EN Company About onsemi Quality & Reliability Environmental Programs Tin Whiskers Tin Whiskers Mitigation Strategies Changing the lead plating material to 100% matte Sn (tin) from SnPb raises industry concerns about tin whisker growth. onsemi has implemented the following mitigation strategies to minimize the occurrence of tin whiskers. Increased the plating thickness from 5 µm to 7.5 µm minimum; 10 µm nominal. Implemented a post - plate anneal of 150 ° C for 1 hour within 24 hours of plating Implemented strict plating process controls Whisker Testing onsemi has conducted tin whisker testing following the guidelines of JEDEC standard JESD22A121. Testing has been conducted on packages utilizing Alloy 42 and Cu leadframe materials with matte tin lead finish. Three test conditions have been used to evaluate whisker growth: Temperature Cycling (-55/+85°C) Ambient Storage at 30°C/60%RH, and High Temperature/High Humidity Storage at 60°C/87%RH. onsemi's internal whisker acceptance spec is 50µ maximum length. All whisker test results to date have passed this spec. Baseline tin whisker test results available for onsemi assembly sites. Click on each report to download. Tin Whisker report for onsemi site in Leshan using matte tin plating over Alloy42 leadframe Tin Whisker report for onsemi site in Seremban using matte tin plating over Alloy42 leadframe Tin Whisker report for onsemi site in Seremban using matte tin plating over Copper leadframe Tin Whisker report for onsemi site in Carmona using matte tin plating over Copper leadframe Tin Whisker Application Note Connect with us Language About onsemi Quality & Reliability Leadership Ecosystem Partners Fact Sheet Intellectual Property Locations Investor Relations Governance Events News Financials Stock Info Resources News & Media Press Announcements In The News Blog COVID-19 Business Updates Media Contacts Image Library Careers University Relations Search Jobs Support Technical Support Sales & Distribution Support Frequently Asked Questions Contact Us Community Forums Accessibility Terms of Sale Do Not Sell My Personal Information Terms of Use Privacy Cookie Policy Site Map © Copyright 1999-2021 Semiconductor Components Industries, LLC Cookies on onsemi We’ve put some small files called cookies on your device to make our site work. We’d also like to make use of optional analytics & marketing cookies. These send information about your device to onsemi & our advertising partners. We use this information to improve your experience on our site, personalize content and advertising, and analyze our site traffic. Read Our Cookie Policy May we use optional analytics & marketing cookies to better serve you? Reject Optional Cookies Accept Optional Cookies