HOME ABOUT US MARKETS PRODUCT LINES LOCATIONS CONTACT US NEWS UPDATE English AVX Releases New UBC 550 Series Ultra-Broadband Capacitors FOUNTAIN INN, S.C. May 20th, 2021 Optimized for high-performance, ultra-broadband microwave and millimeter-wave RF applications, the new UBC 550Z, 550U, and 550L Series capacitors have a rugged and compact single-piece, surface-mount, multilayer ceramic construction and exhibit ultra-low insertion loss, excellent return loss, flat frequency response, and high repeatability. FOUNTAIN INN, S.C. (May 20th, 2021) – AVX Corporation, a leading manufacturer and supplier of advanced electronic components and interconnect, sensor, control, and antenna solutions, has released new UBC 550 Series ultra-broadband capacitors designed to deliver reliable, repeatable performance from 16KHz to 70+GHz in ultra-broadband microwave and millimeter-wave RF applications with stringent operating requirements. The new UBC 550Z, 550U, and 550L Series ultra-broadband capacitors have a rugged and compact single-piece, surface-mount, multilayer ceramic construction made of the highest quality, RoHS-compliant materials and exhibit ultra-low insertion loss, excellent return loss, flat frequency response, and high unit-to-unit repeatability. These characteristics make the series ideally suited for use in DC blocking, coupling, bypassing, and feedback applications within optoelectronics, high-speed data networks, transimpedance amplifiers, broadband test equipment, synchronous optical networks (SONET), transmit and receive optical subassemblies (TOSA and ROSA), and other ultra-broadband microwave and millimeter-wave RF applications. For more information: https://www.avx.com/news/ubc-550-series-ultra-broadband-capacitors Newer Post > < Older Post Melexis announces a 20 W low noise single coil fan and pump driver for automotive applications Tessenderlo, Belgium, 18 March 2021 Melexis, a global microelectronics engineering company, introduces the MLX9041 2-L as the automotive variant of the already well established MLX90412 . Micron’s Low-Power DDR5 DRAM Boosts Performance and Consumer Experience of Motorola’s New Flagship Edge+ Smartphone April 22, 2020 at 12:00 PM EDT Collaboration key to unlocking the full potential of 5G in mobile devices BOISE, Idaho and CHICAGO, April 22, 2020 (GLOBE NEWSWIRE) -- Micron Technology, Inc. (Nasdaq: MU), together with Motorola, today announced integration of Micron’s low-power DDR5 (LPDDR5) DRAM into Motorola’s new motorola edge+ smartphone, bringing the full potential of the 5G experience to consumers. Micron and Motorola worked in close collaboration to enable the edge+ to reach 5G network speeds that require maximum processing power coupled with high bandwidth memory and storage. With 12 gigabytes (GB) of industry-leading Micron LPDDR5 DRAM memory, motorola edge+ delivers a smooth, lag-free consumer experience. The new phone takes advantage of the faster data speeds and lower latency of 5G to increase the performance of cloud-based applications such as gaming and streaming entertainment. “Our collaboration with Motorola on its flagship smartphone highlights the importance that mobile device manufacturers are placing on next-generation memory solutions that provide higher performance and richer consumer experiences,” said Dr. Raj Talluri, senior vice president and general manager of the Mobile Business Unit at Micron. “This announcement underscores how the mobile industry is coalescing behind Micron’s LPDDR5 for 5G flagship smartphone designs.” Quectel unveils SA800U-WF smart module December 4, 2020 ﻿ Quectel Wireless solutions has launched its SA800U-WF premium smart module which features a built-in Android 9.0 or 10.0 operating system (OS). Show More - ﻿MISSION STATEMENT - HEAD OFFICE 1015 Matheson Blvd., Unit 6, Mississauga, ON, Canada L4W 3A4 905-238-0366 Tech-Trek.com | Priva﻿cy Policy | © Copyright 2020, Tech-Trek Inc. | Site Design by GALEdesignGroup.com