English (EN) Services Contact Menu Anodic Bonding EV Group Technologies Anodic Bonding Anodic Bonding Anodic bonding for interlayer free Si-glass bonding Introduction Features Introduction Anodic bonding is a technique to produce hermetic sealing between silicon/metals and glass insulators without using an intermediate layer. Borosilicate glass with high alkali ion concentration is a major requirement for this process. Different from other bonding techniques, anodic bonding involves heating and applying an electric field to the substrate materials. Anodic bonding is also called field assisted bonding or electrostatic sealing. A clean wafer surface and atomic contact between the substrates is required for anodic bonding. Bonding takes place when the wafers are placed between the chuck and the temperature is increased to just below the glass transition temperature of glass, followed by applying electric potential of several hundred volts. After reaching a certain temperature, the oxides dissociate and alkali ions are driven into the glass by an electric field resulting in an oxygen-rich layer at the interface of the wafers. Oxygen ions are driven into the silicon surface by the electric field resulting in the formation of silicon dioxide. With specific applied pressure and voltage, the total bond process time is between 5 to 20 minutes. Features Hermetic sealing Stable bonding Bonding below 4500C Low restrictions for Si surface High bond yield Events SEMICON Europa 2021 MESSE MÜNCHEN | Co-located with Productronica 16.11. - 19.11.2021 Munich, Germany SEMICON Japan 2021 Venue: Tokyo Big Sight/Online 15.12. - 17.12.2021 Tokyo, Japan Show all events Related downloads EVG Solutions for MEMS Brochure - 2.28 MB EVG Solutions for Bio- and Medical Technology Brochure - 2.03 MB EVG GEMINI® Series Brochure - 2.12 MB EVG® 500 Series Brochure - 1.83 MB EVG Solutions for R&D Brochure - 1.66 MB Talk to our EVG technology experts! Questions? Contact form Related products EVG®501 Wafer Bonding System EVG®510 Wafer Bonding System EVG®540 Automated Wafer Bonding System GEMINI® Automated Production Wafer Bonding System EVG®560 Automated Wafer Bonding System Questions about our technologies? Contact the EVG experts Send us a message Related News From wafers to power electronic applications: new consortium to create European supply chain for silicon carbide semiconductors Oct, 2021 EV Group Celebrates “40+1 Year” Anniversary with Exciting Live Event at Corporate Headquarters Sep, 2021 Applied Materials Introduces New Technologies and Capabilities for Accelerating the Semiconductor Industry's Heterogeneous Integration Roadmap Sep, 2021 EV Group Products Technologies Company Careers Social Media LinkedIn Facebook Twitter YouTube Join our newsletter We will send you updates on new products and technologies. Your Email Subscribe © 2021, EV Group (EVG) Imprint Privacy Policy Terms of use