Careers Investor Relations News EN PRODUCTS & SOLUTIONS COMPANY CONTACT Projection Scanner Noted for its highly accurate alignment and precise exposure optics, SUSS MicroTec’s product portfolio of proximity printing equipment is complemented by a unique projection lithography solution. The projection scanner platform DSC combines the advantages of full-field lithography with the imaging performance of projection lithography, offering a very cost-efficient alternative to projection steppers. Equipped with a full-field mask and broadband projection optics, the system exposes the substrate in a single continuous scanning mode. The projection scanner platform is suited for applications such as advanced packaging, especially wafer-level chip-scale packaging and flip-chip packaging, 3D integration, MEMS and displays. DSC300 Gen3 Projection Scanner The High-Throughput Alternative to 1X Steppers Technologies Projection Lithography Projection exposure entails aligning the mask with the wafer. The mask pattern is subsequently projected onto the wafer by means of an optical system between the mask and the wafer. With this process, usually only a portion of the wafer is exposed. By repeating the process incrementally ("step and repeat") or through a continuous process ("scanning"), the wafer is completely exposed. The type and the characteristics of the projection optics are decisive factors for resolution and depth of focus and thus for the effectiveness of the exposure. The projection scanner technology offered by SUSS MicroTec utilizes the combined advantages of full-field exposure and conventional projection lithography, and serves as an alternative to mask aligners and conventional projection steppers. Projection scanning involves aligning a full-field mask with the substrate and then projecting the mask pattern onto the substrate by means of scanning. Scanning technology achieves greater throughput than stepper processes, while at the same time reducing system costs and achieving resolutions down to 3 µm. Projection scanning offers the greatest advantage in processes requiring high resolutions or where high topography and thick resist coatings are involved. Features & Benefits Cost-effective projection solution offering superior resolution down to 3 µm Steep resist sidewalls in thick resist processes Available for: DSC300 Gen3 SÜSS MICROTEC SE Schleissheimer Str. 90 85748 Garching Germany +49 89 32007-0 +49 89 444433-422 CONTACT FORM PRODUCTS AND SOLUTIONS Coater & Developer Inkjet Printing Mask Aligner Wafer Bonder Photomask Equipment Imprint Lithography SUSS Imprint Excellence Center Micro-Optics Remanufactured Equipment Customer Service Training Process Technologies COMPANY Organization Research & Development Quality Management Purchasing Events Customer Magazine INVESTOR RELATIONS Investor Relations Corporate Governance Share Shareholders’ Meeting 2021 Publications IR Contact CAREERS Careers Who we are What we offer Professionals FAQs Open Positions Young Professionals NEWS Corporate News Investor Relations News Image Archive I read the terms and accept it. SEND © 2021 SÜSS MicroTec SE | Imprint | Privacy Policy | Terms of Use | Terms & Conditions