Careers Investor Relations News EN PRODUCTS & SOLUTIONS COMPANY CONTACT DSC300 GEN3 DETAILS OPTIONS DOWNLOADS DSC300 Gen3 Projection Scanner The High-Throughput Alternative to 1X Steppers SUSS MicroTec introduces its next generation projection scanner – the DSC300 Gen3. This proprietary scanning lithography platform best-in-class throughput with fine (< 2 μm) resolution capabilities at the lowest cost of ownership among 1X projection lithography systems. The flexible DSC300 Gen3 Bridge-Tool for 200 mm and 300 mm wafers was re-engineered for higher performance and minimized overhead time. The DSC300 Gen3 Scanner delivers a 300 mm wafer throughput of more than 90 wph at 400 mJ/cm² and >80 wph at 1000 mJ/cm² dose. Its enhanced 1X Wynne-Dyson optics and four recipe-selectable numerical apertures (NA’s) enable the achievement of fine 2 μm features in thin resist, as well as >100 µm DoF in thick resist. The full-field imaging technology of the DSC300 Gen3 supports industry roadmaps for large die patterning and mixed die packaging for heterogeneous integration. In addition, fan-out wafer-level packaging applications can benefit from its optical die-shift compensation option. This latest die-shift and run-in/run-out mitigation feature corrects for up to ± 200 ppm (30 µm on a 300 mm diameter wafer). With the projection scanner DSC300 Gen3, SUSS MicroTec offers a complementary technology to its mask aligner portfolio and a lowest cost of ownership alternative for traditional projection stepper lithography. Highlights High throughput of > 90 wph for 300 mm wafers at 400 mJ/cm² dose Lowest CoO among 1X projection lithography tools Same 2 µm resolution as 1X UV stepper lithography tools ≤ 1.0 µm overlay (mean + 3 σ) Full-field large-die patterning without stitching ± 200 ppm optical die-shift compensation for FOWLP The Alternative to 1X Steppers Traditional 1X stepper lithography tools waste an excessive amount of time to ramp up stage speed, decelerate stage speed, then stop and settle. Multiply that wasted time for 50~70 shots and the resulting throughput is rather low. Comparatively, the DSC300 Gen3 is exceptionally fast with its proprietary smooth, continuous serpentine scanning technique – no stops to waste time. The highly uniform beam with its well controlled projection area insures that the features all the way out at the edges of the wafer get the same uniform dose as the inner wafer. In addition, the beam overlaps itself by 50% on each scan pass to further average the dose across the entire wafer. Prior to each scan exposure, the system measures the UV intensity and controls the stage velocity to provide the intended UV dose programmed into the recipe. The scanned light uniformity across the entire wafer is ≥ 97% (≤ 3% non-uniformity). Features & Benefits Uses easy to design full-field masks (non-inverted) Best pattern and position replication Superior technique for large-die and heterogeneous integration No step-field size limitations – no stitching Fast exposure times with good uniformity High Throughput The DSC300 Gen3 Projection Scanner elevates 1X projection lithography throughput to new heights – achieving triple digit levels for low doses (more than 90 wph for 300 mm wafers). An additional advantage to the DSC300 Gen3 is that the high throughput is stable for a specific UV dose no matter the pattern die size or wafer layout. Further, wafer edge exposure (WEE) and wafer edge protection (WEP) are handled by the full-field mask pattern and take no additional time. Drastically higher throughput compared to 1X steppers Throughput is not die-size, field-size or pattern dependent Details : Projection Optics Enhanced Wynne-Dyson Lens Beam Delivery System Contamination Protection The DSC300 Gen3 Projection Scanner is equipped with a Wynne-Dyson projection technology lens for outstanding imaging performance. This is the same type of lens that is used by several well-known 1X UV Stepper manufacturers, which is why the DSC300 Gen3 has the same imaging capabilities as these stepper litho tools (2 µm L/S in 2 µm resist). However, the SUSS Wynne Dyson Lens is a modified and enhanced version of this well-proven optics technology. Non-inverted imaging Mask pattern and wafer pattern are in the same orientation – easing mask design efforts DSC 300 Gen3 Enhancements Increased the selectable "fine resolution NA" to 0.15 from 0.14. Improved prism design, coatings, and closed-loop active prism cooling system