PRECISION AUTOMATION SOLUTIONS Applications requiring high-accuracy alignment, flex handling, cutting and forming. May combine inspection, placement and bonding technologies. LEARN MORE ADVANCED PACKAGING SOLUTIONS 2D, 2.5D and 3D semiconductor applications requiring high accuracy and efficient die handling. From direct die and flip chip to multi-die heterogeneous integration. LEARN MORE PCB ASSEMBLY SOLUTIONS Traditional printed circuit board assembly, including standard surface mount placement and through-hole component insertion. LEARN MORE PRECISION AUTOMATION PRODUCTS FUZION EXTREME SM & ODD-FORM Fuzion® offers a flexible, high-speed platform solution with plug-and-play adaptability for specialized application-specific tooling. Build your most challenging products with precise, repeatable closed-loop processes – and confidence. LEARN MORE FUZIONSC & HSWF HIGH-SPEED, MULTI-DIE ADVANCED PACKAGING FuzionSC™ and the HSWF™ combine to bring high productivity to advanced packaging assembly, delivering precision passive and active placement on a single platform. This solution supports virtually any feeding option and has the performance to meet high-volume targets. LEARN MORE FLEXBOND AUTOMATED VOLUME HOT BAR BONDING The Flexbond™ high-throughput hot bar bonding platform enables the first fully automated volume solution for advanced flex circuit and other hot bar interconnect applications. It combines Fuzion® for full-process integration, including flux transfer, high-accuracy placement and hot bar soldering. LEARN MORE FUZIONOF TRADITIONAL SM & ODD-FORM FuzionOF™ is easily configured for SM or odd-form applications, performing both component placement and insertion. It is ideal for light-duty odd-form, supporting a wide range of leaded and non-leaded odd-form devices. LEARN MORE UFLEX FLEXIBLE MULTI-PROCESS AUTOMATION Uflex™ delivers ultimate flexibility for all forms of odd-form insertion and mechanical assembly operations. It supports radial and axial insertion and provides passive and active clinching. Uflex is easily retooled for a variety of processes, including screw driving, labeling, test handling, and more. LEARN MORE COMPLEX CONNECTOR ASSEMBLY ODD-FORM AUTOMATION HIGH PIN-COUNT MODULE ASSEMBLY ADVANCED PACKAGING PRODUCTS FUZIONSC & HSWF HIGH-SPEED, MULTI-DIE ADVANCED PACKAGING FuzionSC™ and the HSWF™ combine to bring high productivity to advanced packaging assembly, delivering precision passive and active placement on a single platform. This solution supports virtually any feeding option and has the performance to meet high-volume targets. LEARN MORE FUZIONSC & FLEXION EFFICIENT SINGLE-DIE ADVANCED PACKAGING FuzionSC™ and the Flexion™ direct die feeder support a full complement of high-volume flip chip and bare die applications. Flexion enables high-speed die delivery from wafer over a wide range of die sizes to streamline processes and improve efficiency. LEARN MORE FLEXBOND AUTOMATED VOLUME HOT BAR BONDING The Flexbond™ high-throughput hot bar bonding platform enables the first fully automated volume solution for advanced flex circuit and other hot bar interconnect applications. It combines Fuzion® for full-process integration, including flux transfer, high-accuracy placement and hot bar soldering. LEARN MORE HETEROGENEOUS INTEGRATION FLEXBOND OPERATION PANEL FAN-OUT PCB ASSEMBLY PRODUCTS GENERATION 88HTi TRADITIONAL THROUGH-HOLE Dedicated to pre-taped radial and axial components, the Radial 88HTi™ and VCD 88HTi™ bring a new level of productivity to radial and axial component sequencing and insertion, offering consistently high throughput. LEARN MORE FUZION HIGH-PERFORMANCE SURFACE MOUNT Fuzion® is the pinnacle of platform performance, providing an agile, flexible production model without limitations. Fuzion is the industry’s most adaptable and capable platform, delivering profitable productivity for any manufacturing model from NPI to ultra-high volumes. LEARN MORE FUZIONOF TRADITIONAL SURFACE MOUNT & ODD-FORM FuzionOF™ is easily configured for SM or odd-form applications, performing both component placement and insertion. It is ideal for light-duty odd-form, supporting a wide range of leaded and non-leaded odd-form devices. LEARN MORE UFLEX FLEXIBLE MULTI-PROCESS AUTOMATION Uflex™ delivers ultimate flexibility for all forms of odd-form insertion and mechanical assembly operations. It supports radial and axial insertion and provides passive and active clinching. Uflex is easily retooled for a variety of processes, including screw driving, labeling, test handling, and more. LEARN MORE STANDARD SURFACE MOUNT DIMM AND ODD-FORM AUTOMATION MULTI-PROCESS THROUGH-HOLE MARKETS SOLUTIONS CUSTOMERS PRODUCTS PARTS SUPPORT © 2021 Universal Instruments Corporation Privacy Policy & Terms of Use COMPANY ABOUT US CAREERS CONTACT US