Careers Investor Relations News EN PRODUCTS & SOLUTIONS COMPANY CONTACT WAFER BONDER AUTOMATED SEMI-AUTOMATED TECHNOLOGIES Wafer Bonder SUSS MicroTec’s wafer bonding platforms combine over seventy years of microstructuring experience with solid product quality and a broad range of productivity features. Partnering with research, academia and material suppliers we develop intelligent bond solutions which offer leading-edge technology for our customers. Our wafer bonding platforms cover many different applications in 2.5D and 3D integration, MEMS, LED and power devices as well as other areas of research and development. Automated Wafer Bonder XBS200 Wafer Bonder Automated Platform for Wafer Sizes up to 200 mm XBC300 Gen2 Debonder & Cleaner Automated Platform for Wafer Sizes up to 300 mm XBS300 Temporary Bonder Universal Temporary Wafer Bonder for High Volume Manufacturing XBS300 Hybrid Bonding Platform Automated Platform for Wafer Sizes up to 300 mm Semi-Automated Wafer Bonder BA Gen4 Series Bond Aligner Manual Bond Aligner Wafer Sizes up to 8"/200 mm BA8 Gen4 Pro Bond Aligner High Precision Bond Aligner LD12 Debonder Semi-Automated Excimer Laser Debonder SB6/8 Gen2 Wafer Bonder Semi-automated Tool for Permanent Wafer Bonding of Wafers up to 8"/200 mm XB8 Wafer Bonder Universal High-Force Wafer Bonder Technologies Adhesive Anodic Eutectic Glass Frit Hybrid Metal Diffusion Slid General Information Adhesive Bonding A variety of materials are available for adhesive wafer bonding techniques utilizing polymers and adhesives, including epoxies, dry films, BCB, polyimides, and UV curable compounds. Highlight: Comparatively low temperature for protecting sensitive components Available for: Automated Bonder XBS200 Semi-Automated Bonder XB8 SB6/8 Gen2 SÜSS MICROTEC SE Schleissheimer Str. 90 85748 Garching Germany +49 89 32007-0 +49 89 444433-422 CONTACT FORM PRODUCTS AND SOLUTIONS Coater & Developer Inkjet Printing Mask Aligner Wafer Bonder Photomask Equipment Imprint Lithography SUSS Imprint Excellence Center Micro-Optics Remanufactured Equipment Customer Service Training Process Technologies COMPANY Organization Research & Development Quality Management Purchasing Events Customer Magazine INVESTOR RELATIONS Investor Relations Corporate Governance Share Shareholders’ Meeting 2021 Publications IR Contact CAREERS Careers Who we are What we offer Professionals FAQs Open Positions Young Professionals NEWS Corporate News Investor Relations News Image Archive I read the terms and accept it. SEND © 2021 SÜSS MicroTec SE | Imprint | Privacy Policy | Terms of Use | Terms & Conditions