Search 978-568-1330 HOME ABOUT PRODUCTS CAPABILITIES TECHNICAL DATA NEWS REQUEST A QUOTE CONTACT Centerline offers diamond machined edges, bevels, V grooves and chamfers per your specifications. Wafer Dicing / Diamond Sawing and Machining Centerline Technologies uses computerized diamond saws and CNC controlled surface grinders capable of scribing or dicing a variety of shaped parts up to .200” thick. Centerline can also provide diamond machined edges, bevels, V grooves and chamfers per your specifications. Request a Quote Technical Support Download Page as PDF Benefits of Dicing Substrates: Superior edge quality Optical alignment Tighter tolerances (accuracy +/-.0003'’ repeatability within .0001”) No heat effected zone No stress Cleaner environment Smaller cell sizes (.005” x .005”) Fully patterned substrates (subdivide with computer programmed auto recognition software) Thicknesses range from .003” - .200” thick Centerline Technologies will recommend the proper method of mounting your parts for processing depending on the part size, material thickness and required tolerances. This could be PVC, UV tape or mounted on glass. We strongly recommend that you contact your vendor of choice before layout of circuits to help provide the most economical and highest quality end product. Products Alumina BeO Aluminum Nitride Fused Silica/Quartz Sapphire Shop Our Store Capabilities Lapping Polishing Filled Via Planarity Diamond Sawing Laser Machining Specialty Processes Quality Control Small Quantities Technical Data Conversion Tool About Us Why Polish Substrates? Customers News Quality Control Careers Contact Centerline Technologies, LLC 577 Main Street Suite 270 Hudson, MA 01749 Call: 978-568-1330 Fax: 978-568-1334 End-to-End Encryption, Powered by Worldpay © 2021 Centerline Technologies

Search 978-568-1330 HOME ABOUT PRODUCTS CAPABILITIES TECHNICAL DATA NEWS REQUEST A QUOTE CONTACT Technical Support from Centerline Please Select Mr. Mrs. Ms. Dr. First Name* Last Name* Company Name Phone Number Fax Number Email* Message* Products Alumina BeO Aluminum Nitride Fused Silica/Quartz Sapphire Shop Our Store Capabilities Lapping Polishing Filled Via Planarity Diamond Sawing Laser Machining Specialty Processes Quality Control Small Quantities Technical Data Conversion Tool About Us Why Polish Substrates? Customers News Quality Control Careers Contact Centerline Technologies, LLC 577 Main Street Suite 270 Hudson, MA 01749 Call: 978-568-1330 Fax: 978-568-1334 End-to-End Encryption, Powered by Worldpay © 2021 Centerline Technologies