English (EN) Services Contact Menu Temporary Bonding and Debonding EV Group Technologies Temporary Bonding and Debonding Temporary Bonding and Debonding Temporary bonding and debonding enabling backside processing for 3D integration Introduction Features Figures Introduction Temporary bonding is an essential process to offer mechanical support for thin or to-be-thinned wafers, which are key for 3D IC, power device and FoWLP wafers, as well as for handling fragile substrates like compound semiconductors. EVG’s outstanding bonding know-how includes temporary bonding equipment, which has been provided by the company since 2001. EVG’s open adhesive platform supports all commercially available materials, offering full process integration for temporary bonding and debonding. Adhesives are mainly classified by their debonding mechanism (weakening the adhesive bond between the device and carrier wafer), which is based on laser, mechanical force or temperature. Slide-off and lift-off debonding mark the starting point of temporary bonding at EVG with more than 20 years of experience. More recent developments of mechanical and UV-laser-initiated debonding are combined in EVG’s LowTemp debonding process, where the debond temperature is around room temperature. Especially for recent developments in advanced packaging, LowTemp debonding technologies are essential steps to enable back-side processing of silicon as well as the production of ultra-thin chips and packages for next-generation devices. Features Open adhesive platform Modular tool layout – throughput optimized depending on specific process Bridge capability for different substrate sizes Available with multiple load port options and combinations Integrated metrology enables feedback loop for high-yield processes in automated tools Software monitoring of the whole process Fully integrated SECS/GEM interface in automated tool Figures EVG’s supported debonding technologies. Temporary bonding process flow. Events SEMICON Europa 2021 MESSE MÜNCHEN | Co-located with Productronica 16.11. - 19.11.2021 Munich, Germany SEMICON Japan 2021 Venue: Tokyo Big Sight/Online 15.12. - 17.12.2021 Tokyo, Japan Show all events Related downloads EVG Solutions for Temporary Bonding and Debonding Brochure - 2.03 MB Related links ASTronomy EuROpean Infrared Detector - Successful Laser Debonding Talk to our EVG technology experts! Questions? Contact form Related products EVG®620 NT Smart NIL® UV Nanoimprint Lithography System EVG®6200 NT SmartNIL® UV Nanoimprint Lithography System EVG®720 Automated SmartNIL® UV Nanoimprint Lithography System EVG®7200 Automated SmartNIL® UV Nanoimprint Lithography System IQ Aligner® Automated UV Nanoimprint Lithography System EVG®770 Step-and-Repeat Nanoimprint Lithography System HERCULES® NIL Fully Integrated SmartNIL® UV-NIL System EVG®40 NT Automated Measurement System Questions about our technologies? Contact the EVG experts Send us a message Related News From wafers to power electronic applications: new consortium to create European supply chain for silicon carbide semiconductors Oct, 2021 EV Group Celebrates “40+1 Year” Anniversary with Exciting Live Event at Corporate Headquarters Sep, 2021 Applied Materials Introduces New Technologies and Capabilities for Accelerating the Semiconductor Industry's Heterogeneous Integration Roadmap Sep, 2021 EV Group Products Technologies Company Careers Social Media LinkedIn Facebook Twitter YouTube Join our newsletter We will send you updates on new products and technologies. Your Email Subscribe © 2021, EV Group (EVG) Imprint Privacy Policy Terms of use