EN DE ABOUT AMO RESEARCH PRODUCTS & SERVICES DOWNLOADS CONTACT Home » Products & Services » Cleanroom Facilities CLEANROOM FACILITIES AMO runs a class 10 to class 1000 cleanroom with a total area of 400 m²: Nanolab AMICA. Here, high end fabrication equipment for semiconductor technology is operated in a highly flexible way to enable high quality nanofabrication, quick process changes and unconventional solutions. AMO is, as a matter of principle, a R&D company with several research and development projects within a lot of different research fields and offers high flexibility regarding customer orders. This is based on 20 years of experience in micro- and nanotechnology. As a result, we are not organized like a big wafer fab, AMO is in fact organized in a way that for all customers and partners the best individual solution is found, with low processing times and lot sizes matching the customer’s needs. Thereby, great attention is paid to the customer’s satisfaction. AMO’s business focuses inter alia: Fabrication of nanophotonic components on prototype and small-scale level Nanostructuring-services Cleanroom-Services All the listed euipment below is made available to interested customers and partners in the framework of our services branch. For a concrete proposal please do not hesitate to make direct contact for a tailor-made solution combining all the necessary tools and processes meeting your specific demands. NANOSTRUCTURING The exploitation of the enabling potentials of nanotechnology for the fabrication of novel functional components depends critically on the availability of advanced lithography methods and their continuous improvement. AMICA is designed to be a nanolithography center. The established lithography technology was designed to meet application specific parameters, such as minimum feature size, exposure area and design flexibility. Today, AMO is able to offer a variety of lithography-technologies as follows: LITHOGRAPHY Vistec EBPG 5200 e-beam system: 50/100 kV sub 10 nm resolution from samples of 10×10 mm² up to 8″ wafers Canon FPA 3000 i5r i-line Stepper with 0,5 μm resolution EVG 420 6″ semi-automatic Maskaligner EVG 150: 4″- 8″ automatic resist coater and developer Süss MA8 Gen3 SCIL 2″-8″ UV-Nanoimprint Lithography EVG 770 4″- 8″ UV-Nanoimprint Step&Repeat Lithography EVG 620 Soft UV Nanoimprint prototype: 4″- 6″ flexible template size, sub 50 nm resolution 2 experimental Interference Lithography systems: 180 nm – 2.5 μm pitch, up to 8″ substrates, stitching free ETCHERS DEPOSITION For deposition of high quality thin films, dielectrics and metals, AMO offers a wide range of different techniques enabling thicknesses of the deposited or grown material layer from several angstroms to some microns. CVD (CHEMICAL VAPOUR DEPOSITION) The substrate is exposed to reactive gases which decompose and react on the substrate surface forming the desired deposit. By using low pressure (sub-atmospheric) unwanted gas phase reactions are reduced and the film thickness uniformity is enhanced. Centrotherm 6″ LPCVD furnaces Polysilicon Silicon Nitride LTO (low temp. SiO2) ATOMIC LAYER DEPOSITION SPUTTERING / EVAPORATORS FURNACES AMO has different furnaces available, used at different stages along the process flow for high quality micro- and nanoelectronic devices, ranging from growing high quality silicon oxides to high temperature annealing. Four 6″ – 8″ Centrotherm Furnaces: Oxidation (wet and dry oxides) POCl3-Diffusion Annealing Jipelec JetFirst: 6″ Rapid Thermal Annealing system WET PROCESSING Wet processing is carried out in dedicated areas for handling wet chemicals including areas with amber light for handling lithography resists. To allow for a maximum of flexibility of processable substrates wet benches and tools are provided to handle wafer pieces, single wafers as well as wafer batches. ARIAS Wet benches: single wafer and batch cleaning and resist processes SCFluids Super Critical Dryer: CO2, semi-automatic, up to 6″ substrates METROLOGY In order to ensure process control and device characterization AMO has different measurement equipment available, for measuring diverse parameters, during processing as well as on the finished device. Typical parameters of interest during process control are e.g. layer thickness, layer roughness, layer composition, lateral dimensions and distances. Zeiss Supra 60 VP EDX High resolution SEM with automated CD control module up to 8″ substrates Veeco (DI) Dimension 3100 SPM: high resolution STM, AFM, MFM, up to 6″ substrates Veeco DekTak³ST surface profiler Leica INM 100 and INM 300: optical microscopes, up to 6″ substrates Philips PQ Ruby Ellipsometer, up to 8″ substrates J.A. Woollam spectroscopic Ellipsometer (M-2000U 245-1000nm) To verify device characteristics, both electrical and optical, AMO offers testing facilities to cover these demands. Measurement capabilities comprise the following: ELECTRICAL TESTING High end Parameter analyzer for small signal DC nanoelectronic device testing Cascade Microtech semi-automatic probe station Agilent Precision impedance analyzer (4294A) Agilent Semiconductor parameter analyzer (4156B) Agilent pA-meter (4140B) Agilent Precision LCR-meter (4284A) OPTICAL TESTING PRODUCTS & SERVICES AMONIL®: UV NANOIMPRINT RESIST INTERFERENCE LITHOGRAPHY GRATINGS SERVICES CLEANROOM FACILITIES CONTACT Dipl.-Ing. Herbert Kleinjans Technology Transfer +49 (0) 241 - 8867 125 kleinjans@amo.de DOWNLOADS FACTSHEET SERVICES FURTHER INFORMATION CONTACT FORM About AMO »People at AMO »Contact/Directions »Meet Us »Career @ AMO »News »Spin-offs Research »Graphene Electronics »Nanophotonics »Nanoimprint »Sensor Technology »Publications Products & Services »AMONIL® »IL Gratings »Services »Cleanroom Facilities General Terms| Imprint| Privacy Policy| Intranet We use cookies to ensure that we give you the best experience on our website. If you continue to use this site we will assume that you are happy with it. Ok Read more