TE Connectivity Products Industries & Solutions Sign In PRODUCT UTILITIES Electrical Models and Simulation ENABLING BETTER PRODUCTS Using 3-D modeling tools, we design, model and verify products to provide optimum high-speed performance, giving you the competitive advantage every time. CONNECT WITH US ELECTRICAL MODELS TECHNICAL DOCUMENTS MODEL INFORMATION MECHANICAL MODELS CREDENTIALS Experienced design, documented solutions, and signal integrity. Our experience in component-level simulation has enabled us to continue to provide industry-leading electrical models. As an active participant in industry-wide activities, we provide technical references and innovative solutions for a variety of system design challenges. We recognize that signal integrity continues to be a growing industry driver in high-speed designs. We are committed to pioneering new products and tools that meet the growing demand. Our circuits and design team has the expertise to engineer, layout, and build your proprietary high-speed point-to-point and bussed systems. We have built numerous reference designs, including full system design and layout for finalized products for companies such as Texas Instruments, Lucent, AMCC, and Vitesse. Since our backplanes and interconnection systems run at gigabit speeds that can present unique challenges to designers, our proprietary broadband lossy-line models give more accurate insight into the influence of skin effect and dielectric losses on waveforms. This means we can help optimize your gigabit design based on the performance of actual devices. Additionally, we have worked closely with leading semiconductor vendors to characterize signals, identify noise levels, and define requirements for noise margins in the interconnection system. Our circuits and design team maintains an extensive library of high speed multi line connector models – and we offers test capability to 67GHz and 12.5 Gbps, using advanced calibration and de-embedding techniques. Our expertise separates us from the competition; we are ready to start working on your simulations. ELECTRICAL MODELS Choose Your Model Documents Published in English Backplane and Right Angle Mezzanine and Stacking Coplanar and Docking I/O Modules and Cables Card Edge, Sockets and Memory CAD Allegro TECHNICAL DOCUMENTS We are actively involved in the industry by researching and providing state-of-the-art electrical performance reports, general reports. and reference designs. These free resources cover such topics as alternate PCB materials, 5 and 10 gigabit system design, nanosecond discontinuities, and optical backplane implementation. Search Our Documents Documents Published in English Performance Reports Routing and Application Guides Conference Papers MODEL INFORMATION Electrical expertise – at your service. High speed links need to be designed on time and on budget. This is where our circuits and design services can help. Our goal is to apply system-level expertise to design, simulate, and verify a system that meets your performance goals. We provide the modeling skills and techniques, assortment of proven tools and ground-breaking solutions, and an extensive library of product models that can streamline your engineering process. Accomplished in completing hundreds of system designs and experienced in system layout, design, and simulation, we are ready to go to work for your design. Multi Line Model (MLM) Represents several lines of the connector, and includes the contact components, contact to contact couplings, and where applicable, includes contact to shield couplings, and inter-pad couplings. This results in a detailed model that can be used for simulating crosstalk and ground bounce in addition to the parameters analyzed with the Single Line Model (SLM). Due to the contents of these models, TE requires the following agreement for use. Single Line Model (SLM) Represents the effects of one line of a connector wired appropriately for high speed signal transmission (typically near-by contacts grounded). The model includes the lumped elements representing the series resistance, "effective" inductance and the total capacitance for one line. It also includes the impedance (Z 0 ) and propagation delay (t pd ) for the transmission line equivalent. This model can be used for simulating reflections, time delays and skew, attenuation and signal transmission quality. S-Parameters Contains a matrix of frequency based data. These models are extremely versatile and can be used in time-domain transforms to generate impedance, crosstalk, propagation delay and eye-patterns, or they can be used in frequency-domain simulations for throughput and crosstalk. All files are provided in Touchstone format, which is compatible with many simulation software packages. IBIS Models Currently, we do not support IBIS models. Our models are written in SPICE notation. To the best of our knowledge, our MLMs do not translate directly into IBIS. We encourage you contact your software vendor and/or the IBIS committee for insight into these translations. In the past, our SLMs have been successfully converted into IBIS models. For help with IBIS models, visit he ANSI/EIA-656-A homepage. You will find resources needed to assist you in converting our SLM's into IBIS models. Since we do not support IBIS models, we do not have the support needed to qualify your results from the conversion from SPICE to IBIS. MECHANICAL MODELS We can engineer, layout, and build your proprietary high speed point-to-point and bussed systems. Our experience includes reference designs for companies such as Texas Instruments, Lucent, AMCC, and Vitesse. We also provide full system design and layout for finalized products. Mechanical Models Email us your model requirements. CREDENTIALS Precision is critical in your industry. To ensure a successful implementation of your design, we team with silicon partners to develop simple, turn-key solutions. Industry Standards TE has an active involvement with these committees: PCI-Express Advanced TCA (PICMG 3.X) Cellbus Fibre ChannelFirewire 1394 Gigabit Ethernet and 10GEA Hyper Transport Infiniband PCI-X, CPCI and subcommittees RapidIO VME SIGNAL INTEGRITY MODEL GENERATOR Create a custom PCB Stackup model using TE's Signal Integrity Model Generator. Requires secure access. 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