Company Products Support Careers Investors News & Events Contact Advanced thin film solutions since 1991 Intevac continues the advancement of vacuum coating equipment and process technologies in order to meet the evolving needs of our customers. View Equipment Lineup Trusted eyes in the dark Intevac Photonics produces night vision imaging sensors, cameras and systems for the defense and commercial industries. For defense applications, whether serving forces on the ground or in the air, Intevac technology supports operations carried out through the darkest of conditions. View Photonics Lineup COMPANY Overview Support Careers Supplier/Customer T’s & C’s Investors NEWS & EVENTS Press Releases Events & Presentations THIN FILM EQUIPMENT Overview Hard Disk Drive (HDD) Display Cover Panel Solar Advanced Packaging PHOTONICS Overview Military Commercial CONTACT Thin Film Equipment Photonics Investor Relations General Inquiries © 2021 Intevac, Inc. | All Rights Reserved | Privacy | Conflict Minerals Policy

Company Products Support Careers Investors News & Events Contact Contact Photonics Home » Customer Support » Contact Photonics 3560 Bassett Street Santa Clara, CA 95054 Phone: +1-408-987-2525 Fields marked with an * are required Your Name * Company * Address * City * Zip/Postal Code * State/Province/Country * Phone * Email * Subject * Message * Recaptcha COMPANY Overview Support Careers Supplier/Customer T’s & C’s Investors NEWS & EVENTS Press Releases Events & Presentations THIN FILM EQUIPMENT Overview Hard Disk Drive (HDD) Display Cover Panel Solar Advanced Packaging PHOTONICS Overview Military Commercial CONTACT Thin Film Equipment Photonics Investor Relations General Inquiries © 2021 Intevac, Inc. | All Rights Reserved | Privacy | Conflict Minerals Policy

Company Products Support Careers Investors News & Events Contact Advanced Packaging Home » Thin Film Equipment » Advanced Packaging The MATRIX® PVD System is a substrate-independent platform for multiple thin film applications in semiconductor packaging. From its modular design to its automated linear transport, every aspect in the design of the MATRIX® PVD System aims at maximizing productivity and minimizing cost of ownership. Application Fan-Out Packaging and UBM Learn about the process and productivity advantages that Intevac offers for advanced semiconductor packaging. Learn more Platform MATRIX™ PVD System for Advanced Packaging One platform to process a variety of barrier/seed layer films in fan-out redistribution layer (RDL) and under bump metallization (UBM) applications, the MATRIX PVD System leverages Intevac’s core capabilities in precise thin film technologies. Learn more COMPANY Overview Support Careers Supplier/Customer T’s & C’s Investors NEWS & EVENTS Press Releases Events & Presentations THIN FILM EQUIPMENT Overview Hard Disk Drive (HDD) Display Cover Panel Solar Advanced Packaging PHOTONICS Overview Military Commercial CONTACT Thin Film Equipment Photonics Investor Relations General Inquiries © 2021 Intevac, Inc. | All Rights Reserved | Privacy | Conflict Minerals Policy