Contact Us Contact Us How can we help you? Drop us a message and we will get back to you very quickly Home » News » Custom Interconnect Ltd installs Datacon 2200EVO Die bonder for GaN and SiC power devices Custom Interconnect Ltd installs Datacon 2200EVO Die bonder for GaN and SiC power devices Custom Interconnect Ltd installs Datacon 2200EVO Die bonder for GaN and SiC power devices As part of its continued investment in GaN and SiC power device development and production enabled by APC15 @ FutureBEV and InnovateUK GaNSiC funding, CIL now has production capability for high pressure and pressureless Silver Sintering of WBG / SiC / GaN devices. As the Automotive market transitions from predominantly internal combustion engines (ICE) to plug in hybrid electric vehicles (PHEV) and full battery electric vehicles (BEV) the use of SiC power switching will become the dominant technology throughout the entire automotive industry. With battery voltages of 800V fast becoming the norm and switching currents of 500 – 700A, the power densities that the power modules have to switch are enormous. Therefore, the thermal management of the SiC based power module is one of the most critical focus points in BEV development. Traditional Silicon (Si) die attach methods such as conductive epoxies and eutectic solders simple cannot thermally perform at these power densities, so have been replaced by Silver Sinter die attach techniques. This started with low pressure / pressureless Silver Sinter, but for optimum thermal transfer High pressure Silver Sintering is the only solution. Pressureless silver sinter die attach can be achieved on simpler die bonders, but a fundamental of high-pressure silver sinter process is the heating of each die before being placed in the dried sinter paste. Therefore the ability to pick die from wafer / waffle pack, heat to a specific temperature necessitated the investment in the Datacon 2200EVO. Customers such as BMW on APC15@FutureBEV and other Tier 1 automotive customers insist on nothing less and APC15@FutureBEV and Innovate UK project GaNSiC has enabled CIL to make this significant investment for the future of Automotive manufacture in the UK. This Datacon2200EVO Die bonder system is part of an overall series of investments that are necessary for production capability in the UK for future Automotive / Aerospace / Power generation power modules. To date the other investments made include Boschman Sinterstar Innovate F-XL press, Boschman Heat / cool Tower system, K&S Asterion Heavy Gauge wire/ribbon bonder, Nordson SONOSCAN Gen7 Scanning Acoustic Microscope (CSAM). These essential pieces of capital equipment when coupled with CIL’s extensive existing production equipment / capability will ensure CIL is ready for our low carbon transportation future and ensures that UK manufacturing stays are the forefront of this technology. CIL now has 6 SMT lines Multiple 10 zone reflow including N2 Vacuum Assisted Vapour Phase reflow for power devices Multiple 3D Automatic Optical Inspection systems (3D AOI) Multiple TAKAYA Flying Probe Test stations (FPT) Laser de-panel system X-ray / CT Scan / Scanning Acoustic Microscopy (CSAM) / 4K Ultra High Res Digital Microscope Multiple Die Bonders Multiple Au Ball Bonders Multiple Al Wedge Bonders Back to News Help and Advice? CIL Brochure E: sales@cil-uk.co.uk T: +44 (0)1264 321321 OUR OFFICE Address: Custom Interconnect Limited, Charlton Road, Andover, Hampshire, SP10 3JL Phone: +44 (0)1264 321321 Email: sales@cil-uk.co.uk SERVICES + Electronics Manufacturing + Advanced Technologies + Design Services + Power Electronics for BEV & PHEV Vehicles + Box Build + Rapid Prototypes SECTORS + Aerospace & Space Tech + Automotive BEV & PHEV + Communications + Defence & Homeland Security + Industrial + Medical & Laboratory + Oil & Gas + Transportation Infrastructure CORPORATE + A Brief History + Our Vision, Mission & Values + CIL Supply Chain + Quality Assurance + Case Studies + Downloads + Connexion Technologies + Privacy Policy + Accessibility Custom Interconnect Limited (Group) - © 2021 Web Design by Devmac