BACK TO ALL CAPABILITIES MICROELECTRONICS ASSEMBLY In-market. On-time. On-budget. That’s the Intricon advantage. Decades of experience in microelectronics design and assembly combined with a focus on joint development manufacturing give you every advantage. Our engineers can guide your designs to ensure the highest performance and manufacturability. Then we use our state-of-the-art high-speed surface mount technology (SMT) pick-and-place machines to populate your flex circuits or printed circuit boards. If you have a need for ball bonding or wedge bonding, we have you covered with in-house capabilities for both technologies. Automated computer-controlled testing equipment is used to download your programs and perform electrical testing to verify that all requirements are met. Both proprietary automation equipment and skilled hand assembly are available at our facilities in the United States, Singapore, and Indonesia. For the latest in microelectronic subassemblies and devices, Intricon can help you improve performance, provide higher yields and improve the cost structure of the manufacturing process. ABOUT TECHNICAL CAPABILITIES DEVICE PLATFORMS SUPPORT OPPORTUNITIES INVESTORS CONTACT HEADQUARTERS 1260 Red Fox Road Arden Hills, MN 55112 UNITED STATES Vadnais Heights, MN Arden Hills, MN (2 sites) DeKalb, IL Riverside, CA ASIA Singapore Batam, Indonesia EUROPE Freising, Germany QUESTIONS/COMMENT 651.636.9770 ©2021 Intricon Corporation – All rights reserved. | Privacy Policy | Terms of Use We use cookies to ensure that we give you the best experience on our website. If you continue to use this site we will assume that you are happy with it. Ok