DOWNLOADS CAREERS ABOUT US CONTACT US LANGUAGE HOME EQUIPMENT WLP SERVICES CHEMISTRY NEWS & EVENTS Die Sort HomeWLP ServicesDie Sort After sawing the wafer into individual die, the die often times need to be picked from the sawing tape and placed into either, Waffle Packs, Gel Packs, or inserted into Tape and Reel pockets. Pac Tech has the capabilities to perform all of these operations either manually for low volume applications or fully automatic for high volume applications. The die are peeled from the tape and manually loaded in die trays. Die are carefully peeled from the wafer tape and deposited on a special handling film utilizing a die-tape separator. An operator then moves the die from the film to the appropriate carrier utilizing a vacuum pencil. In automated process, the wafer remains on the ring frame and is loaded onto the pick and place equipment. As it is clamped into place, the tape is stretched to increase the space between each die. The carriers are loaded onto the discharge fixture of the machine. Eject pins push up through the wafer tape to elevate the die and loosen it from the tape. The vacuum pickup arm retrieves the die and deposits the die in the carrier. The machine is programmed to recognize ink dots left on the surface of the die during the wafer probe and visual inspection operations. Electronic maps can be used to identify rejected dies. Incoming Wafer Requirements: Contact Us General Overview Solder Bumping Wafer Level Redistribution Flip Chip Test Wafer Test Wafer Pac 2.0 Test Wafer Pac 2.3 Test Wafer Pac 2.7 Wafer Level Photoresist / BCB Coating Wafer Level UBM Plating Electroplating Electroless Plating Wafer Backside Metallization Bonding / Assembly Wafer Thinning Wafer Sawing Die Sort CONTACT Pac Tech – Packaging Technologies GmbH Am Schlangenhorst 7 – 9 14641 Nauen – Germany +49 (0) 3321 4495 – 100 info@pactech.de NEWSLETTER Name Email* SUBSCRIBE MENU Home Contact Us Terms & Conditions Sitemap Imprint Privacy Policy Facebook Youtube © PacTech - Packaging Technologies GmbH 2019. All Rights Reserved. We use cookies to ensure that we give you the best experience on our website. If you continue to use this site we will assume that you are happy with it.OkRead more