Search 978-568-1330 HOME ABOUT PRODUCTS CAPABILITIES TECHNICAL DATA NEWS REQUEST A QUOTE CONTACT Centerline uses both mechanical and chemical mechanical process (CMP) to meet the polishing needs of our customers. Precision Polishing Capabilities Centerline Technologies is dedicated to providing the polishing of advanced materials to surface finishes and supplier quality levels that consistently meet or exceed our customer’s expectations. Advanced level polishing requires that appropriate abrasive and pre-lapping conditions be used to significantly reduce sub-surface damage. Centerline uses both mechanical and CMP (chemical mechanical process) depending on the customers requirements. We are constantly looking for ways to enhance the processes that we have already established, while maintaining careful process controls and qualifications. Industry standard materials polished are 99.6% Alumina, 96% Alumina, AlN, BeO, Sapphire, Fused Silica. Centerline polishes virtually any ferrous or non ferrous material. Centerline Technologies’ polishing process controls the surface finish and, combined with our lapping process, assures thickness identity and parallelism, as well as flatness of substrates. Our lapping and polishing processes are custom designed for each type of material and the physical dimensions required. Request a Quote Technical Support Download Page as PDF Why Polish substrates? - Understand the benefits of polishing substrates Die Level Lapping and Polishing - for parts as small as 7mm Material Surface Finish Thickness Tolerance Applications As-Fired 99.6% < 4 u-in +/- 10% or +/- 5% Use for low to medium power DC & RF circuits Polished 99.6% Alumina < 1 u-in +/- .0005" Use for low to medium power RF, Microwave, and Optical interconnects Polished 99.5% Beryllium Oxide < 3 u-in +/- .0005" Use for high power DC/RF/Microwave & Optical applications Polished Aluminum Nitride < 2 u-in +/- .0005" Use for higher power DC/RF/Microwave & Optical applications Polished Fused Silica < 1 u-in +/- .0005" Use for Optical or High Frequency interconnects requiring extremely low loss transmission performance Polished Titanates < 3 u-in +/- .0005" RF & Microwave devices requiring high Q performance Products Alumina BeO Aluminum Nitride Fused Silica/Quartz Sapphire Shop Our Store Capabilities Lapping Polishing Filled Via Planarity Diamond Sawing Laser Machining Specialty Processes Quality Control Small Quantities Technical Data Conversion Tool About Us Why Polish Substrates? Customers News Quality Control Careers Contact Centerline Technologies, LLC 577 Main Street Suite 270 Hudson, MA 01749 Call: 978-568-1330 Fax: 978-568-1334 End-to-End Encryption, Powered by Worldpay © 2021 Centerline Technologies