Main navigation Submenü DE EN SUPERIOR EFFIENCY, QUALITY, AND PROFITABILITY Breadcrumb Home / Card Systems & Passport Systems / Chip Module Production / PowerSeal - Chip Module Encapsulation Machine POWERSEAL - CHIP MODULE ENCAPSULATION MACHINE Automatic chip module encapsulation with unbeaten quality and highest throughput The PowerSeal sets new benchmarks for high-speed encapsulation of chip modules: extremely compact and powerful, with a throughput of up to 40,000 modules/hour using two 16-fold dispensing heads and UV LED curing technology. UV LED curing saves production cost by lower energy consumption and long LED lifetime without aging. The curing is much faster compared to standard UV discharge lamps and the start-up time is reduced by providing full power directly after switching on. This enables high-speed production with significantly lower cost per module, resulting in an unsurpassed value for money. Alternatively, the machine can also be equipped with UV discharge lamps or heating units. Diverse nozzle plates are available for the different module tape pitches. Thermal curing resins such as black epoxy can be processed optionally. Reliable process stations and automated inline quality control ensure highest quality at a minimum of cost per module. YOUR CONTACT PERSON: Daria Miroshnychenko Division Manager Sales Card & Passport Systems +49 36925 929322 d.miroshnychenko@ruhlamat.de Do you have any questions or would you like us to send you an offer? Then simply send us your request! Open CONTACT FORM FEATURES ADVANTAGES High-speed chip module encapsulation with up to 40,000 modules/hour The flexible machine design and the powerful software allow different process modes such as fill, dam & fill, or fill & fill Various solutions for curing of the cast resin can be integrated, such as UV discharge lamps, heating units, or power saving UV LEDs The use of UV LEDs is environmentally friendly because they produce much less heat and no ozone compared to UV discharge lamps Graphical user interface with touch screen for easy operation Easily accessible components, less wearing parts and the use of standard parts reduce the cost of service and maintenance Cast resin preparation for fill material can be done by an optionally available external preparation unit for mixing, evacuation and heating of special resins Small footprint APPLICATIONS RELATED PRODUCTS The for smart cards and RFID devices, based on parametric and functional testing, is an integral part in the production flow and quality assurance. GTL700 - Glue Tape Lamination System The GTL700 is a highly reliable and flexible system for glue tape lamination of chip module tapes in preparation for the hot melt implanting process. Zurück Weiter DOWNLOADS Module Solutions brochure You can see more downloads here. ruhlamat Germany ruhlamat GmbH OT Marksuhl Sonnenacker 2 99834 Gerstungen Germany Tel.: +49 36925 929-0 Fax: +49 36925 929-111 info@ruhlamat.de www.ruhlamat.de Main navigation Home Products Markets Technologies Service Company Karriere Rechtliches und Datenschutz Terms and Conditions Privacy Imprint Legal notice BACK TO TOP Copyright © 2021 ruhlamat GmbH - All rights reserved.