InvenSense TDK Product Center Login | Register Solutions Applications Developers Sustainability Login | Register TDK Sensor Catalog TDK Worldwide Motion Sound Imaging Location Click to Enlarge Our technology includes five core elements: Patented InvenSense-Fabrication process, Advanced MEMS motion sensor designs, Mixed-signal circuitry for sensor signal processing, MotionFusion™ and calibration firmware, and MotionApps™ software consisting of drivers and APIs for applications development on all major consumer electronics operating systems. Our patented InvenSense-Fabrication process enables direct integration of MEMS mechanical structures with standard complementary metal oxide semiconductor (CMOS) at the wafer level. This results in significant performance, reliability, integration and cost benefits, and enabled InvenSense to pioneer the industry’s first high-volume, commercial MEMS fabless business model. Our mixed-signal circuitry provides sensor signal processing which enables MotionFusion™ technology critical to our MotionProcessing™ platform. Highly integrated and cost effective solutions enabled by our patented InvenSense-Fabrication Process Manufacturing efficiency, flexibility and scalability Scalable MotionProcessing™ platform with opportunities for multi-sensor integration High performance and reliability Solutions Mobile Automotive Wearables Drones Smart Remotes Internet of Things Robotics Indoor Positioning Vehicle Positioning TDK Global Technology Motion Imaging Sound Location Ultrasonic Developers Software Downloads Industrial Audio Wearable Design Discussion Forum Support Center & FAQ IoT Company Company Profile News/Media Video/Resources Management Distributors Sales Rep Info Offices/Contact Careers TDK Group TDK Code of Conduct TDK Global Legal Privacy Copyright© 2021 InvenSense. All rights reserved. TDK logo is a trademark or registered trademark of TDK Corporation.