DE EN IT FR 中文 Companies Products & Solutions Service & support equipment Career Contact CHIP CARD IC MODULE PRODUCTION Chip module encapsulation Tape inspection Molding Electrical Test & Pre-Perso ALL in ONE solution CARD BODY PRODUCTION CHIP CARD PRODUCTION CARD PERSONALIZATION & ISSUANCE SOFTWARE IC MODULE PRODUCTION Mühlbauer is the only one-stop technology partner who can offer the complete production line for the manufacture of IC modules. We offer high-quality, highly precise, state-of-the-art systems - starting with die bonding, in which the bare die is applied to the back of the modular belt, to wire bonding, potting, inspection and electrical testing of the finished modular belt. Our market-proven machine concept and the continuous further development of hardware and software allow us to claim that you are in good hands with one of the most competent suppliers of IC module production systems. Thanks to our extensive experience, we can offer an optimal consulting solution, from planning your production to sales and customer service and bring you together with all the leading companies in the IC module market - worldwide! Our flexible financing concepts offer a further incentive to choose Mühlbauer solutions. Die-bonding The bare die, also known as the die, is placed on the IC module tape (lead frame). Usually epoxy adhesives are used to fix the bare die to the back of the modular tape. The exact pick-up and deposit position of the bare die from the wafer is controlled by various image processing systems. After the chip has been applied, the epoxy resin is solidified in a subsequent thermal curing oven before the tape is finally rolled up. Wire bonding The contact surfaces of the chip are electrically connected to the contact surfaces of the tape by a gold wire approx. 30 µm thick. The wires are attached to the contact surfaces using the thermosonic bonding process. Shed Cast resin is applied here to protect the bare die and the exposed wires against mechanical and environmental influences. Typically a clear UV curable material or a black thermosetting material is used for the potting. Due to the high accuracy of this method, no further processing of the surface such as milling is necessary. Two different methods can be used for the dosing process itself: Dam & Fill or Glob-Top. In Dam & Fill mode, the first dosing head sets a dam to limit the area for the glob top. Then the second dosing head fills the area inside the dam. In glob-top mode, both dosing heads completely fill the entire module. Modular belt inspection Die vollautomatische optische Inspektion führt eine Dickenmessung durch und überprüft den Glob-Top und die Oberflächen. Die Ober- und/oder Unterseite des Bandes wird auf Schäden auf der Oberflächen geprüft, wie offene Drahtbrücken, Kratzer oder Fingerabdrücke, usw. Es ist sogar möglich eine elektrische Teststation zu integrieren, um komplett fertig gestellte Module zu erhalten, die versandfertig sind. Defekte Module sind deutlich durch ein gestanztes Ausschuss-Loch gekennzeichnet. Spritzgießen Dieser Herstellungsschritt wird üblicherweise für dreireihige Bänder für kontaktlose Karten, ID-Applikationen und ePässen verwendet. Das Multi-Einspritzsystem arbeitet mit einer elektromechanischen Presse. Der Prozess beinhaltet eine Off-Line-Reinigung, welche die produktive Klarzeit erhöht. Elektrischer Test & Vorpersonalisierung For a function test, the IC modules are electrically isolated and tested or even prepersonalized in a production step. Depending on the chip type (memory or microprocessor), complex test routines and parameter tests are carried out by the best test readers in their class. Defective modules are clearly marked with a punched hole. imprint Terms and Conditions Privacy policy © Mühlbauer Group 2015