English (EN) Services Contact Menu EV Group Technologies Technologies For nearly 40 years, EVG has provided industry-leading process technologies and solutions that have enabled innovations in advanced packaging, optics and photonics, sensors and bio-medical devices and applications. True to our Triple-i philosophy of “Invent”, “Innovate” and “Implement”, our core lithography, wafer bonding and metrology technologies enable manufacturers to develop the latest micro- and nanotechnology device breakthroughs, and then bring them into high-volume production, cost effectively and at high process yields. Core technologies MLE™ - Maskless Exposure Technology Moving beyond traditional mask-based lithoghraphy toward digital lithography technology Explore now Nanoimprint Lithography (NIL) - SmartNIL® A large-area soft UV-nanoimprint lithography process for high-volume manufacturing Explore now Wafer-Level Optics Market-leading WLO manufacturing portfolio, including step-and-repeat mastering, lens molding, nanoimprint lithography and stacking Explore now Optical Lithography The most complete technology portfolio, supporting a maximum range of requirements in optical lithography Explore now Resist Processing Resist processing technology together with patterning are the most repeated steps in semiconductor manufacturing Explore now Temporary Bonding and Debonding Temporary bonding and debonding enabling backside processing for 3D integration Explore now Eutectic Bonding Eutectic wafer bonding for reliable hermetic sealing Explore now Transient Liquid Phase (TLP) Bonding Low-temperature metal wafer bonding by Transient Liquid Phase (TLP) Explore now Anodic Bonding Anodic bonding for interlayer-free Si-glass bonding Explore now Metal Diffusion Bonding Metal diffusion bonding for precise interfaces and alignment Explore now Fusion and Hybrid Bonding Fusion and Hybrid Bonding for engineered substrates and 3D device integration Explore now Die-to-Wafer Fusion and Hybrid Bonding Collective and direct-placement die-to-wafer bonding Explore now ComBond® High-vacuum Wafer Bonding Technology A breakthrough technology driving the bonding of “anything on anything” enabling emerging and “beyond CMOS” device designs Explore now Metrology Process control and optimization for lithography and bonding Explore now EV Group Products Technologies Company Careers Social Media LinkedIn Facebook Twitter YouTube Join our newsletter We will send you updates on new products and technologies. Your Email Subscribe © 2021, EV Group (EVG) Imprint Privacy Policy Terms of use