Your browser does not support HTML5 video. Home Semiconductor SEMICONDUCTOR SENSORS Speed Your Semiconductor Processes WaferSense® & ReticleSense® Wireless Measurement Devices SAVE TIME. TAKE A BREAK Speed your semiconductor processes with WaferSense and ReticleSense measurement devices. When you need the most efficient and effective measurement devices for semiconductor tool set-up and maintenance processes, count on CyberOptics, the global market leader in wireless semiconductor measurement devices for chamber gapping, leveling, wafer handoff teaching, vibration, airborne particle, relative humidity and resistance measurement. Semiconductor fabs and OEMs value the accuracy, precision and versatility of the WaferSense and ReticleSense measurement portfolio to enable improvements in fab yields and equipment uptime. Semiconductor Product Family Brochure Save Time & Expense Improve yields and increase tool uptime Increase throughput Reduce resource needs Speed equipment set-up, maintenance cycles, trouble-shooting, qualification and release to production Speed tool optimization, stabilization and standardization Streamline fab processes Establish repeatable and verifiable standards Most Efficient and Effective Since the wireless, Bluetooth® enabled and battery powered devices are wafer or reticle shaped, they can generally travel anywhere a wafer or reticle travels, providing optimal ease-of-use and access to locations that otherwise may be difficult or impossible to reach. Vacuum Compatible Calibrations can be done under closed-chamber process conditions with the vacuum compatible WaferSense and ReticleSense measurement devices. Intuitive Software Receive and record data in real-time on your laptop with CyberOptics easy-to-use software and count on accurate, precise, reliable and repeatable results that save time and expense compared to traditional or legacy methods. Application: ALL APPLICATION AUTOMATED HANDLING SYSTEMS - AMHS (8) PHOTO LITHOGRAPHY (8) CHEMICAL VAPOR DEPOSITION CVD, ALD (7) DIFFUSION / FURNACE (7) MICRO CONTAMINATION (7) RAPID THERMAL ANNEAL RTA, RTP (7) TEST AND INSPECTION (7) WET (CHEMICAL) ETCHING / PLASMA ETCH (7) ATOMIC LAYER DEPOSITION - ALD (6) DRY ETCH (6) ION IMPLANT (6) PLASMA VAPOR DEPOSITION - PVD (6) EPITAXY (5) METROLOGY (5) MODULE REPAIR (5) THERMAL OXIDATION / METALIZATION (5) CMP (4) ELECTROCHEMICAL DEPOSITION; ECD (1) EUVL (1) GAS SYSTEM (1) VACUUM SYSTEM (1) Type: ALL TYPES LEVELING (4) VIBRATION (4) PARTICLE (3) RELATIVE HUMIDITY (2) GAPPING (1) RESISTANCE (1) TEACHING (1) WaferSense® Auto Resistance Sensor™ (ARS) ARS Shorten equipment maintenance cycles with wafer-like 4-wire resistance sensor. Predict when a tool needs maintenance with quantitative analysis of measured mean resistance over time. Improve cell-to-cell process uniformity with objective and repeatable resistance measurement. Includes CyberSpectrum™ software. WaferSense® Auto Vibration and Leveling Sensor™ (AVLS3) AVLS3 Speed equipment qualification with wireless measurements. Shorten equipment maintenance cycles with thin and lightweight wafer-like form factor. Lower equipment maintenance expenses and enhance process uniformity with objectiv eand reproducible data. Includes CyberSpectrum™ Software WaferSense® Airborne Particle Sensor™ APS1, 2 & 3 Quickly monitors, identifies and enables troubleshooting of airborne particles down to 0.14um within semiconductor process equipment and automated material handling systems. Easily identifies when and where the particles originate and measures the effectiveness of cleaning adjustments and repairs in real-time. Includes CyberSpectrum™ software. WaferSense® Auto Multi Sensor™ AMS Speed equipment qualification with wireless measurements. Shorten equipment maintenance cycles with thin and lightweight wafer-like form factor. Lower equipment maintenance expenses and enhance process uniformity with objective and