TOP Quote Contact Us access Todenka Kogyo Co., Ltd. is also focusing on research and development. We aim to be a "proposal-type company" that can meet a wide range of customer needs by challenging new things such as plating difficult-to-plate materials. Plating on ceramic substrate ■ Electroless plating on paste -It is possible to apply electroless plating to the pattern on the paste (Ag / Cu) on the ceramic . -It is possible to improve the wire bonding property of each paste. -The electroless plating method improves the variation in thickness. -Our original plating process enables highly reliable plating. -Due to our unique plating process, there is no plating deposition on laser scribes, etc. Various combinations of plating specifications are possible Electroless Ni plating 2.0-8.0 μm Electroless Pd plating 0.05-0.4 μm Electroless Au plating 0.1-0.3 μm Metallize to ceramic ■ Wet process (under development) ・ We are researching and developing Cu metallize of alumina oxide, aluminum nitride, and silicon nitride. ・ We are conducting research and development to ensure adhesion by using electroless Ni, electroless Cu, and composite plating. ・ Final Cu plating thickness is 1 to 20 μm (consultation required for 20 μm or more) ・ Depending on the material, adhesion may not be obtained, so we will make a prototype after consultation. << Example of Cu metallizing on silicon nitride >> << Example of metallizing ceramic and electroless Au plating >> Plating on difficult-to-plating materials ■ Direct plating on ceramics -Alumina oxide, aluminum nitride, and silicon nitride can be directly plated. -In the following case, NiAu plating is performed directly on the ceramic, and the electrical characteristics can be obtained while making the best use of the characteristics of the ceramic. ・ Depending on the material, adhesion may not be obtained, so we will make a prototype after consultation. << Case of direct plating on ceramic powder >> ■ Electroless NiPdAg plating on Ag wax -Our original process enables direct electroless NiPdAg plating on Ag wax without damaging the substrate. -By applying NiPdAg plating while taking advantage of the characteristics of Ag wax, it is possible to improve solderability and ensure bondability . ■ Direct Ni plating on Mo material and CuW -Plating difficult materials, Mo materials, and CuW is possible. -By Ni-plating Mo and CuW, it is possible to solder and braze. ■ Cu plating on resin / Ni-B plating -Direct plating on ABS resin is possible. -By plating, heat resistance / corrosion resistance is given, heat deformation and damage by ultraviolet rays can be suppressed, and it is also resistant to scratches. -It has a beautiful appearance with metallic luster. Plating on LED board ■ NiAg plating for LED, NiAu plating -Ag plating has excellent reflection characteristics. -Au plating has poor reflection characteristics, but it is resistant to discoloration and has high durability. ・ We can propose processes in consideration of various characteristics. -Both can be mass-produced by automatic machines. Contact Us If you are interested, please contact the person in charge below. In charge Quality Engineering Department Shigemitsu Wagoya TEL (Representative) 018-892-3411 Mail shigemitsu_wagouya@azumadenka.co.jp Copyright (C) 2013 azumadenka. All Rights Reserved.