Contact now Welcome to our CCIT-Showroom Take your time and experience all about different leak testing methods (CCIT – Container Closure Integrity Testing) for your pharmaceutical packaging design: Here, your experts from Pfeiffer Vacuum provide you a wide range of information to learn more about the challenges of leak testing for IV bags, syringes, blister, plastic bottles, vials and other non-porous containers. With our leak test solutions we help you to overcome your challenges. Whether you need MALL testing for vials or other sealed packages, 100% production testing of IV bags or an integrated process control (IPC). All of our solutions comply with PDA regulation USP1207 and can be tailored to your needs. Please enjoy! |

Menü ausklappen HomeMarketsSemiconductorEtch & Clean Dry Stripping & Cleaning Dielectric Etch Conductor & Polysilicon Etch ALE Etch & Clean Manufacturing of a semiconductor component is a very complex process, involving many steps under vacuum. Dry etch process is one of them and consists of selectively removing a material on the wafer. This material can either be a conductor material, shaping the structure of the semiconductor component, or a dielectric material, insulating the conducting parts of the component. Strip & Clean processes are also used to remove selective materials from wafer surface, such as photoresist film and residues that could impact the device performance. Each technology requires a different level of vacuum. We provide high vacuum turbo pumps and primary dry pumps solutions dedicated to your Etch & Clean applications and designed for the lowest cost of ownership and highest process lifetime. Applications Dry Stripping & Cleaning Dielectric Etch Conductor & Polysilicon Etch ALE Social Networks: Newsletter Sitemap Data Protection Legal Notice General Terms and Conditions Newsletter Literature Ordering Downloads Contact Group Press Investor Relations Careers © 2021 Pfeiffer Vacuum GmbH