Corporate message Company Profile Core technology Specific grinding energy Nanotem contract system Aerofix 　New Porous ceramic vacuum chuck ・ Technical information ·Product introduction ・ Chuck for 2 weeks ・ Sample chuck rental Suction roll Precision diamond grindstone ・ Technical information ·Product introduction Dicing blade ・ Technical information ·Product introduction Precision multifunctional lap machine 　New The grinder ・ Technical information ·Product introduction Large grinding machine Video room Manufacture and sale of vacuum chucks for suction of various substrates in the semiconductor, flat panel display (FPD), and printed circuit board industries Grinding, polishing, dicing and sales of consumables for blue and white LED sapphire substrates Grinding, polishing and dicing of various hard and brittle materials such as ceramics Porous Ceramics Vacuum Chuck Technology With ceramics with uniform pores on the order of microns and a unique vacuum exhaust method, processed materials are adsorbed on the surface without bending the materials. The suction part can be manufactured in various shapes. Precision cutting technology (dicing blade) A thin blade grindstone (diamond) that cuts semiconductor substrates, etc., and supports thicknesses of 50 to 500 μm. Cuttable material (sapphire, quartz glass, silicon, etc.) Precision diamond grindstone polishing technology Because the diamond part has a higher degree of coupling than the core part, the core part wears first and the workpiece always comes into contact with the diamond. Furthermore, since it is a porous body with 40% or more pores, water and air can be taken in and out. Grinding / polishing equipment (The Grinder, Large Grinding Machine) One of Nanotem's unique next-generation grinding technology developments that we have cultivated so far, we have realized the provision of processing solutions to the ever-expanding semiconductor, liquid crystal, and printed circuit board industries. I will. この部分はIFRAME対応のブラウザでご覧いただけます。 * Click here for a list of new information Copyright (C) 2005 Nano-TEM Co., Ltd. All Rights Reserved.