EN Home Products Electronics Final finishing Final finishing Coping with the harsh environment of multiple Pb-free soldering with a complete line of final finishes for package substrates and PCBs Quick facts Highest global market share for final finishing Complete portfolio of final finishes Production proven lead free processing OEM relevant development Applications ENIG / ENEPIG EPAG Immersion Tin OSP Product portfolio Electroless Nickel / Immersion Gold (ENIG) Advanced ENIG using Aurotech® Plus Aurotech® Plus: An Atotech optimized ENIG process that is designed specifically with high end HDI manufacturing in mind. Dramatically reduced in nickel corrosion, minimized extraneous nickel plating and outstanding soldermask mask and base material compatibility, are all primary benefits. Whilst technically assured; Aurotech® Plus offers cost saving through extended lifetimes, excellent distribution and process control. Aurotech® HPE: An ENIG process developed especially for the high corrosion resistance requirements of mobile handset manufacturers. Its nickel layer with high phosphorous content provides significantly better protection versus an aggressive environment than conventional nickel layers with mid or low P-content. The process is qualified and in mass production for the world’s leading cellular phone fabricators. AuNic®: A drop-in process for existing standard ENIG lines. It consists of five main steps: cleaning, micro-etch, activation, electroless nickel and immersion Gold. The most distinguishable feature of AuNic® is the introduction of the additive AuNic® EN C, which is added for bath make-up and after idle times instead of performing dummy plating. Aurotech® Flex M: A mid phosphorous electroless nickel process that achieves market-leading bending performance due to the specifically engineered depositional characteristics. It reveals good results for both: ENIG and ENEPIG. A long lifetime at low loading factors underlines its outstanding properties for modern flex applications. Electroless Nickel / Electroless Palladium / Immersion Gold (ENEPIG) Electroless Palladium Autocatalytic Gold (EPAG) Immersion Tin Organic Solderable Finish (OSP) Featured products Aurotech® G-Bond A semi-autocatalytic Gold solution for highest bonding reliability Read more Aurotech® Plus An ENIG process solution designed exclusively for adv. HDI production Read more PallaBond® The future generation high end finish for fine line and high frequency applications Read more Stannatech® The market leading horizontal Immersion Tin process Read more Horizon Stannatech® 2000 The market leading immersion tin for the automotive industry, with over 10M m² being processed each year Stannatech® 2000 offers the unique combination of chemical process and state of the art equipment from a single pool of expertise. Stannatech® 2000 is mass production proven and is qualified by the leading automotive end users Stannatech® 2000 offers unequalled process control and m²/l production capacity by employing auxillary equipment: Crystallizer™ and ConStannic™ The experience gained from Stannatech® 2000 has facilitated the development of an i-Sn process for IC substrates and QFN production: Stannatech® IC and Stanna-Q® respectively Immersion tin is also a cost effective option for the emerging wearable market Read more “We offer the market final finishes that are systematically and statistically developed whilst reflecting the current requirement for technology based solutions. Specific cost and reliability requirements are all factored into our portfolio.” Gustavo Ramos Global Product Director Final Finishing at Atotech Germany Recent publications Designing a high performance electroless Nickel and Immersion Gold to maximize highest reliability The latest highest reliability requirements demand a high performance electroless nickel and immersion gold (HP ENIG). The new IPC specification 4552B has refocused the industry with reference to nickel corrosion. It could clearly be shown that HP ENIG is able to cope the demands of this spec. It adds further value through significantly better solderability than MP ENIG for similar gold layer thickness which can result in huge cost advantages for HP ENIG A great solder joint reliability performance especially after multiple reflow cycles, and improved aluminum wire bonding fracture modes contribute to its excellent performance. Finally, the amorphous structure as well as the electrochemically more noble behavior of the HP Ni reveals it as the best choice for exposure to corrosive media, either immersion Au baths and/or corrosive environment. 2018, PDF, 2,000 KB How detrimental production concerns related to solder mask residues can be countered by simple operational adaptations The soldermask application is one of the key considerations to ensure a successful application of a selective finish. The selective finish is the final chemical step of the PCB manufacturing process, this is when the panels are at their most valuable and are unfortunately not re-workable. Imperfections are not tolerated, even if they are wholly cosmetic. Quality issues often manifest themselves in the form of a ‘ping pong’ conversation between the fabricators, the soldermask suppliers and the selective finish suppliers. Without tangible evidence these discussions are difficult to resolve and the selective finish process is usually regarded as responsible. Soldermasks identified as ‘critical’ in the field, and through testing, have been tested using state of the art technology to assess whether performance markers could be found. 2017, PDF, 1,000 KB Electronics portfolio overview Surface treatment Desmear and metallization Electrolytic plating Leadframe and connector Semiconductor Equipment Contact Us Country Name Email By entering your email address, you agree that we will answer your request via email. Your message I have read the privacy policy and I agree to the data storage and use as described there. Products Electronics General Metal Finishing About us Company Innovation Management History Sustainability Environmental Social Corporate governance Careers Why join Jobs Investor relations Stock information Financial information Investor resources Media Press releases Tradeshows Technology updates Videos Webinars Global TechCenters Production Contact Follow us Atotech 2021Legal information & privacy policy We use cookies to ensure that we give you the best experience on our website. If you continue to use this site we will assume that you are happy with it.Ok