VHS-P VERTICAL PANEL PROCESSING VHS-P VERTICAL PANEL PROCESSING Our newest platform was introduced in 2016 to process panels larger than 300x300mm² in vertical chambers. Where the high -speed plating system allowed us to achieve already superior uniformity and plating speeds on single wafer substrate in a horizontal configuration, the vertical chamber is where this system truly shines. PLATING ELECTROLYTE Through careful and uniform injection of the plating electrolyte near the surface and the linearization of the electric field at the same time, it is the only system that makes fine line plating feasible on large / very large substrates. PHOTORESIST STRIP/DEVELOP AND UBM ETCH Knowing that plating is just one step in the whole wet process of the panel, we also offer a complete photoresist strip / developer and seed and barrier layer etch program to enable all kinds of RDL (redistribution layer) processes for your packaging needs. VHS-P CUSTOMER ADDED VALUES The ideal platform for fine-line plating on large substrates up to Gen5.1 Customized to our customer’s needs Two substrates processed at once per chamber for higher throughput Full suite of wet processes for RDL packaging applications Modular platform Upgrade- and future-proof Highly innovative new wet processes Established high-throughput processing chambers VHS-P HIGHLIGHTS Processing of 300x300mm² up to Gen5.1 substrates Deposition of extremely uniform metal structures. Patented High-Speed Plating for better throughput and better uniformity – without changing the chemistry Industry 4.0 ready – control and monitor all process parameters Plating uniformity 5% or better Etch uniformity 5% or better Online dosing system Online chemical monitoring Online gas detection for safety Multipoint end-point detection for many etch processes APPLICATIONS ELECTRO CHEMICAL DEPOSITION Cu RDL layer Cu tall pillar Cu Bumb Cu –Ni- SnAg , Cu-SnAg Cu- Ni- Au Au, Cu TSV Au pillar In SURFACE PREPARATION Resist develop Resist strip Seed layer etch Barrier layer etch OSP Cu seed e-less Cleaning Cu roughening SEMSYSCO HQ. Europe | Austria | Salzburg Karolingerstraße 7c 5020 Salzburg T: +43 662 222 10 F: +43 662 222 180 Mail: office@semsysco.com Company Vision & Mision History Solution by competence Management team Philosophy Related Products Galaxy Triton VHS-P Members of © Copyright 2018 - Semsysco GmbH | created by werbezeit Download Area Privacy policy Imprint Career By continuing to browse the site, you are agreeing to our use of cookies. OKLearn more