By continuing to browse this website, you accept the use of cookies. To have more information click here. × IPS optimized industrial technology is specifically designed to address the needs of high quality interconnect products for the electronic assembly and semiconductor packaging industries. Privately held, the company developed unique in-house ultrasonic atomization process to manufacture Solder Powder for Solder paste application and Solder Spheres to serve the semiconductor packaging industry. Links Legal mentions Cookies

By continuing to browse this website, you accept the use of cookies. To have more information click here. × Ips Research and developpement and innovation Solder powders Solder spheres Download Contact IPS Solder Spheres portfolio The IPS Solder Spheres portfolio covers all applications, from Plastic BGA (PBGA) to Fine pitch BGA (FBGA), Ceramic BGA (CBGA) and Chip Scale Packages (CSP) down to wafer bumping applications. Typical alloys are lead-free composition including the use of Ag, Cu, Sb… All alloy compositions comply with J-STD-006 standard. Alloy Examples Product specification MSDS Leaded alloys High lead alloys Sn10Pb90 SBPS1 SBMSDS1 Standard lead alloys Sn63Pb37 SBPS2 SBMSDS2 Sn62Pb36Ag2 SBPS3 SBMSDS2 Lead free alloys SAC (SnAgCu) Sn95,5Ag4Cu0,5* SBPS4 SBMSDS3 Sn96,5Ag3Cu0,5* SBPS5 SBMSDS3 Sn98,5Ag1Cu0,5 SBPS6 SBMSDS3 SAC (+ Ni) Sn98,5Ag1Cu0,5ND SBPS7 SBMSDS4 Size in mil Size in metric Tolerances Jar content 10 mil 250µm +/- 8 µm 2kk Samples available 12 mil 300µm +/- 10 µm 1kk FULL PRODUCTION 14 mil 350µm +/- 10 µm 1kk 16 mil 400µm +/- 10 µm 1,5kk 18 mil 450µm +/- 10 µm 1,5kk 20 mil 500µm +/- 20 µm 1kk 25mil and above 635µm and above +/- 25 µm 500kk under request Click on the link to download the PDF files *IPS is licensee of patent JP#3027441. Certain alloys may require prior approval from the patent owner. Solder Spheres portfolio Micro-Spheres Lead - Free Spheres IPS Spheres Offer Competitive Advantages Links Legal mentions Cookies