Home About Business Segments News & Media Investors Contact Business Segments A Trusted Supplier of Brand Name Semiconductor Equipment At Amtech Systems, we focus specifically on two high-growth sectors of the semiconductor market: Silicon Carbide and Power Semiconductors. Through our three wholly-owned subsidiaries (PR Hoffman, Bruce Technologies, and BTU International) we manufacture and sell a wide range of essential semiconductor equipment, including lapping and polishing, diffusion furnace, and thermal processing products. Silicon Carbide / LED Lapping & Polishing In 1997, we acquired PR Hoffman, a premier brand that manufactures and sells lapping and polishing consumables and machines. PR Hoffman’s key customers include several major SiC, Si, and sapphire wafer producers. SiC/LED Products Substrate Carriers of various sizes and materials, which combine the strength of hardened steel as the processing backbone with a softer plastic material in the work holes known as an insert. Substrate Polishing Templates which are used to securely hold silicon carbide, silicon, sapphire, or other wafer materials in place during single-sided wax-free polishing processes. Lapping and Polishing Machines which are designed to process materials such as silicon wafers, sapphire, and other wafer-like materials. LEARN MORE ABOUT PR HOFFMAN CONTACT US Semiconductor Diffusion Furnace In 2004, we acquired Bruce Technologies. Through this subsidiary, we produce and sell 200mm and 300mm horizontal diffusion and deposition furnaces to top players in the power chip, sensor, and analog sectors. Our horizontal furnaces currently address several steps in the semiconductor manufacturing process, including diffusion, LPCVD, annealing, and high-temperature oxidation, which is used in silicon and silicon carbide power chips. LEARN MORE ABOUT BRUCE TECHNOLOGIES CONTACT US Thermal Processing We acquired BTU International in 2015. Through this subsidiary, we produce and sell reliable thermal processing systems used in various stages of printed circuit board assembly and advanced semiconductor packaging. Our printed circuit board assembly products are used primarily in the advanced, high-density segments of the market that utilize surface mount technology. Our key customers include various chip packaging, SMT, and custom engineered high-temperature belt furnace producers. LEARN MORE ABOUT BTU INTERNATIONAL CONTACT US © 2021 Amtech Systems, Inc. All Rights Reserved. Privacy Policy Disclaimer Sitemap