EN HYBtronics ABOUT US TECHNOLOGY PROCESS CAPABILITY MARKETS CAREER CONTACT DIFFERENT FIELDS OF APPLICATION History: Process Capability > CHIP ON BOARD Clean room Class 10000 (Fed. Stand. 209d) Class 7 (ISO 14644-1) Wedge bonding with gold and aluminum wire. Gold: 25µm and 50µm Aluminum: wire from 30 µm up to 350 µm Substrates used for die attach: Ceramic, PCB (FR4) and IMS (Al or Cu based) Glob top encapsulation or cavity filling. Design together with HYBtronics your professional future: Practical Course Job Offers Address HYBtronics Microsystems, S.A. Oreitiasolo 14 01006 VITORIA (Spain) Imprint Privacy Policy Cookies help us to improve our website. By using our website, you agree to our use of cookies.OKMore Information

EN HYBtronics ABOUT US TECHNOLOGY PROCESS CAPABILITY MARKETS CAREER CONTACT History: CAREER You are seeking a fresh vocational challenge or the opportunity to begin a new career with potential for development. Vacancies currently on offer present a multitude of prospects. Job offers: -currently no jobs available- On your own initiative Not found the right job amongst our vacancies? Then take the initiative – and send us your personal application. Because, regardless of the jobs that we’re actually advertising, – we’re interested in your experiences and qualifications. We are also looking for dedicated and competent employees to carry out administrative and business tasks at all levels. Interested? Then please send your completed application to Mr Santos Martin at info(at)hybtronics.com. Design together with HYBtronics your professional future: Practical Course Job Offers Address HYBtronics Microsystems, S.A. Oreitiasolo 14 01006 VITORIA (Spain) Imprint Privacy Policy

EN HYBtronics ABOUT US TECHNOLOGY PROCESS CAPABILITY MARKETS CAREER CONTACT AUTOMOTIVE SOLUTION History: Technology > CHIP ON BOARD With COB technology, the bare die is attached directly onto the surface of the circuit and wire bonded to establish the electrical connections. Bonding can be done with either aluminum or gold wires, depending on the application. The bonded die is covered with epoxy resin to protect it from the environment: humidity, light shocks, etc. COB offers a versatile solution for high-density packing and it is normally mixed with SMD components. Design together with HYBtronics your professional future: Practical Course Job Offers Address HYBtronics Microsystems, S.A. Oreitiasolo 14 01006 VITORIA (Spain) Imprint Privacy Policy