for greater stability. Of course, the valuable lens elements are protected by nitrogen purging and a sacrificial window at the exit of the lens. Features & Benefits Enables the same imaging performance as 1X steppers, but with the much higher throughput of the projection scanner. Details : Focus-Level Height Measurement System Z-Axis Levelling The DSC300 Gen3 is equipped with three air gauge sensors to complete 3-point level measurements in the same time it takes for one. In addition, the air gauge sensor design was re-engineered for state-of-the-art accuracy and higher sensor longevity. Each sensor is routinely and automatically calibrated to the same reference source to maintain high precision measurements. Features & Benefits Higher throughput and lower cost of ownership Details : Handling Wafer/Substrate The standard DSC300 Gen3 is a bridge-tool for 200 mm and 300 mm wafers. The primary tool configuration is for automatic handling of 300 mm wafers (200 mm optional). Manual load/unload option available, along with other wafer and substrate sizes. Automated Wafer Handling (200 mm and 300 mm) The system includes an EFEM for 300 mm FOUPs with dual load ports, dual-arm robot, end-effectors, and pre-aligner (notch finder). For 200 mm wafer handling, either 200 mm FOUP inserts or 200 mm open cassette adapter boxes are available. Both SEMI wafers and bonded wafer pairs can be loaded. Warped Wafer Handling Standard and custom warped wafer solutions are available on the DSC300 Gen3 for up to a 2 mm bow. These solutions primarily consist of the proper choice of wafer chuck and robot end-effector designs. Optional Handling Please consult the factory regarding solutions for thin wafers, TAIKO wafers, smaller wafers (6”, 4”, 2”), and substrates (non-round, up to 310 x 310 mm). Features and Benefits Fast, safe, and reliable handling of wafers and substrates Flexible for size, type, and thickness Details : Others Optical Alignment Environment Control Unit (ECU) and HEPA Airflow SECS-II/GEM Interface The DSC300 Gen3 comes equipped with a state-of-the-art, sub-micron optical alignment system capable of 2-Target and 4-Target global alignment. Target locations can be anywhere on the wafer when using the 1-vision camera, but in fixed pitch locations when using the dual off-axis cameras. 300 mm Wafer Tools and 200 mm/300 mm Bridge Tools The system includes one on-axis (through-the-lens) vision camera and two off-axis, fixed-pitch, vision cameras for simultaneous 2-Target image capturing. This ensures for fastest throughput and SUSS MicroTec enhanced Cognex VisionPro® Pattern Recognition. Features & Benefits Combination on-axis and off-axis alignment system with sub-micron alignment capabilities. Others Dual Variable NA’s Optical Run-in/Run-out Control Optical Compensation The DSC300 Gen 3 is available with Dual Variable NA's to boost imaging optimization to the highest level possible. This optional feature adds four selectable projection lens numerical apertures (NAp: 0.15, 0.14, 0.10 & 0.07) to the system's existing four selectable condenser numerical apertures (NAc: 0.15, 0.14, 0.10 & 0.07). The ability to mix and match the two types of NA’s enables the greatest fine-tuning of their ratio to optimize sigma for the specific resist and process. Selectable NA Combinations Enable Balancing of Fine Resolution and High DoF Fine resolution (i.e. 2 µm) in thin resists Precision structuring in medium resists High aspect ratio patterning in thick resist (100~300 µm) Features & Benefits Greatest control over imaging performance and DoF among 1X projection lithography tools Downloads DSC300 Gen3 Data Sheet SUSS Product Portfolio SÜSS MICROTEC SE Schleissheimer Str. 90 85748 Garching Germany +49 89 32007-0 +49 89 444433-422 CONTACT FORM PRODUCTS AND SOLUTIONS Coater & Developer Inkjet Printing Mask Aligner Wafer Bonder Photomask Equipment Imprint Lithography SUSS Imprint Excellence Center Micro-Optics Remanufactured Equipment Customer Service Training Process Technologies COMPANY Organization Research & Development Quality Management Purchasing Events Customer Magazine INVESTOR RELATIONS Investor Relations Corporate Governance Share Shareholders’ Meeting 2021 Publications IR Contact CAREERS Careers Who we are What we offer Professionals FAQs Open Positions Young Professionals NEWS Corporate News Investor Relations News Image Archive I read the terms and accept it. 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