Careers Investor Relations News EN PRODUCTS & SOLUTIONS COMPANY CONTACT MA8 GEN5 MASK-ALIGNER DETAILS OPTIONS DOWNLOADS MA8 Gen5 Mask Aligner Compact Aligner Platform for Research and Mid- to Large Scale Production The MA8 Gen5 represents the latest generation of SUSS MicroTec’s semi-automated mask and bond aligner. The new platform introduces improved imprint processing features for standard, advanced and high-end processes. The MA8 Gen5 offers an enhanced ergonomic and user-friendly design, cost efficiency and a reduced footprint, and is the perfect tool for use in research and mid- to large-scale production. SUSS MicroTec’s MA8 Gen5 is setting a new benchmark in full-field lithography for MEMS & NEMS, 3D integration and compound semiconductor markets, especially for a large variety of imprint applications in the field of LED, MEMS/NEMS, micro-optics, augmented reality and opto-electronic sensors using the renowned SMILE technology. It is also able to handle processes such as bond alignment and fusion bonding. Highlights Enhanced SUSS leveling system One tool covering micro- to nano imprinting Outstanding process results User friendliness Low cost of ownership Small footprint and enhanced ergonomics Ideal process results through precision The high degree of automation of the MA8 Gen5 enables outstanding process results. Functions such as constant dose mode, an automated control unit for exposure time and auto-alignment all help optimize process parameters. Additionally, equipped with the high-grade MO Exposure Optics system, the MA8 Gen5 provides ideal exposure conditions and thus achieves top-class results. Sophisticated mechanical workings ensure high adjustment precision: the particular design of the top- and bottom-side microscope unit (TSA and BSA) eliminates long travel for the TSA microscope, as well as the disturbing vibrations. It supports several imprint processes for micro- and nanostructures. With only a little adjustment, it allows wafer-to-wafer alignment, as well as easy fusion bonding. High operating comfort Functions such as a highly intuitive recipe editor, sophisticated data logging and the ability to assign user rights simplify the user’s work and simultaneously minimize the need for operator intervention. The MA Gen5 platform also makes use of high-grade digital microscopes and cameras, which significantly simplify the alignment process thanks to enhanced image quality and an extended field of view on the monitor. Work safety and environmental protection The MA8 Gen5 is equipped with an energy-efficient LED light source and sophisticated exposure optics for all lithography processes. In addition, a dedicated UV-LED flood exposure unit is available for imprint applications. The UV-LED light source not only reduces operating and maintenance costs, but improves work safety and environmental protection as well. This eliminates the expensive and hazardous waste disposal of mercury lamps. The machine offers further security features, such as UV radiation protection, safety interlocks and trap protection, thus fulfilling strict safety requirements. Optionally, configuration with a mercury light source is possible as well. Cost-effectiveness With its compact design, the MA8 Gen5 offers a wide variety of processes despite a reduced footprint, which is a major factor in the attractive cost of ownership, saving costly cleanroom space. Maintenance effort is reduced by the accessibility of the operating elements and exchangeable parts, as well as use of the LED light source and the renowned SUSS MO Exposure Optics. In the event of an error or failure, the machine can be accessed by SUSS MicroTec service staff remotely, so that the issue can be resolved in a quick and cost-effective manner. Details : Alignment Top-side alignment (TSA) Bottom-side alignment (BSA) Infrared alignment (IR) DirectAlign® Where lithographic processes require the alignment of structures on only one side of the device wafer (e.g. RDL, microbumping and similar techniques), top-side alignment is used to align the fiducials on the mask with those of the wafer. Depending on substrate properties, this can be achieved either using stored position data for the wafer or through live image alignment, as in the DirectAligntm system invented at SUSS MicroTec. Highlights Mask aligner for the highest level of alignment precision Clear and stable pattern recognition even under poor constrast conditions Available for: Automated Mask Aligner MA300 Gen2 MA200 Gen3 MA100/150e Gen2 Semi-Automated Mask Aligner MA/BA Gen4 Pro Series MA/BA Gen4 Series MA12 Manual Mask Aligner MJB4 Details : Exposure Proximity Lithography Soft Contact Exposure Hard Contact Exposure Vacuum Contact Exposure A mask with a certain structure is aligned with the wafer in very close proximity (thus “proximity” lithography). During exposure, the shadow cast by the mask structure is transferred to the wafer. The resulting exposure quality depends on both the precision with which the mask and wafer are spaced apart and the optical system used for exposure. Being fast and suited to flexible implementation, this method is regarded as the most cost-effective technique for producing microstructures down to 3 µm in size. With contact exposure, resolutions in the sub-micron range can be achieved. Typical areas of use include wafer-level chip-scale packaging, flip chip packaging, bumping, MEMS, LED and power devices. The systems are deployed in high-volume production as well as in industrial research. The mask aligners supplied by SUSS MicroTec are based on proximity lithography. Features & Benefits Superior resolution as a result of diffraction-reducing optics Process stability through the use of microlens optical systems Available for: Automated Mask Aligner MA300 Gen2 MA200 Gen3 MA100/150e Gen2 Semi-Automated Mask Aligner MA/BA Gen4 Pro Series MA/BA Gen4 Series MA12 Manual Mask Aligner MJB4 Details : Exposure Optics MO Exposure Optics® Diffraction-Reducing