OPTOI Microelectronics - Optoelectronics Italy ITA ENG HOME WHO WE ARE ORGANIZATION SERVICES PRODUCTS DOWNLOAD CONTACTS DESIGN PACKAGING CONSULTING MICROELECTRONIC PACKAGING The integration of micro-electronic, micro-mechanical and micro-optomechanical components into products and systems requires particular attention and expertise in the design and production of suitable packages or substrates. Optoi Microelectronics specializes in the so-called microelectronic packaging activities, which involve specific expertise in materials engineering (plastic, ceramic, glass, metal, composite materials, etc.), electromagnetic compatibility, radio frequency and optics , preparation and treatment of silicon substrates, microelectronic assembly and final testing of the devices. THE MAIN PACKAGE SOLUTIONS ARE THE FOLLOWING: Plastic SMD (Surface Mount Device) Metallic (TO-18, TO-46, TO-5, TO-8, etc.) Ceramics (DIL, CLCC, LTCC, etc.) COB (Chip On Board) CSP (Chip Scale Package) POP (Precision Optical Package) MCM (Multi Chip Module) Stack 3D (Module with 3D Stacked Multi Chip) Microsystems (for sensors and / or actuators and / or other integrated functions) THE MAIN MATERIALS USED ARE ALSO LISTED: Semiconductors (wafers and dies: silicon, EPI, SOI, gallium arsenide, germanium, etc.) Plastics (epoxy resins, silicone resins, polyurethane, etc.) Metallics (kovar, aluminum, steel, etc.) Ceramics (White alumina, glass, quartz, zirconia, black alumina, etc.) Composites (glass fiber reinforced, G200, FR4, Kapton, polyamide, Teflon, etc.) Come back upstairs © 2015 Optoelettronica Italia Srl | Via Vienna, 8 - 38121 Gardolo (TN) ITALY | Phone: +39.0461.99.11.21 | Fax: +39.0461.99.01.64 VAT number: 01486920224 | mail@optoi.com | Privacy & cookie policy | web by crisidellaprospettiva.com