About Products Services & Support Supply Partners Press Room Contact Us Hakuto Film Lamination Home » Products » Equipment » Hakuto Film Lamination Next Generation Auto Film Laminator From the beginning of the PCB manufacturing industry in the early 1950’s, printed circuit board dry film lamination has been implemented by applying pressure to the end shafts of heated rubber rollers. The mechanical physics as shown demonstrates how there is uneven pressure across the surface of the film lamination with increasing lower pressure and lower heat toward the center of the board. As electronic circuit packages became miniaturized, their connection leads moved to 50 mil pitch and smaller – requiring the resulting PCB traces and spaces to reach sub 0.005″ size. This uneven pressure phenomenon across the surface of the PCB can ultimately cause faulty image transfer resulting in open circuit defects on the final etched layer further resulting in an entire panel being scrapped. To deal with this new dry film precision requirement (sub 5 mil features), the industry has tried many modifications; heavy duty rolls, cantilevered pressures mechanisms, and wet lamination. The uneven pressure situation has now been solved by utilizing a new mechanical concept whereby a heavy barrel type roller transfers pressure onto a common rubber roller with remarkable consistency for both pressure and temperature. FOR MORE INFO, CONTACT Fred Long fred@matrixelectronics.com Mobile (416) 569-8800 Supply Partner: Hakuto FEATURES Easy Lamination Roll Exchange Easy Maintenance New Pressure and Temperature Uniformity Module New Enclosure for Clean Operation ECO Take-up Roll for Easy Mylar Removal Touch-screeen PLC Panel Control LAMINATOR FEATURES AND OPTIONS Mach 630Np Mach 660Np Easy Lamination Roll Exchange S S Easy Maintenance S S EVEN Pressure Uniformity Module S S EVEN Temperature Uniformity Module S S Full Enclosure for Clean Operation S S Touch Screen PLC Control S S ECO Take-up Roll for Easy Mylar Removal S S Cartridge Film Loading System O S Exit Panel Temperature Monitoring O S Dry Film Usage and End Warning Indicators O S Ultra Thin Transport O O Mach Prolog Software (Custom Request) O O S = Standard Feature | O = Optional Feature RESOURCES Hakuto 630NP/6630NP Brochure PDF, 649 KB Supplier to the North American Circuit Board Industry since 1977 Call us at 1-800-668-5447 Toronto 1124 Midway Boulevard, Mississauga, ON L5T 2C1 Phone (905) 670-8400 Fax (905) 670-8420 Santa Ana 2730 S Main Street, Santa Ana, CA 92707 Phone (714) 825-0404 Fax (714) 825-0406 Santa Clara 3261 Edward Avenue, Santa Clara, CA 95054 Phone (408) 477-2963 Fax (408) 564-7047 Chicago 770 Creel Drive, Wood Dale, IL 60191 Phone (630) 475-8753 Connect with us! Corporate Responsibility Terms & Conditions Copyright © 2021 Matrix USA Inc. All rights reserved. All trademarks are the property of their respective owners.