IC MANUFACTURING COMPOUND SEMICONDUCTORS WAFER LEVEL PACKAGING TECH PAPERS COMPANY INVESTORS CONTACT Plating Systems For wafer level packaging applications High-performance plating Plating is a key step in wafer level packaging (WLP) because it significantly influences the quality and electrical performance of the final product. ACM’s advanced Ultra ECP ap and map plating systems complement our coaters, developers, etchers, scrubbers, etc., to provide virtually all the wet processing equipment that is needed for WLP. ACM’s electrochemical plating systems (developed since 1998) offer processing equipment for Cu, Ni and Sn/Ag plating, as well as vacuum pre-wet and post-clean modules. Our ECP systems perform many critical WLP plating steps including pillar, bump and RDL. The plating tools can also be used in fan-out, through silicon via (TSV) and through molding via (TMV) processes. The easy-to-use ACM plating systems provide uniform, high-speed plating using a specially designed process chamber that provides a strong and steady flow. The single-wafer, flat-type plating design also eliminates cross-contamination between baths. ACM has numerous patents, awarded and pending, in many areas of plating technology—such as multi-zone anodes for superior uniformity control, rubber-seal plating chucks for superior sealing and elimination of plate-out issues, and vacuum pre-wetting of wafers. Major Benefits Cu plating chambers: Separate anode chamber with membrane Soluble Cu anode Anode chamber auto-flush to simplify maintenance Sn/Ag plating chambers: Separate anode chamber with membrane Soluble Sn anode Anode chamber auto-flush to simplify maintenance Contact ring plate-out auto-detection Sn++ auto-replenish from anode to cathode Ni plating chambers: Separate anode chamber with membrane Soluble Ni anode Anode chamber auto-flush to simplify maintenance In-line temperature control In-line rinse heating up to avoid crystallization Au plating chambers: Separate anode chamber with membrane Anode chamber auto-flush to simplify maintenance In-line temperature control Automated additive dosing The additives of each electrolyte tank can be dosed automatically, controlled by amperage and/or bath time. Dosing pump and bottle volume are also recorded for timely refilling of the additive bottle. Anode auto-flush Faster, better, lower-cost automated anode chamber cleaning Increased uptime Elimination of human disassembly/reassembly errors Reduced chemical exposure, increased safety Features & Specifications 8” and 12” wafer compatible Main hardware configuration: 2-3 load ports EFEM with aligner and robot 1 process robot 4 pre-wet chambers, vacuum type 4 cleaning chambers 16-20 plating chambers: Cu, Sn/Ag, Ni Process capabilities: Uniformity: <5% (max-min/2 average) Within-die uniformity: <3% Wafer-to-wafer uniformity: <3% Repeatability: <2% COP: <2.0µm Throughput: 30 wafers/hour (pillar) Interested in Plating Systems? Contact Us News © 2021 ACM Research, Inc.. All rights reserved.