E-Bond Epoxies, Inc. Formulating User Friendly Epoxy Compounds For Over 60 Years Home Our Products Shop More 0 Home E-Bond 560 Low-Mod Gel -2 gallon kit $95.00 Price E-BOND 560 LOW-MOD is a 100% solids, solvent-free, two-component MOISTURE INSENSITIVE epoxy resin system. Has unique LOW-MODULUS OF ELASTICITY, which allows for variations in stress and temperature. With proper aggregate loading, it provides an epoxy mortar/concrete with a co-efficient of expansion very close to Portland-cement concrete. 560 Low- Mod Gel produces a gel-like consistency as a gap filling material for bonding irregular materials, concrete, wood, steel, etc. 560 Gel is also recommended to grout anchor bolts and set dowels. Mixed with salt-free, kiln-dried silica aggregate to produce a sag resistant mortar for overhead and vertical patching. E-BOND 560 LOW-MOD conforms to ASTM-C-881, Type III, Grade 3, Class B and C, AASHTO-M235-91 FEATURES: Easy mixing ratio of 1 to 1 for the two components Gel-like consistency Insensitive to moisture before, during and after cure Exterior epoxy mortar/concrete repair to resist thermal movement Provides excellent adhesion to most structural materials Fast setting; provides high early strength within 24 hours Low Temperature cures as low as 40°F(4oC) Zero VOC - Fully reactive, No low boiling constituents PURCHASE INCLUDES: 1 gal E-Bond 560 Part A 1 gal E-Bond 560 Part B Click Here for 560 Data Sheet Click Here for MSDS 560A Click Here for MSDS 560B For large project/quantity purchases please contact E-Bond for large quantity quote of material. Quantity Add to Cart E-Bond Epoxies, Inc. (877) 265-0011 501 NE 33rd St, Oakland Park, FL 33334, USA