menu Home Applications Integrated Circuit Packaging, Assembly and Test Electronic Gases Integrated Circuit Packaging, Assembly and Test Leveraging our unique and innovative technologies that help you enhance competitiveness The electronics packaging and assembly industry is constantly adjusting to satisfy the requirements of the newest generation of semiconductors. Smaller footprint device sizes, 2.5D and 3D TSV packaging are just some of the changes that have occurred. With these changes come challenges to the manufacturing process, so how to use and control of nitrogen or hydrogen-based atmospheres is critical to achieve the best performance. Air Products’ expertise, technologies and gas supply advantages can provide improved performance and up-time, while reducing defects and total cost of ownership for your integrated circuit board assembly and test processes. download-circle Download Electronics brochure Overview Benefits Gases Services Ask the Expert Resources CONTACT US Global leading gas supplier for IC Packaging, Assembly and Test Our core capabilities of product, equipment, and service include: Various supply modes, including onsite generation, liquid bulk and microbulk supply Bulk gases including, nitrogen, oxygen, hydrogen, helium and argon Ultra high purity process gases and gas mixtures Design, manufacture and installation of all related equipment Excellent record of meeting on-time needs Industry leader in safety Technical expertise World-class customer service A cost-effective method to reflow your bumped wafers If you need to improve your productivity and lower your costs, then consider our fluxless Electron Attachment solution, which uses non-flammable hydrogen and nitrogen blends to replace traditional flux chemistries for wafer-level packaging. Gases Air Products gases, typically provided in gaseous and liquid form, enable customers in a wide range of industries to improve their environmental performance, product quality, and productivity. Argon Compressed argon gas and liquid argon in a variety of purities and in various modes of supply around the world thanks to our network of storage and transfill facilities. Carbon Dioxide Our experienced applications teams across the globe can use their industry and application knowledge to provide you with a compressed or liquid carbon dioxide supply and technology solution to meet your unique needs. Helium An inert gas for cryogenic, heat transfer, shielding, leak detection, analytical and lifting applications Hydrogen Valued for its reactive and protective properties, and used by many industries such as electronics, foods, glass, chemicals, refining and more can benefit from its unique properties to improve quality, optimize performance and reduce costs. Nitrogen Useful as a gas, for its inert properties, and as a liquid for cooling and freezing. Virtually any industry can benefit from its unique properties to improve yields, optimize performance and make operations safer. Oxygen In addition to its use as a respiratory gas for healthcare applications, its strong oxidizing properties benefit many industries by improving yields, optimizing performance, lowering costs and reducing carbon footprint compared to other fuels. Atmosphere optimization services to improve your soldering processes Looking to improve your process? Utilizing knowledge applied at our worldwide customer base, Air Products’ global team conducts on-site audits to evaluate your manufacturing process and address your concerns. The site audit can provide realistic process cost savings and improvements, including recommendations for improving uptime, achieving higher productivity, and lowering manufacturing costs, as well as process enhancements that can be achieved through optimized gas usage. CONTACT US Ask the Expert We are experiencing poor underfill flow in our flip chip assemblies. What is the possible cause and is there a solution that can be implemented to improve our underfill process? Poor underfill flow is a common concern in flip chip assembly and is due to several issues. The predominate problem is contaminates left behind post reflow assembly. The primary contaminate is flux residue. Although you may clean the assembly post reflow, the likelihood of flux left behind is high. Most fluxes will polymerize during the reflow process in air or high O₂ ppm level (>500 O₂ ppm). Current cleaning processes may not be efficient enough to remove all the residue under the flip chip. The key is to use an inert atmosphere, such as nitrogen or argon, to eliminate high O₂ levels. The high O₂ levels will cause the flux to polymerize and be difficult to clean. Read more... FAQS ASK A QUESTION Questions? We've got answers. Our technical team is here to help you. Book a free consultation today! CONTACT US RESOURCE CENTER ap0104-download DOWNLOADS Fluxless Soldering in Activated Hydrogen Atmosphere Production-scale Flux-free Bump Reflow Using Electron Attachment Fluxless Soldering Using Electron Attachment (EA) Technology Production-Ready, Flux-free Bump Reflow System With Activated Hydrogen MORE RESOURCES This website uses "cookies" to store information on your computer. Some are important for our website to function properly; others help us understand our users better. By accessing the website, you agree to the use of these cookies. Read our privacy notice. 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