IC MANUFACTURING COMPOUND SEMICONDUCTORS WAFER LEVEL PACKAGING TECH PAPERS COMPANY INVESTORS CONTACT Furnace Systems—Ultra Fn For advanced dry processing applications High-performance batch processing of 300mm wafers Part of ACM’s Ultra family of advanced wafer processing systems, the Ultra Furnace platform addresses dry processing challenges of low-pressure chemical vapor deposition (LPCVD), atomic layer deposition (ALD), oxidation and annealing. The Ultra Furnace was designed from the ground up to meet best-in-class requirements. Its innovative design combines ACM’s proven software technology with new hardware that improves durability and reliability, as well as ACM’s proprietary process-control IP. Ultra Furnace provides rapid, stable process control During deposition and diffusion, process gases are injected into the furnace chamber under high-temperature and high-vacuum conditions and then diffused into a low-pressure space to form a thin silicon oxide or nitride film on the wafer surface. Because today’s devices are designed with complex, fine geometries, providing consistent and stable heat control is paramount in maintaining wafer integrity. This is why the heater is the most critical component in a furnace. To address these demands, the Ultra Furnace heater features a proprietary control algorithm, which provides stable control of temperature, pressure and gas flow rate. Ultra Furnace Applications The Ultra Furnace meets drying requirements for key applications, including: LPCVD Polysilicon High-temperature oxide (HTO) Silicon nitride (SiN) Diffusion Oxidation Annealing ALD Oxide SiN Major Benefits Superior process control Because of its inventive hardware design and proprietary algorithm, the Ultra Furnace delivers superior temperature and pressure control, ensuring the stability of the reaction process that takes place inside the chamber. Flexible While the Ultra Furnace system is configured for LPCVD processes, the tool can be easily and efficiently customized for other deposition and diffusion applications through minor component and layout changes. Cost-effective Through its proprietary algorithm for temperature and pressure control, the Ultra Furnace ensures that today’s advanced devices with fine geometries are protected, improving throughput and yield to deliver a low cost of ownership. Features & Specifications Batch processing of up to 100 wafers 300mm wafer compatibility Quick ramping control heater keeps the temperature within two limits from the bottom to the top of the heating unit, allowing for precise, consistent temperature control across the entire heating chamber Four loadports – two automated, two manual Loading area O2 control IGS gas supply system In situ dry cleaning system SEMI standard Five-unit configuration: Boat unit Reactor unit Gas supply unit Vacuum unit Wafer transfer unit Interested in Ultra™ Furnace Systems? Contact Us News © 2021 ACM Research, Inc.. All rights reserved.