ASSEMBLY VIRTUAL TOUR Capabilities State-of-the-art 35k sq/ft facility in San Jose 24 Hour builds available Front end engineering services for DFM review 12 Zone Ovens with ON-Demand Liquid Nitrogen for 99.99% purity on solder joints Lead Times Standard leads times range from 3-5 Days 24 Hour expedites are available Parts Procurement & Inventory Parts Procurement team and Parts Inventory available FUJI PICK AND PLACE Quality 100% Inline Solder Paste Inspection First Article QA inspection done on every job Flying Probe Test Parametric Bench Test 100% 3D Xray Inspection after SMT and at Final QA on every leadless part to insure no shorts, opens or voids are present 100% Inline AOI insures no errors with parts placement, mis-alignment, mis-orientation, and solder joint defects SOLDER PASTE INSPECTION SEICA Test Solutions Pilot V8 4D: Maximum board size 30″ x 30″ Configured with 4 probes front side and 4 rear side moving probes TOS SEICA Pilot V8 4D premium optical system IC open subsystem with dual sensors Quad-output, quad-range for power on applications Real image map option Programmable DC power supply TRI TR7007 series II Solder Paste Inspection Unit: World’s fastest inspection speed up to 200 cm2/sec @ 15 µm Shadow free Fringe Pattern lighting technology Optical resolution 10 µm or 15 µm Linear motor X-Y table for vibration free accurate inspection Camera type: 4 MP camera Optical resolution 10 µm or 15 µm (factory setting) Inspection speed: up to 90 cm2/sec @ 10 µm or 200 cm2/sec @ 15 µm Inspection performance Height resolution: 0.4 µm Min solder paste pitch: 100 µm Board size 50 x 50 – 510 x 460 mm (850 x 610 mm) AOI: Vibration free ultra-high speed Inline Color AOI with precise linear motor control Advanced RGB+W lighting system for improved solder and marking inspection Camera type: top view 3CCD camera + 4 mono angled cameras Inspection speed: 100 cm2/sec @ 15 µm and or 68 cm2/sec @ 12 µm Inspection Function: Component missing, tombstone, billboard, polarity, skew, marking Solder joint insufficient/excess solder, bridge, Through-hole pins, lifted lead, golden finger scratch/contamination VJ Electronix Vertex II X-ray inspection system: 2D/3D high resolution micro focus x-ray system with 130kv tube Inspect board up to 20″ x 20″ with 5 axis, X,Y,Z-horizontal rotate-OVHM axis Digital Flat Panel Detector (in lieu of Image Intensifier & Variable Magnification Vision System) Active Area 204.8 x 204.8 mm square (>1 million pixels)Pixel Pitch: 200um Image Intensifier Detector mounted on an Independent programmable X/Y stage 110° Wide Angle 130kV source, Provides up to +/- 50 deg Off Axis Viewing ADE: Automated Defect Enhancement Software Module 3D computed tomography software for image intensifier SMT CAPABILITIES POST SMT Let’s Build Something Incredible! UPLOAD FILES Connect With Us Global Headquarters 1445 Oakland Rd San Jose, CA 95112 Contact: Karl Rauch, VP of Sales Tel: +1-408-294-9897 Email: info@gorillacircuits.com Eastern U.S. 98 Spit Brook Road, Suite 1104 Nashua, NH 03062 Contact: Brett Dobens, Director of East Coast Operations Tel: +1-603-864-0283 Email: info@gorillacircuits.com U.S.A. PCBA Manufacturer for the World’s Best in Tech. Upload Files to Get A Quote © 2020 Gorilla Circuits. All Rights Reserved. | TERMS OF USE | PRIVACY POLICY | CERTIFICATIONS Content Created by Brett Dobens, Mark Anselmi, and Casey M Willard. Website by CleverLight