Search wwwSearch www.mec-co.com site map 2014/08/12 "Environmental Report 2014" has been posted. 2014/07/31 Investor information has been updated 2014/07/01 Investor information has been updated 2014/06/20 Investor information has been updated 2014/06/05 Investor information has been updated 2014/06/03 Investor information has been updated 2014/05/22 Investor information has been updated 2014/05/09 Investor information has been updated 2014/04/01 Investor information has been updated 2014/03/19 This time, it was selected as one of the "100 Global Niche Top Companies" by the Ministry of Economy, Trade and Industry. Among the companies working to develop the international market, the ministry has selected the companies that have secured a high share in the niche field and are practicing good management as "GNT 100 selections". Details are posted on the ministry's website. 2014/03/03 Investor information has been updated 2014/02/27 We have updated the employment information. We have started entry for those who are planning to graduate in March 2015. 2014/01/31 Investor information has been updated 2014/01/06 Investor information has been updated 2013/12/19 Notice of program appearance. MEC will be introduced in the project "Professor Satake's Kirari Economics & Kirari to Hikaru Company" in Sun TV "Kirari Keizai". Scheduled program broadcast date: Sunday, December 22, 2013 22: 00-22: 24 2013/12/19 The CSR report has been updated. 2013/10/31 Investor information has been updated 2013/10/02 Investor information has been updated JPCA Show 2014 Thank you for visiting our booth. 4th Car Weight Reduction Technology Exhibition (in Automotive) Thank you for visiting our booth. NPLUS --Composite exhibition of materials and technologies that add new value- Thank you for visiting our booth. MEC Co., Ltd. Amax Building, 3-95, Showadori , Amagasaki-shi, Hyogo TEL.06-6414-3451 FAX.06-6414-3455 Corporate information Some content on this site requires the Flash Player plug-in . If you do not have the plug-in, please download it from here . To view the PDF files on this site, please download ADOBE READER . Electronic board manufacturing process diagram For semi-additive construction method Improved adhesion of ultra-roughened system Lamination pretreatment Copper surface treatment for CO 2 direct laser Copper surface adhesion improvement treatment for high-frequency substrates Micro etching Etch down Bleed removal Copper rust removal, rust prevention Metal resist peeling Lead-free solder compatible HAL related Selective etchability list Selective etching Roughening, etc. ｜Inquiries｜Site Map｜