Capabilities Facilities Quality Careers Resources Request a Quote Die Preparation Wafer Thinning & Polishing Wafer Dicing Our in-house engineers have carefully researched and isolated the most common causes of die chipping, low die strength and poor yields. At the end of the day, it usually comes down to subpar dicing. To avoid that, we use world-class, fully automatic DISCO wafer dicing systems. This allows us to handle wafer sizes ranging from mere fragments to 300 mm in diameter, with cut lines as small as 15 µm. Dice Before Grind (DBG) Die Attach Film (DAF) Custom Parameters Complex Die Patterns Cleanliness & Electrostatic Discharge Elimination Assembly Service Guide Learn how to make your products cost effective and ready for manufacture with this detailed guide. Want to learn more? Contact our team today to learn more about our die prep services, tell us about your project needs and get your free quote, 100% risk-free. Get a free quote 800-622-2382 Request a Quote Capabilities Die Prep Packaging & Assembly Electrical Test Reliability & Qualification DPA & FA Counterfeit Detection Other Services Resources Blog Press Releases Webinars Videos Guides FAQ Contact Us Facilities Standard Products About Us Careers Technical Hotline Terms & Conditions Privacy Policy © 2021 Integra Technologies

Capabilities Facilities Quality Careers Resources Request a Quote Want to learn more? Contact our team today to learn more about our reliability & qualification services, tell us about your project needs and get your free quote, 100% risk-free. Get a free quote 800-622-2382 Request a Quote Capabilities Die Prep Packaging & Assembly Electrical Test Reliability & Qualification DPA & FA Counterfeit Detection Other Services Resources Blog Press Releases Webinars Videos Guides FAQ Contact Us Facilities Standard Products About Us Careers Technical Hotline Terms & Conditions Privacy Policy © 2021 Integra Technologies