Search 978-568-1330 HOME ABOUT PRODUCTS CAPABILITIES TECHNICAL DATA NEWS REQUEST A QUOTE CONTACT The lapping process is used to provide flatness, parallelism, thickness identity, and surface finishes to extremely demanding tolerances. Precision Lapping Capabilities Centerline Technologies uses free abrasive lapping processes to provide flatness, parallelism, thickness identity, and surface finishes to extremely demanding tolerances. In the free abrasive machining process, an abrasive (various compounds) mixed into the selected slurry is applied to a lap. The work part is placed on top of the lap in fixtures and both the lap and work plates are moving. This creates the cutting action/material removal at a controlled rate. Using various methods and unique processes, Centerline can finish pieces without introducing stresses and heat damage associated with other processes, such as grinding. The selection of abrasive, pressure, speed of machine and shape of the lap all play a critical role in the outcome of your finished product. Using SPC processes, the controls at Centerline Technologies will provide you with a repeatable product from one lot to the next, again and again, time after time. Here at Centerline Technologies we use single and double sided lapping, and you can rest assured that we will recommend the processes that will benefit your product the most, and to provide the highest quality at the most economical rate. Request a Quote Technical Support Download Page as PDF Die Level Lapping & Polishing - for parts as small as 7mm Back-Lapping - to change the mechanical, electrial or optical properties of the material Material Surface Finish (u-inches) Thickness Tolerance Applications As-Fired 99.6% Alumina < 4 u-in +/- 10% or +/- 5% Use for low to medium power DC & RF circuits Polished 99.6% Alumina 10 u-in nominal +/- .0005" Use for low to medium power RF & Microwave circuits Lapped 99.5% Beryllium Oxide 20-30 u-in +/- .0005" Use for high power DC/RF/Microwave circuits Lapped Aluminum Nitride 12 - 20 u-in nominal +/- .0005" Use for higher power DC/RF/Microwave circuits Lapped Fused Silica 10 u-in nominal matte finish +/- .0005" Use for high frequency circuits requiring extremely low loss performance Lapped Titanates 15-30 u-in +/- .0005" RF & Microwave circuits requiring high Q Products Alumina BeO Aluminum Nitride Fused Silica/Quartz Sapphire Shop Our Store Capabilities Lapping Polishing Filled Via Planarity Diamond Sawing Laser Machining Specialty Processes Quality Control Small Quantities Technical Data Conversion Tool About Us Why Polish Substrates? Customers News Quality Control Careers Contact Centerline Technologies, LLC 577 Main Street Suite 270 Hudson, MA 01749 Call: 978-568-1330 Fax: 978-568-1334 End-to-End Encryption, Powered by Worldpay © 2021 Centerline Technologies