StockTicker SEARCH Homepage Products & Technology Packaging Singulation Fico Sawing Line Die Attach Packaging Molding Fico AMS-X Fico Molding Line Fico AMS-LM Fico AMS-LM Top Foil Fico MMS-LM Fico MMS-LM Top Foil Fico AMS-i Fico MMS-i Trim & Form Fico Compact Line - X Fico Compact Line - P Singulation Fico Sawing Line Accessories and Services Process Technology Fico Trim & Form Tools Saw Conversion Kits Fico Molds Plating EU projects Scientific publications Smart manufacturing Wettable flank Fico Sawing Line With the launch of the improved Fico Sawing Line (FSL), Besi initiates yet another era in singulation. The FSL is the only integrated singulation system on the market of a single solution provider. Singulation is a 4 step process where - from a large strip - individual products are sawn, cleaned, inspected and sorted. In the Fico Sawing Line, Besi has integrated all these process steps into one single machine. With its compact size the FSL has the highest output per square meter. The FSL carries out all process steps simultaneously using reliable vacuum on each single product, instead of tape. The unique and patented sawing method has the best scrap handling in the market and an unsurpassed accuracy. 100% inspection ensures that only perfect products leave the machine. With the FSL, singulation is elevated to an art, the art of singulation. More information? Curious of what the Fico Sawing Line can do for you? Contact the Besi sales department for more information. Key Features Key Features Main improvement features Extreme warpage handling (best warpage handling in the market) Improved output with new 9-head sorting Improved accuracy - 25 μm offset/size accuray optionally available Step cut application (option) High Output Fully parallel processing with dedicated units Balanced throughput with optimal process performance Production output up to 34,000 UPH Large Substrate Handling Capable of handling substrate sizes of up to 100 x 300 mm Fully prepared for future increase of high density substrate approach Fast Conversion Fast & easy product conversion to different substrate & product size No tools required and completely automatic alignment of all product related parts Upside Down Sawing Substrates and products are handled in a "live bug" (contacts down) state throughout the system End product is fixed from the top side Substrate is cut from below Cut scrap falls automatically into the waste bin Minimal risk of scrap hitting the sawing blade High Accuracy All substrates are fully analyzed with the pre-alignment feature, operating in parallel with the sawing process (zero time loss) The sawing process is taking into account all specific substrate shape and geometry deviations Final package accuracy of ±50 μm at Cpk > 2.0 (6-sigma process control) Features Automatic tray feeder Rework tray 3 reject bins 9 head product sorting Tube offloader (optional) Tape ring offloader (optional) 2.5 kW spindle power 3" blades (70 - 80 mm) Specifications Downloads © Copyright 2021 Besi - All rights reserved Privacy Statement | Disclaimer | Sitemap