Services CEVA IP Markets Careers About Blog Contact Platforms for Semiconductor Design Reuseable functions across processing platforms & mixed signal systems. Intrinsix Platforms and semiconductor IP provide unique solutions that can be quickly brought to bear on customer projects. The two most direct and tangible benefits are in speeding time to market and predictability of schedule and outcome. This, in turn, drives down effective cost of development and, of course, accelerates time to revenue for Intrinsix customers. Intrinsix platforms consist of groups of semiconductor IP which have been pre-configured for a particular market or purpose. Often, the Design IP (whether represented by RTL or transistors in a particular process) is paired with Verification IP to create a development suite for that market. A critical aspect of the Intrinsix IP strategy is that we avoid marketing our IP as standalone products. This strategy frees us from typical “Not Invented Here” attitudes and positions our solutions as agnostic in regards to IP choices. Our customer’s view of Best-in-Class price/performance wins the day. Every day. With this approach, we are able to partner with all providers of IP, such as EDA companies and boutique IP companies. New solutions and options appear all of the time and Intrinsix strategy ensures a level playing field for our customers and their choices. Most of the Platforms and IP offered has been derived from focused internal R&D, funded solely by Intrinsix. But a significant portion also comes directly from Intrinsix participation in the Small Business Innovate Research (SBIR) program. This program funds companies to create compelling solutions for government and commercial advancement. Check out our SBIR and Patents page for a complete list. Platforms and IP Collections AIB PHY IP and Services AMBA SoC Design and Verification Platform ARM-AMBA Components Analog & Mixed Signal Jump-Start Kit Cryptographic IP Cores for IoT PWM Regulator IP Sigma-Delta Refinery Sensor Data Acquisition Platform IoT Platform ROIC & Imaging Technology ROIC Technology for Demanding Imaging Applications New innovations in ROIC technology are available from Intrinsix - a leader in advanced imaging chip design services. The offerings address modern imager challenges such as Signal to Noise (SNR), Dynamic Range (DR), conversion efficiency (watts/bit/sec) and DC scene “skimming”. The architectures are applicable to cooled (70K) or uncooled photodiode detectors (monolithic, BSI, hybridized), and micro-bolometers (continuous or pulsed). Current offerings are briefly described below, with example size/process node data points: Serpentine Sigma-Delta Modulator based ROICs High SNR applications Moderate frame rates Rolling shutter – programmable integration time Configurable Preview & Foveal low power modes 92dB SNR at 48nW / pixel / sec 58dB SNR at 26nW / pixel / sec Independent Primary and Redundant signal paths 15um pixel pitch in 180nm CMOS Targeting Very High Dynamic Range Imaging Applications (>16 bit) Leverages Intrinsix Sigma Delta IP Per-pixel Log2ADC based Digital Focal Plane Array (DFPA) High Dynamic Range, High Frame Rate applications 126dB DR at 1000FPS (1920x1080) Moderate SNR (~75dB) over eight octaves Continuous integration (global frame shutter) Digital 16bit log2 integration 13bit mantissa, 3bit radix Optional IIR noise filter and orthogonal TDI 12um pixel pitch in 55nm CMOS In-pixel Correlated Double Sampling Small, six transistor (6T) implementation of CDS pixel Single non-floating-diffusion capacitor used for offset and signal sampling CDS removes photodiode bias offset allowing signal gain to be applied yielding 2V output on 3.3V supplies Two color (N-on-P & P-on-N) variant using 8T pixel 10um pixel pitch in 180nm BSI CMOS Adaptive self-heating polynomial estimation and correction Pulsed micro-bolometer applications Iterative (averaged) polynomial estimation of self-heating based on “shunted” micro-bolometers Dynamic polynomial Bias compensates for PVT effects Enables dynamic offset cancellation before signal gain to extend TEC-less operational range OUR SERVICES Services Overview SoC, ASIC & FPGA Mixed-Signal & RF RF and Millimeter Wave Metrics-based Verification Physical Design & Silicon Realization Ready to Get Started? 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