Careers Investor Relations News EN PRODUCTS & SOLUTIONS COMPANY CONTACT MA100/150E GEN2 DETAILS OPTIONS DOWNLOADS PUBLICATIONS MA100/150e Gen2 Mask Aligner Dedicated Mask Aligner Solution for High Volume Production of Compound Semiconductors Devices With the MA100/150e Gen2 SUSS MicroTec has designed a dedicated mask aligner platform for processing high brightness LEDs (HB-LED) on substrates up to 150 mm. With its high precision mask alignment, sophisticated substrate handling for fragile, warped and transparent wafers and its high resolution down to 0.7 µm the MA100/150e Gen2 is able to overcome all lithography challenges given by the LED manufacturing process. Lowest cost of ownership is achieved by superior throughput performance. Highlights Dedicated Mask Aligner Solution for HB-LEDs, Power Devices, RF-MEMS etc. Simultaneous handling of 3 wafers allows > 145 wph. incl auto-alignment and exposure Proximity printing for challenging resolution requirements (down to 3 µm L/S at 20 µm exposure gap in thin resist on 100 mm wafer) Multi-size tooling minimizes time required for wafer size changes Non-contact pre-alignment avoids wafer damages The 'Line Alignment' function for sapphire wafers aligns scribe lines precisely to the photo mask Based on SUSS MicroTec's production proven mask aligner design the MA100/150e Gen2 enables exceptional process scalability and fast time-to-market for new device designs, while the industry leading throughput of 145 wafers per hour reduces cycle time. The MA100/150e Gen2 is optimized for wafers sizes up to 6". The system reliably achieves an alignment accuracy of < ±0.7 µm (DirectAlign). Bottom-side alignment (BSA) is optionally available offering an alignment accuracy of < ±1.5 µm. The alignment unit of the MA100/150e is tailored to the specific requirements of LED manufacturing, offering excellent contrast even on transparent and textured wafers. For applications using scribe lines the new 'Line Alignment' function allows precise alignment of prescribed sapphire wafers to the photo mask without need of traditional wafer targets. Details : Alignment Top-side alignment (TSA) Bottom-side alignment (BSA) Infrared alignment (IR) DirectAlign® Where lithographic processes require the alignment of structures on only one side of the device wafer (e.g. RDL, microbumping and similar techniques), top-side alignment is used to align the fiducials on the mask with those of the wafer. Depending on substrate properties, this can be achieved either using stored position data for the wafer or through live image alignment, as in the DirectAligntm system invented at SUSS MicroTec. Highlights Mask aligner for the highest level of alignment precision Clear and stable pattern recognition even under poor constrast conditions Available for: Automated Mask Aligner MA300 Gen2 MA200 Gen3 MA100/150e Gen2 Semi-Automated Mask Aligner MA/BA Gen4 Pro Series MA/BA Gen4 Series MA12 Manual Mask Aligner MJB4 Details : Exposure Proximity Lithography Soft Contact Exposure Hard Contact Exposure Vacuum Contact Exposure A mask with a certain structure is aligned with the wafer in very close proximity (thus “proximity” lithography). During exposure, the shadow cast by the mask structure is transferred to the wafer. The resulting exposure quality depends on both the precision with which the mask and wafer are spaced apart and the optical system used for exposure. Being fast and suited to flexible implementation, this method is regarded as the most cost-effective technique for producing microstructures down to 3 µm in size. With contact exposure, resolutions in the sub-micron range can be achieved. Typical areas of use include wafer-level chip-scale packaging, flip chip packaging, bumping, MEMS, LED and power devices. The systems are deployed in high-volume production as well as in industrial research. The mask aligners supplied by SUSS MicroTec are based on proximity lithography. Features & Benefits Superior resolution as a result of diffraction-reducing optics Process stability through the use of microlens optical systems Available for: Automated Mask Aligner MA300 Gen2 MA200 Gen3 MA100/150e Gen2 Semi-Automated Mask Aligner MA/BA Gen4 Pro Series MA/BA Gen4 Series MA12 Manual Mask Aligner MJB4 Details : Exposure Optics MO Exposure Optics® HR and LGO optics Diffraction-Reducing Optics UV-LED light source MO Exposure Optics® is a unique illumination optics specifically designed for SUSS mask aligners. It is based on micro-lens plates instead of macroscopic lens assemblies. A simple plug & play changeover allows for a quick and easy changeover between different angular settings including the functionality of both classical SUSS HR and LGO illumination optics. The telecentric illumination which is provided by the MO Exposure Optics improves light uniformity and leads to a larger process window. In consequence, this causes yield enhancements. MO Exposure Optics also decouples the exposure light from the lamp source thus small misalignments of the lamp do not affect the light uniformity. A decoupled light source saves setup and maintenance time and guarantees uniform illumination conditions during the full life-time of the lamp. Highlights Excellent light uniformity over full exposure field Stable light source Customizable illumination by means of illumination filter plate exchange "DUV-ready" process capabilities with fused silica micro optics Special "down-sizing kits" for light compression to smaller wafer sizes Available for: Automated Mask Aligner MA200 Gen3 MA100/150e Gen2 Semi-Automated Mask Aligner MA/BA Gen4 Pro Series MA/BA Gen4 Series MA12 Manual Mask Aligner MJB4 Details : Automation Auto Alignment Wedge Error Compensation (WEC) Auto Alignment is based on a motorized alignment stage. The COGNEX® based pattern recognition software automatically recognizes wafer target locations and controls the movement of the alignment stage. Coupled with SUSS MicroTec‘s DirectAlign® accuracies down to 0.25μm can be achieved. Auto Alignment enables highest repeatability of process results coupled with optimized throughput and minimum operator intervention. Available for: Automated Mask Aligner MA300 Gen2 MA200 Gen3 MA100/150e Gen2 Semi-Automated Mask Aligner MA/BA Gen4 Pro Series MA/BA Gen4 Series Alignment ThermAlign® Large Clearfield Alignment Enhanced Alignment Overlay accuracy regularly suffers considerable degradation due to the thermal run-out between photomask and the wafer. The SUSS MicroTec compensation system ThermAlign® ensures a constant temperature on the wafer chuck and additionally provides a stabilizing influence on the mask temperature. ThermAlign® compensates for run-out effects by adapting the temperature to the process conditions. Available for: Automated Mask Aligner MA300 Gen2 MA200 Gen3 MA100/150e Gen2 Exposure Lab Simulation Software Source Mask Optimization Simulation of lithographic processes A simulation of lithographic processes makes the selection of optimal settings for process parameters possible without long-winded trial and error sessions. The multi-functional simulation software of lithographic processes “Lab”, which SUSS MicroTec distributes together with the supplier, GenISys, first and foremost allows the operator better process control. It offers all the required simulation functionality for an integrated design and process development, as well as verification and optimization. At the same time it covers all the process steps from illumination shaping and mask layout optimization up to photo resist processing. Additionally, modern 3D simulation functions improve the model visualizations. The combination of MO Exposure Optics and the for SUSS optics custom-developed optical models in Lab facilitates customer-specific design optimization of the exposure filter plates, which in turn leads to an improvement in pattern fidelity. Highlights Complete simulation of the mask aligner lithographic process Adjustable illumination parameters (collimation, spectral composition), custom-developed for all SUSS optics Fast and flexible visualization and quantitative predictions in 1, 2 and 3D Available for: Automated Mask Aligner MA300 Gen2 MA200 Gen3 MA100/150e Gen2 Semi-Automated Mask Aligner MA/BA Gen4 Pro Series MA/BA Gen4 Series MA12 Manual Mask Aligner MJB4 Others Wafer Handling Toolings Handling Fragile and Bent Substrates Handling wafers is the major challenge when automating production processes. In a production environment with high process change rates and therefore a large number of different substrates, for example in foundry production, the handling systems have to meet rapidly changing requirements. The reliability of the automatic handling has a direct effect on through-put and yield. SUSS mask aligners have a choice of flexibly interchangeable special tooling for handling the widest range of fragile, bent or warped substrates, and the tooling can be customized even further for particularly arduous production processes according to customer specifications. Handling of Thinned Wafers A special vacuum chuck supports ultra-thin wafers with thicknesses of less than 120 µm and down to 50 µm. Handling of Warped Wafers Bent and warped wafers are carefully pulled flat before alignment and exposure. Due to the variety of the parameters that affect it, an optimal tooling implementation requires adaptation for the specific substrate. Edge Handling A special carrier system protects the wafer, especially suitable for the protection of double-sided structures as for MEMS applications. Available for: Automated Mask Aligner MA300 Gen2 MA200 Gen3 MA100/150e Gen2 Downloads MA100/150e Gen2 Datasheet SUSS Product Portfolio Publications Auto-Alignment Insights - Part 1 Auto-Alignment Insights — Part 2: Case Studies Reduction of Proximity Induced Corner Artifacts by Simulation Supported Process Optimization SHOW MORE SÜSS MICROTEC SE Schleissheimer Str. 90 85748 Garching Germany +49 89 32007-0 +49 89 444433-422 CONTACT FORM PRODUCTS AND SOLUTIONS Coater & Developer Inkjet Printing Mask Aligner Wafer Bonder Photomask Equipment Imprint Lithography SUSS Imprint Excellence Center Micro-Optics Remanufactured Equipment Customer Service Training Process Technologies COMPANY Organization Research & Development Quality Management Purchasing Events Customer Magazine INVESTOR RELATIONS Investor Relations Corporate Governance Share Shareholders’ Meeting 2021 Publications IR Contact CAREERS Careers Who we are What we offer Professionals FAQs Open Positions Young Professionals NEWS Corporate News Investor Relations News Image Archive I read the terms and accept it. SEND © 2021 SÜSS MicroTec SE | Imprint | Privacy Policy | Terms of Use | Terms & Conditions