IC MANUFACTURING COMPOUND SEMICONDUCTORS WAFER LEVEL PACKAGING TECH PAPERS COMPANY INVESTORS CONTACT Scrubber Systems—Ultra C s For wafer level packaging applications Flexible, thorough, gentle scrubbing ACM’s Ultra C s scrubber systems are designed to perform one of the most important process functions in IC manufacturing–wafer cleaning. Employing ACM’s state-of-the-art wet-cleaning technology, these tools remove contaminants such as particles, residues and other unwanted surface defects that can cause fatal errors in IC devices. Commonly used by IC and wafer level packaging (WLP) manufacturers as well as research institutes, these scrubber systems can be used between virtually any two steps in the wafer manufacturing process. With high particle removal efficiency (PRE), ACM scrubber systems are able to effectively clean particles of all sizes without damaging the wafer—thereby increasing product yield, decreasing costs and increasing profitability. The system features exceptional customizability, ease-of-use and superior technology. Major Benefits Gentler N2 spray The N2 spray technology combines nitrogen and the desired cleaning chemical. The use of nitrogen ensures specific velocity of the atomized chemical to more effectively clean smaller particles. The atomized cleaning chemical is gentler on the wafer structure so as to avoid damage. SAPS™ advanced cleaning These scrubber systems can be equipped with our proprietary SAPS megasonic technology. ACM’s SAPS technology ensures unprecedented PRE, even with smaller particle sizes, without damaging the 2D flat wafer’s finer patterned structures. Customizable The tool is equipped with an N2 spray function, a high-pressure deionized water cleaning function, as well as a soft nylon brush function, allowing the user to easily change cleaning functions to suit their process requirements. Cost-efficient The ACM Scrubber tool contains filter systems that recycle chemicals, which decreases cost and waste. Precise temperature control ACM’s state-of-the-art Chemical Temperature Control System ensures that chemicals are always at the precise correct temperature before being released. Superior technology This scrubber tool uses leading-edge component systems such as high-precision wafer transfer systems, ultra-thin wafer handling capability, and independent control of the process environment for each chamber. Features & Specifications 8” and 12” wafer compatibility Process module: 1 to 4 single wafer chambers with: ULPA FFU in each cleaning chamber N2 atomizing spray nozzle in each cleaning chamber High-pressure DIW nozzle in each cleaning chamber Normal DIW nozzle in each cleaning chamber Brush in each cleaning chamber N2 nozzle for wafer drying 1 to 3 backside-cleaning nozzles Chemical and plumbing module includes CO2/DIW generator High pressure pump system Wafer transfer module includes 1 to 4 loadports Robot with 2 to 4 vacuum or mechanical robot arms ULPA FFU in robot bay Interested in Scrubber Systems? Contact Us News © 2021 ACM Research, Inc.. All rights reserved.