Careers Investor Relations News EN PRODUCTS & SOLUTIONS COMPANY CONTACT MA/BA GEN4 SERIES DETAILS OPTIONS DOWNLOADS PUBLICATIONS MA/BA Gen4-Serie Mask- und Bond-Aligner Compact Aligner Platform for Research and Low-Volume Production The MA/BA Gen4 series represents the latest generation of SUSS MicroTec’s semi-automated mask and bond aligner and introduces a new platform system. The two platform types differ in configuration, and consist of the MA/BA Gen4 for standard processes and the MA/BA Gen4 Pro series dedicated to advanced and high-end processes. The MA/BA Gen4 series is the entry-level model, available as MA/BA6 Gen4 and MA/BA8 Gen4. With its enhanced ergonomic and user-friendly design, cost efficiency and reduced footprint, it is the perfect tool for use in research and low-volume production. SUSS MicroTec’s MA/BA Gen4 series is setting a new benchmark in full-field lithography for academia, MEMS & NEMS, 3D integration and compound semiconductor markets. It is also prepared to handle processes like bond alignment, fusion bonding and SMILE imprinting. Processes developed on the MA/BA Gen4 series can be quickly transferred onto SUSS MicroTec‘s automated mask alignment platforms for high-volume production. Highlights Outstanding process results High user friendliness Low cost of ownership Enhanced ergonomics Small footprint Face-to-face microscopes Ideal process results through precision The MA/BA Gen4 series’ high degree of automation enables outstanding process results. Functions such as constant dose mode, an automated control unit for exposure time as well as auto alignment all help optimize process parameters. Additionally equipped with the high-grade MO Exposure Optics system, the MA/BA Gen4 series provides ideal exposure conditions and thus achieves top results. Sophisticated mechanical workings ensure high adjustment precision: a special design of the top- and bottom-side microscope unit (TSA and BSA) eliminates the long travel of the TSA microscope and the disturbing vibrations. High operating comfort Functions such as a highly ergonomic recipe editor and the sophisticated data logging or the ability to assign user rights simplify the operator’s work and simultaneously minimize sources of errors. The MA/BA Gen4 platform also makes use of high-grade digital microscopes and cameras, which significantly simplify the adjustment process thanks to enhanced image quality and an enlarged field of view on the monitor. Work safety and environmental protection The MA/BA Gen4 series can optionally be equipped with an energy-efficient LED light source, which not only reduces operating and maintenance costs, but improves work safety and environmental protection as well. This eliminates expensive hazardous waste disposal for mercury lamps. The machine offers further security features, such as UV radiation protection, safety interlocks and trap protection, thus fulfilling strict safety requirements. Cost effectiveness A major factor for the attractive cost of ownership of the MA/BA Gen4 series is that it has a small footprint and still offers a wide variety of processes. This includes operating and maintenance expenses, which can be reduced by such means as using an optional energy-efficient LED light source. The highly robust design, easy accessibility of operating elements and replaceable parts as well as the use of the LED light source and SUSS MicroTec’s MO Exposure Optics reduce maintenance expenses for the MA/BA Gen4 platform. Remote-controlled access to the machine can also be used to detect and rectify sources of errors in a cost-effective manner. Additional functions such as wafer-to-wafer adjustment, fusion bonding and imprint lithography can be added as optional upgrades. Details : Alignment Top-side alignment (TSA) Bottom-side alignment (BSA) Infrared alignment (IR) DirectAlign® Where lithographic processes require the alignment of structures on only one side of the device wafer (e.g. RDL, microbumping and similar techniques), top-side alignment is used to align the fiducials on the mask with those of the wafer. Depending on substrate properties, this can be achieved either using stored position data for the wafer or through live image alignment, as in the DirectAligntm system invented at SUSS MicroTec. Highlights Mask aligner for the highest level of alignment precision Clear and stable pattern recognition even under poor constrast conditions Available for: Automated Mask Aligner MA300 Gen2 MA200 Gen3 MA100/150e Gen2 Semi-Automated Mask Aligner MA/BA Gen4 Pro Series MA/BA Gen4 Series MA12 Manual Mask Aligner MJB4 Details : Exposure Proximity Lithography Soft Contact Exposure Hard Contact Exposure Vacuum Contact Exposure UV-LED light source A mask with a certain structure is aligned with the wafer in very close proximity (thus “proximity” lithography). During exposure, the shadow cast by the mask structure is transferred to the wafer. The resulting exposure quality depends on both the precision with which the mask and wafer are spaced apart and the optical system used for exposure. Being fast and suited to flexible implementation, this method is regarded as the most cost-effective technique for producing microstructures down to 3 µm in size. With contact exposure, resolutions in the sub-micron range can be achieved. Typical areas of use include wafer-level chip-scale packaging, flip chip packaging, bumping, MEMS, LED and power devices. The systems are deployed in high-volume production as well as in industrial research. The mask aligners supplied by SUSS MicroTec are based on proximity lithography. Features & Benefits Superior resolution as a result of diffraction-reducing optics Process stability through the use of microlens optical systems Available for: Automated Mask Aligner MA300 Gen2 MA200 Gen3 MA100/150e Gen2 Semi-Automated Mask Aligner MA/BA Gen4 Pro Series MA/BA Gen4 Series MA12 Manual Mask Aligner MJB4 Details : Exposure Optics MO Exposure Optics® Diffraction-Reducing Optics MO Exposure Optics® is a unique illumination optics specifically designed