INVESTORS CAREERS SKYPORT CUSTOMER PORTAL SUPPLIERS Skywater Technology Skywater, Deca sign packaging pact SkyWater Technology, the Minnesota specialist foundry, and Deca Technologies, the packaging specialist have agreed a deal to use Deca’s second generation M-Series fan-out wafer-level packaging (FOWLP) technology with Adaptive Patterning in SkyWater’s packaging facility in Florida. The companies are endeavoring to establish the first high volume FOWLP capability in the U.S. to bring proven solutions for single and multi-die packaging and advanced heterogeneous integration capability for chiplets through 2.5D and 3D implementations. Deca’s Adaptive Patterning with mask-less laser direct imaging delivers high-density design rules and high production yields in a cost-effective miniaturized format. Read the article in ElectronicsWeekly.com: https://www.electronicsweekly.com/news/business/skywater-deca-sign-packaging-pact-2021-10/?eea=*EEA* RETURN TO INDUSTRY NEWS PAGE Post navigation SkyWater Signs Technology Transfer and License Agreement for Deca’s Gen 2 M-Series Fan-out and Adaptive Patterning Technology SkyWater Signs Technology Transfer and License Agreement with Deca SkyWater Technology Headquarters 2401 East 86th St., Bloomington, MN 55425 952.851.5200 Florida Facility Office: 194 NeoCity Way, Kissimmee, FL 34744 Fab: 200 NeoCity Way, Kissimmee, FL 34744 Policies and Certifications AS9100 Aerospace Certified Code of Business Conduct and Ethics Code of Ethics for Sr Financial Officers EEO / AA Policy Environmental Policy ISO13485 Medical Certified ISO9001 / IATF16949 Automotive Certified ISO 9001 Quality Management System ISO14001 Environmental Certified REACH Compliant RoHS Directive 2011/2015 Compliant Quality Policy Privacy Policy Terms & Conditions SkyNet Employee Portal