Optics MO Exposure Optics® is a unique illumination optics specifically designed for SUSS mask aligners. It is based on micro-lens plates instead of macroscopic lens assemblies. A simple plug & play changeover allows for a quick and easy changeover between different angular settings including the functionality of both classical SUSS HR and LGO illumination optics. The telecentric illumination which is provided by the MO Exposure Optics improves light uniformity and leads to a larger process window. In consequence, this causes yield enhancements. MO Exposure Optics also decouples the exposure light from the lamp source thus small misalignments of the lamp do not affect the light uniformity. A decoupled light source saves setup and maintenance time and guarantees uniform illumination conditions during the full life-time of the lamp. Highlights Excellent light uniformity over full exposure field Stable light source Customizable illumination by means of illumination filter plate exchange "DUV-ready" process capabilities with fused silica micro optics Special "down-sizing kits" for light compression to smaller wafer sizes Available for: Automated Mask Aligner MA200 Gen3 MA100/150e Gen2 Semi-Automated Mask Aligner MA/BA Gen4 Pro Series MA/BA Gen4 Series MA12 Manual Mask Aligner MJB4 Details : Automation Auto Alignment SUSS Leveling System Auto Alignment is based on a motorized alignment stage. The COGNEX® based pattern recognition software automatically recognizes wafer target locations and controls the movement of the alignment stage. Coupled with SUSS MicroTec‘s DirectAlign® accuracies down to 0.25μm can be achieved. Auto Alignment enables highest repeatability of process results coupled with optimized throughput and minimum operator intervention. Available for: Automated Mask Aligner MA300 Gen2 MA200 Gen3 MA100/150e Gen2 Semi-Automated Mask Aligner MA/BA Gen4 Pro Series MA/BA Gen4 Series Exposure Lab Simulation Software Source Mask Optimization UV-LED Light Source Simulation of lithographic processes A simulation of lithographic processes makes the selection of optimal settings for process parameters possible without long-winded trial and error sessions. The multi-functional simulation software of lithographic processes “Lab”, which SUSS MicroTec distributes together with the supplier, GenISys, first and foremost allows the operator better process control. It offers all the required simulation functionality for an integrated design and process development, as well as verification and optimization. At the same time it covers all the process steps from illumination shaping and mask layout optimization up to photo resist processing. Additionally, modern 3D simulation functions improve the model visualizations. The combination of MO Exposure Optics and the for SUSS optics custom-developed optical models in Lab facilitates customer-specific design optimization of the exposure filter plates, which in turn leads to an improvement in pattern fidelity. Highlights Complete simulation of the mask aligner lithographic process Adjustable illumination parameters (collimation, spectral composition), custom-developed for all SUSS optics Fast and flexible visualization and quantitative predictions in 1, 2 and 3D Available for: Automated Mask Aligner MA300 Gen2 MA200 Gen3 MA100/150e Gen2 Semi-Automated Mask Aligner MA/BA Gen4 Pro Series MA/BA Gen4 Series MA12 Manual Mask Aligner MJB4 Nanoimprint Lithography Imprint Lithography SMILE Stamp Fabrication Imprint lithography represents a cost-effective and highly reliable means of transferring three-dimensional nano- or micro-scale patterns onto a wide variety of substrates. For the imprint, a stamp is brought into contact with a photosensitive material on the substrate. The photoresist fills out the three-dimensional pattern of the stamp and then solidifies under UV light. Parameters such as pattern topography, structure resolution and aspect ratio have a considerable influence on the process quality. Thanks to its compatibility to well-established semiconductor processes, imprint lithography plays a key role in the development and production of DFB lasers, HB LEDs, wafer-level cameras and MEMS. SUSS MicroTec solutions for imprint lithography are based on manual mask aligner platforms and support a wide range of materials and substrate with sizes up to 200 mm. Furthermore, SUSS platforms provide the capability of aligning and levelling stamps to substrates, as required by many imprint applications. Imprint equipment can also be retrofitted to SUSS mask aligners which are already in the field. Depending on process requirements, SUSS MicroTec offers different imprint technologies on its mask aligners. Imprint Lithography Brochure Imprint Lithography Webpage Available for: Semi-Automated Mask Aligner MA/BA Gen4 Pro Series MA/BA Gen4 Series MA8 Gen5 Mask-Aligner Manual Mask Aligner MJB4 Bonding UV Bonding Bond Alignment Fusion Bonding Tooling for bonding of two substrates in the mask aligner. Available for: Semi-Automated Mask Aligner MA/BA Gen4 Pro Series MA/BA Gen4 Series Downloads MA8 Gen 5 Datasheet SUSS Product Portfolio SÜSS MICROTEC SE Schleissheimer Str. 90 85748 Garching Germany +49 89 32007-0 +49 89 444433-422 CONTACT FORM PRODUCTS AND SOLUTIONS Coater & Developer Inkjet Printing Mask Aligner Wafer Bonder Photomask Equipment Imprint Lithography SUSS Imprint Excellence Center Micro-Optics Remanufactured Equipment Customer Service Training Process Technologies COMPANY Organization Research & Development Quality Management Purchasing Events Customer Magazine INVESTOR RELATIONS Investor Relations Corporate Governance Share Shareholders’ Meeting 2021 Publications IR Contact CAREERS Careers Who we are What we offer Professionals FAQs Open Positions Young Professionals NEWS Corporate News Investor Relations News Image Archive I read the terms and accept it. SEND © 2021 SÜSS MicroTec SE | Imprint | Privacy Policy | Terms of Use | Terms & Conditions