-20,000 1-2 hrs -55°C-200°C D-91 Download UC-2524 1500-3000 1-2 hrs -55°C-130°C A-86 Download SC-550LV-RT 800-1500 1-2 hrs -55°C-205°C A-55 Download Epoxyset is a leading manufacturer of custom formulated adhesives and potting compounds used in advanced technology applications. We supply superior quality products that are used in electronic and microelectronic, medical device, semiconductor, fiber optics, and assembly industries. 718 Park East Dr. Woonsocket, RI 02895, USA Phone: (401) 726-4500 | Email: info@epoxyset.com Terms & Conditions | Privacy Policy © 2021 EpoxySet, Inc.. All Rights Reserved. | Web Design by Black Door Creative English

Home About Us Products Packaging News Resources Contact Putty & Liquid Gap Fillers Request Information Putty & Liquid Gap Fillers TCP putties are ultra soft and highly conformable one part, paste type, Non-Cure type gap filler. Its consistency assures efficient heat transfer between delicate parts where minimum pressure can be tolerated. This Form-in-place gap filler is ideal for applying any thickness with little or no stress. It is designed to provide a thermal solution for the recent trends of integrating higher frequency electronics into smaller devices. Thermal Gap Fillers are also ultra soft, 2-part silicone polymers designed to efficiently transfer heat while creating a mechanical bond. Thermal gap fillers are ideal for high throughput use and are extremely easy to clean off once cured. Product Component Type Thermal Conductivity (W/mK) Service Temperature (°C) Viscosity (cps) Datasheet TGF-331 2 Gap Filler 3.6 -40-205 100,000-150,000 Download TGF-331-2 2 Gap Filler 3.6 -40-205 >500,000 Download TCP-101 1 Putty 2.1 -40-150 >4,000,000 Download TCP-101HT 1 Putty 3.2 -40-150 >4,500,000 Download Epoxyset is a leading manufacturer of custom formulated adhesives and potting compounds used in advanced technology applications. We supply superior quality products that are used in electronic and microelectronic, medical device, semiconductor, fiber optics, and assembly industries. 718 Park East Dr. Woonsocket, RI 02895, USA Phone: (401) 726-4500 | Email: info@epoxyset.com Terms & Conditions | Privacy Policy © 2021 EpoxySet, Inc.. All Rights Reserved. | Web Design by Black Door Creative English