Search 978-568-1330 HOME ABOUT PRODUCTS CAPABILITIES TECHNICAL DATA NEWS REQUEST A QUOTE CONTACT We specialize in making filled via's co-planar with surface substrate. Filled Via Planarity Process Centerline Technologies utilizes its expertise in making filled via’s co-planar with the surface of the substrate. Depending on the height of the via protruding from the surface, Centerline Technologies will use a one or two step process to reduce the via height. We strongly recommend you establish the process considerations with Centerline Technologies before building the circuits, so we can provide you with a better finished product. Centerline Technologies will use its expertise in both lapping and polishing to maintain a flat and parallel surface on your finished substrates. Request a Quote Technical Support Download Page as PDF Considerations Before Filling Via’s: Thickness required of finished pieces Space between Via’s Surface finish on material Via height after fill It is very important to specify the starting thickness and flatness and parallelism of the substrate prior to filling via holes. Please be aware that materials machine at different rates and, therefore, it is strongly recommended that you contact your vendor of choice before purchasing substrates to be filled. This will help provide the most economical and highest quality end product. Products Alumina BeO Aluminum Nitride Fused Silica/Quartz Sapphire Shop Our Store Capabilities Lapping Polishing Filled Via Planarity Diamond Sawing Laser Machining Specialty Processes Quality Control Small Quantities Technical Data Conversion Tool About Us Why Polish Substrates? Customers News Quality Control Careers Contact Centerline Technologies, LLC 577 Main Street Suite 270 Hudson, MA 01749 Call: 978-568-1330 Fax: 978-568-1334 End-to-End Encryption, Powered by Worldpay © 2021 Centerline Technologies