DOWNLOADS CAREERS ABOUT US CONTACT US LANGUAGE HOME EQUIPMENT WLP SERVICES CHEMISTRY NEWS & EVENTS WLP Services HomeWLP Services PacTech’s Wafer Level Packaging PacTech’s Electroless Nickel Technology is recognized throughout the industry as the highest quality process with the widest product flexibility. These technologies include: Ni/Au and Ni/Pd for Under-Bump-Metallization, tall Ni/Au for ACF and ACA bumping, and Ni/Au and Ni/Pd/Au for pad re-metallization (OPM for wirebonding). PacTech offers several technologies for solder deposition including Single sphere solder jetting using PacTech’s SB² Laser based Bumping tools, and complete wafer bumping using PacTech’s Ultra-SB² Solder Sphere Transfer equipment. The combination of these technologies allows PacTech to provide the widest product offering in the industry; servicing the ASIC, Foundry, Military, Medical, Aerospace, Consumer, Telecommunication, Memory, MEMS, Probe Card, and Hard Disc Drive industries. To facilitate being a full service provider, PacTech offers a complete set of additional wafer level and backend services, including: sawing, dicing, redistribution, repassivation, backside laser marking, backside coating, test die, and assembly. In addition, PacTech owns the latest metrology and analytical equipment to help in the development and production processes, including: x-ray, shear test, AOI, ICP, AA, probing, high speed ball pull, chemical analysis, etc Wafer Level Bumping (Flip Chip and WLCSP) Wafer Level Backend Processing and Assembly Solder Jetting & Deballing / Reballing Contact Us General Overview Solder Bumping Wafer Level Redistribution Flip Chip Test Wafer Test Wafer Pac 2.0 Test Wafer Pac 2.3 Test Wafer Pac 2.7 Wafer Level Photoresist / BCB Coating Wafer Level UBM Plating Electroplating Electroless Plating Wafer Backside Metallization Bonding / Assembly Wafer Thinning Wafer Sawing Die Sort CONTACT Pac Tech – Packaging Technologies GmbH Am Schlangenhorst 7 – 9 14641 Nauen – Germany +49 (0) 3321 4495 – 100 info@pactech.de NEWSLETTER Name Email* SUBSCRIBE MENU Home Contact Us Terms & Conditions Sitemap Imprint Privacy Policy Facebook Youtube © PacTech - Packaging Technologies GmbH 2019. All Rights Reserved. We use cookies to ensure that we give you the best experience on our website. If you continue to use this site we will assume that you are happy with it.OkRead more