IC MANUFACTURING COMPOUND SEMICONDUCTORS WAFER LEVEL PACKAGING TECH PAPERS COMPANY INVESTORS CONTACT The industry’s most advanced front-end wafer cleaning technologies Learn More Smarter Megasonic Cleaning For Advanced 2D and 3D Devices Thorough Wafer-wide Cleaning Gentler Damage-free Cleaning Reducing Defects, Raising Yields Proprietary Technology Our Smart Megasonix™ is the industry’s most advanced cleaning technology, which achieves thorough, comprehensive cleaning evenly across the wafer and without damage to device features. These proprietary new ACM technologies are able to precisely control both the power intensity and the distribution of megasonic cleaning — with dramatically positive effect. ACM Research - Recognized for Excellence ACM Research – Recognized for Excellence « » 1 2 3 4 5 6 Who We Are We develop, manufacture, and sell semiconductor process equipment and service solutions for single-wafer or batch wet cleaning, electroplating, stress-free polishing, and thermal processes critical to advanced semiconductor device manufacturing and wafer-level packaging. We are committed to delivering customized, high-performance, cost-effective process and support solutions that semiconductor manufacturers can use in numerous manufacturing steps to improve productivity and product yield. Our Solutions IC Manufacturing Systems Wafer-Level Packaging Systems News © 2021 ACM Research, Inc.. All rights reserved.