StockTicker SEARCH Homepage Products & Technology Packaging Molding Fico Molding Line Die Attach Packaging Molding Fico AMS-X Fico Molding Line Fico AMS-LM Fico AMS-LM Top Foil Fico MMS-LM Fico MMS-LM Top Foil Fico AMS-i Fico MMS-i Trim & Form Fico Compact Line - X Fico Compact Line - P Singulation Fico Sawing Line Accessories and Services Process Technology Fico Trim & Form Tools Saw Conversion Kits Fico Molds Plating EU projects Scientific publications Smart manufacturing Wettable flank Fico Molding Line The new Fico Molding Line (FML) is a transfer molding system for wafers and large panels. It can mold wafers of up to 12" (305mm) and panels up to 300x340mm. The Fico Molding Line can mold both overmolded and exposed die products in the same mold configuration, something that is not possible with compression molding. 100µm cap height The FML uses a conventional transfer molding concept to overmold products. With the standard top foil addition it can also perfectly mold exposed die products. Fill heights, as low as 100µm, and small gaps between dies, as low as 50µm, can be achieved. Despite the small cap height and the large molding surface, the end product remains free from voids, flash or bleed. Even extreme low vicosity compounds are no problem for the FML, the end product will be perfect of quality, outperforming liquid or powder compression molding. Advanced handling capabilities, a high precision mold with several vacuum systems allow also trouble free production of molded underfill products. Substrates, glass and silicon The Fico Molding Line is able to mold substrates, standard silicon and glass wafers. With its advanced clamp force and level control, it can also handle extreme thin and sensitive stacked wafers. Manual and automatic system The Fico Molding Line is already available as a manual system for product development. An automatic system is being optimized and in beta test at several customer sites. It will be released later. With the new modular FML design, a manual system can be upgraded to an automatic system when production ramps up. Also read the article on Exposed die fan-out wafer-level packaging by transfer molding in Chip Scale Review. Key Features Key Features Wafers and panels Wafer diameter up to 305 mm (>12”) Panel size up to 300 x 340 mm Low cap size, down to 100 µm Small channels between dies / packages Foil molding Exposed die molding for Flip Chip & Wafer packaging (only possible with transfer molding) Bleed free molding, without post processing (no back grinding needed) No mold cleaning necessary Easy operation Fast tool exchange Easy accessible machine Touch screen interface Intuitive interface Built in hand exhaust Molding press Top edge injection transfer molding Standard pellet material handling Dynamic clamping control, protects from die and wafer crack (very flexible clamp control, multiple clamp force profiles possible) Active clamp force level control for precise mold cap height and planarity New dynamic transfer pressure control, optimized transfer profile to ensure exact repeatable process conditions Mold integrated degating Accurate multi zone temperature control Board, cavity and foil vacuum Glass wafer handling Silicon wafer handling 17 process patents Standard building blocks Modular building blocks for wafers and panels Fully compatible automatic and manual systems Tools and process parameters fully exchangeable Universal parts (low spare stock) Common modules (FML-FCL-FSL) Vacuum Supreme board and wafer vacuum Cavity vacuum control Void free end product Suited for complex molded underfill (MUF and eMUF) packages Suited for ultra low packaging and micro SIP sealing Specifications © Copyright 2021 Besi - All rights reserved Privacy Statement | Disclaimer | Sitemap