DOWNLOADS CAREERS ABOUT US CONTACT US LANGUAGE HOME EQUIPMENT WLP SERVICES CHEMISTRY NEWS & EVENTS Solder Ball Transfer HomeEquipmentSolder Ball Transfer Gang Ball Placement for Wafer & Panel Level Wafer Level Solder Balling is one of PacTech’s equipment platforms for solder deposition, covered by the Ultra-SB² machines. The Ultra-SB² is ideal for high yield and high volume wafer level solder balling applications. Of the two machines available, the Automatic Ultra SB² 200/300 is made for micro ball bumping for flip chip & wafer-level CSP, whereas the Semiautomatic Ultra SB²-200 is used for one-step solder ball placement on wafer level. Automatic Ultra-SB² 200/300 Micro Ball Bumping for Flip Chip & Wafer Level CSP more info Semi-automatic Ultra-SB² 200 Solder Ball Transfer on wafer level more info Contact Us Automatic Ultra-SB² 200/300 Semi-automatic Ultra-SB² 200 Sales Contact Thomas Oppert +49 (0)3321 4495 620 +49 (0)3321 4495 610 Get in contact: sales@pactech.de CONTACT Pac Tech – Packaging Technologies GmbH Am Schlangenhorst 7 – 9 14641 Nauen – Germany +49 (0) 3321 4495 – 100 info@pactech.de NEWSLETTER Name Email* SUBSCRIBE MENU Home Contact Us Terms & Conditions Sitemap Imprint Privacy Policy Facebook Youtube © PacTech - Packaging Technologies GmbH 2019. All Rights Reserved. We use cookies to ensure that we give you the best experience on our website. If you continue to use this site we will assume that you are happy with it.OkRead more