reproducible data. Includes CyberSpectrum™ software. WaferSense® Auto Gapping System™ (AGS) AGS Speeds non-contact gap measurements and parallelism adjustments under vacuum for semiconductor processes such as thin-film deposition, sputtering and etch. Improves uniformity, tool availability and repeatability. Includes CyberSpectrum™ software. WaferSense® Auto Vibration System™ (AVS) AVS Monitors 3-axis accelerations and vibration to enable yield improvements by maximizing acceleration and minimizing vibration. Records vibration data for easy comparison between past and present, as well as one tool to another, to reduce particles, maintenance time and cycle time. Includes CyberSpectrum™ software. WaferSense® Auto Teaching System™ (ATS) ATS “Sees” inside equipment to capture three dimensional offset data (x, y, and z) to quickly teach wafer transfer positions with accuracy to 100um. Improves yields and lowers particulate contamination with accurate wafer hand-off calibration, proper alignment and set ups. Includes CyberSpectrum™ software. WaferSense® Auto Leveling System 2 Vertical™ (ALS/ALS2V) ALS2V Speeds setting the right inclination by measuring pitch, roll, rise overrun and vertical inclinations. Quickly and accurately enables setting the same level across the tools for better process uniformity. Includes CyberSpectrum™ software. ReticleSense® Airborne Particle Sensor™ (APSR/APSRQ) APSR / APSRQ Quickly monitors, identifies and enables troubleshooting of airborne particles down to 0.14um within semiconductor process equipment and automated material handling systems. Easily identifies when and where the particles originate and measures the effectiveness of cleaning adjustments and repairs in real-time. Includes CyberSpectrum™ software. ReticleSense® Auto Multi Sensor™ (AMSR) AMSR Speed equipment qualification with wireless measurements. Shorten equipment maintenance cycles with reticle-like form factor. Lower equipment maintenance expenses and enhance process uniformity with objective and reproducible data. Includes CyberSpectrum™ software. In-line Particle Sensor™ (IPS™) IPS Speed equipment qualification with real-time 24/7 monitoring. Shorten equipment maintenance cycles with inline particle sensing. Lower equipment expenses with objective and reproducible data. Includes CyberSpectrum™ software. CyberSpectrum™ Software SOFTWARE FOR WAFERSENSE® • RETICLESENSE® • In-Line Particle Sensor™ CyberSpectrum is a powerful yet extremely simple software with an intuitive interface providing numerical and visual feedback for real-time measurement and analysis for multiple applications. WaferSense® SDK SOFTWARE DEVELOPMENT KIT The WaferSense Software Development Kit provides the Application Programming Interface (API) to the WaferSense® and ReticleSense® family of devices. This allows direct integration of the device into user developed software applications. WX3000™ Metrology and Inspection Systems for Wafer-Level and Advanced Packaging Powered by MRS™ Technology NanoResolution MRS™ Sensor Powered by MRS Technology NanoResolution MRS Sensor for Wafer-Level and Advanced Packaging Applications for OEM integration. SQ3000 CMM for Semiconductor Applications The Ultimate in Speed and Accuracy for Coordinate Measurement Applications - Seconds. Not Hours EX-Q Wafer Mapping Sensor A DRAMATIC STEP FORWARD IN WAFER DETECTION EX-QS Wafer Mapping Sensor GOOD THINGS DO COME IN SMALL PACKAGES Digital and Analog Frame Grabbers DEPENDABLE, QUICK SETUP MACHINE VISION COMPONENTS Solutions SMT Inspection Semiconductor Industrial Metrology MRS Technology Resources Downloads & Manuals WaferSense® & ReticleSense® Product Registration FAQ Company About Leadership Sustainability Sales Reps Statements & Policies Investors News Careers Support Contact CyberOptics © 2019-2021Terms of Use Privacy Policy We'll assume you're ok with this, but you can opt-out if you wish. Cookie settingsACCEPT