News/Events Investors Career Tools My X-FAB Contact Search ABOUT US MARKETS TECHNOLOGY MANUFACTURING DESIGN SUPPORT Manufacturing excellence to make your innovations come to life VALUE CHAIN PROCESSES & CAPABILITIES RELATED NEWS Manufacturing Solutions X-FAB has an established track record of over 25 years of experience providing proprietary manufacturing processes and advanced design and engineering support offerings. Excellent service, reliability and first-class technical support – that’s what X-FAB stands for. X-FAB group operates six wafer manufacturing sites in Germany, France, Malaysia, and the United States, with aggregate production capacity of approximately 100,000 wafer starts per month (8-inch equivalent). We are relentlessly improving our manufacturing processes for robust quality, highest efficiency and speed of operational execution. Our goal: Deliver on time all the time. DIRK DRESCHER, VP OPERATIONS, X-FAB GROUP The foundry in the semiconductor value chain X-FAB manufactures analog/mixed-signal ICs utilizing proprietary process technologies. As a pure-play foundry X-FAB does not have its own IC products, but manufactures them based on designs created by its customers or third parties in cooperation and mostly based on X-FAB’s portfolio of modular, highly specialized proprietary process technologies and IP. Manufacturing processes and capabilities A modular approach allows customers to choose from a wide range of enhanced options across many semiconductor technologies, designs and processes including complementary metal-oxide semiconductor (CMOS), silicon on insulator (SOI), silicon carbide (SiC) and micro-electro-mechanical systems (MEMS). Customers can draw on a variety of features in order to develop ICs specifically tailored to their end-use requirements and to optimize product performance, product size, power consumption, and other parameters. Currently, we offer foundry process technologies with feature sizes of 1.0 μm, 0.8 μm, and 0.6 μm on 150 mm wafers and 0.6 μm, 350 nm, 250 nm, 180 nm, and 130 nm on 200 mm wafers. TECHNOLOGY OVERVIEW FAB OVERVIEW Related news Sep 14, 2021 LIGENTEC and X-FAB collaboration creates Europe’s largest capacity foundry service for integrated photonic circuits Strategic partnership will address rapidly growing demand across a broad range of industry sectors READ MORE Sep 07, 2021 X-FAB Becomes First Foundry to Offer High-Volume Micro-Transfer Printing Capabilities Following Licensing Agreement with X-Celeprint Long-term collaboration, plus major engineering investment, leads to highly cost-effective, scalable, and convenient methodology for heterogeneous integration of different… READ MORE Mar 19, 2020 X-FAB Further Expands its SiC Capacity and Adds New In-House Epitaxy Capabilities Positioning itself as the first foundry to offer high-volume manufacturing so that rapidly growing SiC demands can be met READ MORE MORE NEWS Contact For more information, please contact us: NAME* E-MAIL* MESSAGE* By submitting the form you agree to our privacy policy. I agree to my data being stored and processed by X-FAB. RECAPTCHA send message ABOUT US News & Events Investors Career MARKETS Automotive Medical Industrial Communication & Consumer TECHNOLOGY High Voltage e-NVM CMOS & MEMS Sensors RF SiC & GaN WLP & 3D Integration Silicon-based Microfluidics Innovation MANUFACTURING Our Fabs Supply Chain Management Quality Prototyping Outsourcing DESIGN SUPPORT FeatureXplorer ResourceXplorer X-CHAIN IP Portal My X-FAB Login MPW Schedule Sitemap Imprint Privacy Statement © 2021 X-FAB Silicon Foundries SE COOKIE SETTINGS We use cookies and other tracking technologies to personalize and improve your experience. By continuing to use our website you consent to this. More info Necessary cookies Statistics SELECT ALL SAVE Show details Imprint | Datapolicy