HPB-5C+ THE INDUSTRY STANDARD FOR BURN-IN OF HIGH POWER CIRCUITS The HPB-5C+ Burn-In with Test System meets the challenges created by wide variation in heat dissipation, and the diverse burn-in needs high-power VLSI devices. The active thermal control feature provided by the HPB-5C+ ensures that the proper thermal stress is applied to each device during the burn-in cycle. HPB-5C+ The Clear Choice for High-Power Device Burn-In FEATURES: Individual temperature control for each device up to 150 W Variable oven overflow control Individual pattern zone per burn-in board slot 32M vector memory standard, 64M optional Tests devices at a temperature of up to 150°C Up to 800 MHz clock rate 128 digital I/O channels per burn-in board System capacity of 384 devices under test with individual temperature control per device 16 programmable voltage regulators with 1080 amps of device under test power per burn-in board 8 high-current supplies (0-4 volts at up to 125 amps each) 8 low-current supplies (0-6 volts at up to 10 amps each) BENEFITS: Testing capabilities for high-power devices Ensures proper thermal stress for each device Measures device temperature more accurately Testing is more cost-effective due to greater system capacity resulting in higher throughputs Exercise and test high pin count devices or more parts in parallel Run large numbers of test vectors without time-consuming reloads Up to 16 different pattern zones with one burn-in board per zone Up to 2000 Watts of device under test power available per slot Translate and run device test programs Clock devices with built-in self-test (BIST) at high speed Flexibility to test complex devices Stores failure information without slowing down the test Test both logic and memory functions Flexible system protection control for more detailed reports of failure REQUEST LITERATURE ON THE HPB-5C+ LEARN MORE INVEST IN QUALITY CONTACT US 7956 Main Street NE Minneapolis, MN 55432, USA Burn-In with Test Systems +1 763-786-8750 +1 800-328-9923 Privacy Policy © Micro Control Company 2021