for SUSS mask aligners. It is based on micro-lens plates instead of macroscopic lens assemblies. A simple plug & play changeover allows for a quick and easy changeover between different angular settings including the functionality of both classical SUSS HR and LGO illumination optics. The telecentric illumination which is provided by the MO Exposure Optics improves light uniformity and leads to a larger process window. In consequence, this causes yield enhancements. MO Exposure Optics also decouples the exposure light from the lamp source thus small misalignments of the lamp do not affect the light uniformity. A decoupled light source saves setup and maintenance time and guarantees uniform illumination conditions during the full life-time of the lamp. Highlights Excellent light uniformity over full exposure field Stable light source Customizable illumination by means of illumination filter plate exchange "DUV-ready" process capabilities with fused silica micro optics Special "down-sizing kits" for light compression to smaller wafer sizes Available for: Automated Mask Aligner MA200 Gen3 MA100/150e Gen2 Semi-Automated Mask Aligner MA/BA Gen4 Pro Series MA/BA Gen4 Series MA12 Manual Mask Aligner MJB4 Details : Automation Auto Alignment Wedge Error Compensation (WEC) Auto Alignment is based on a motorized alignment stage. The COGNEX® based pattern recognition software automatically recognizes wafer target locations and controls the movement of the alignment stage. Coupled with SUSS MicroTec‘s DirectAlign® accuracies down to 0.25μm can be achieved. Auto Alignment enables highest repeatability of process results coupled with optimized throughput and minimum operator intervention. Available for: Automated Mask Aligner MA300 Gen2 MA200 Gen3 MA100/150e Gen2 Semi-Automated Mask Aligner MA/BA Gen4 Pro Series MA/BA Gen4 Series Details Exposure Lab Simulation Software Source Mask Optimization Simulation of lithographic processes A simulation of lithographic processes makes the selection of optimal settings for process parameters possible without long-winded trial and error sessions. The multi-functional simulation software of lithographic processes “Lab”, which SUSS MicroTec distributes together with the supplier, GenISys, first and foremost allows the operator better process control. It offers all the required simulation functionality for an integrated design and process development, as well as verification and optimization. At the same time it covers all the process steps from illumination shaping and mask layout optimization up to photo resist processing. Additionally, modern 3D simulation functions improve the model visualizations. The combination of MO Exposure Optics and the for SUSS optics custom-developed optical models in Lab facilitates customer-specific design optimization of the exposure filter plates, which in turn leads to an improvement in pattern fidelity. Highlights Complete simulation of the mask aligner lithographic process Adjustable illumination parameters (collimation, spectral composition), custom-developed for all SUSS optics Fast and flexible visualization and quantitative predictions in 1, 2 and 3D Available for: Automated Mask Aligner MA300 Gen2 MA200 Gen3 MA100/150e Gen2 Semi-Automated Mask Aligner MA/BA Gen4 Pro Series MA/BA Gen4 Series MA12 Manual Mask Aligner MJB4 Nanoimprint Lithography Imprint Lithography SMILE Stamp Fabrication Imprint lithography represents a cost-effective and highly reliable means of transferring three-dimensional nano- or micro-scale patterns onto a wide variety of substrates. For the imprint, a stamp is brought into contact with a photosensitive material on the substrate. The photoresist fills out the three-dimensional pattern of the stamp and then solidifies under UV light. Parameters such as pattern topography, structure resolution and aspect ratio have a considerable influence on the process quality. Thanks to its compatibility to well-established semiconductor processes, imprint lithography plays a key role in the development and production of DFB lasers, HB LEDs, wafer-level cameras and MEMS. SUSS MicroTec solutions for imprint lithography are based on manual mask aligner platforms and support a wide range of materials and substrate with sizes up to 200 mm. Furthermore, SUSS platforms provide the capability of aligning and levelling stamps to substrates, as required by many imprint applications. Imprint equipment can also be retrofitted to SUSS mask aligners which are already in the field. Depending on process requirements, SUSS MicroTec offers different imprint technologies on its mask aligners. Imprint Lithography Brochure Imprint Lithography Webpage Available for: Semi-Automated Mask Aligner MA/BA Gen4 Pro Series MA/BA Gen4 Series MA8 Gen5 Mask-Aligner Manual Mask Aligner MJB4 Bonding UV Bonding Bond Alignment Fusion Tooling for bonding of two substrates in the mask aligner. Available for: Semi-Automated Mask Aligner MA/BA Gen4 Pro Series MA/BA Gen4 Series Downloads MA/BA Gen 4 Series Brochure SUSS Product Portfolio Publications Reduction of Proximity Induced Corner Artifacts by Simulation Supported Process Optimization 3D Topography Mask Aligner Lithography Simulation UV-LED Lamp House – Light Source of the Future SHOW MORE SÜSS MICROTEC SE Schleissheimer Str. 90 85748 Garching Germany +49 89 32007-0 +49 89 444433-422 CONTACT FORM PRODUCTS AND SOLUTIONS Coater & Developer Inkjet Printing Mask Aligner Wafer Bonder Photomask Equipment Imprint Lithography SUSS Imprint Excellence Center Micro-Optics Remanufactured Equipment Customer Service Training Process Technologies COMPANY Organization Research & Development Quality Management Purchasing Events Customer Magazine INVESTOR RELATIONS Investor Relations Corporate Governance Share Shareholders’ Meeting 2021 Publications IR Contact CAREERS Careers Who we are What we offer Professionals FAQs Open Positions Young Professionals NEWS Corporate News Investor Relations News Image Archive I read the terms and accept it. 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