www.cspi.com/multicomputer/ Learn more SEARCH IN SITE LOGIN (800) 325-3110 ABOUT US SOLUTIONS SUPPORT & SERVICES NEWS CONTACT TeraXP 300 SOLUTIONS TeraXP OpenVPX Embedded Servers FastCluster 0pen Platforms KeyDSP Commercial HPC Solutions Myricom Networking Solutions Software Storage ATCA OpenVPX 3220Q GPP 3300GTX GPGPU TeraXP Development Platform TeraXP 300 VXS VME PRODUCT DETAIL Block Diagram Download Datasheet RELATED PRODUCTS Software RELATED TECHNOLOGIES Converged Fabric OpenVPX VITA 66 (Optical Interconnect) InfiniiBand My path: Multicomputer Solutions OpenVPX TeraXP 300 KEY FEATURES Intel® Xeon® Processors for High Performance dual socket SMP operation with QPI Technology NVIDIA GPU co-processors FDR InfiniBand™ technology with 56 Gbit/s Host Channel Adapters 10/40GbE & Fibre Channel technologies VPX Backplane with new VITA 66.1 Optical Interconnect TeraXP 300 The TeraXP™ family of OpenVPX Embedded Servers addresses critical high performance embedded computing (HPEC) requirements in a compact, rugged grade, air-cooled or liquid/conduction-cooled chassis designed for deployment where reduced size, weight and power (SWaP) are imperative. The commercial grade air-cooled TeraXP 300 is a six slot VPX system that can be confi gured with up to three TeraXP servers. The system hosts 3000 SERIES OpenVPX payloads with powerful Intel® Xeon® processors, NVIDIA GPU co-processors, the latest FDR InfiniBand™ technology, a VPX backplane with the new VITA 66 Optical Interconnect, and a non proprietary software stack protecting development investments. Request more info or click the tabs in the tabel below for more detailed product information. HARDWARE SPECIFICATIONS SOFTWARE SPECIFICATIONS TeraXP 300 Commercial Grade Servers Up to 3 TeraXP SMP Servers Backplane 6-Slot VPX (VITA 65) Backplane for configuring 3000 SERIES 6U OpenVPX Payloads. Slots 2, 4, and 6 populated with a VITA 66.1 Connector on P6 supporting the InfiniBand Fiber Data Plane Supported Payloads 3220Q (Intel® Xeon® GPP) VPX REDI Type 1 & 2 3300GTX (GPGPUs) VPX REDI Type 1 & 2 3300 (InfiniBand Carrier) 3200 (PCIe XMC/PMC Carrier) Environmental Operating Temperature 0ºC to 40ºC (inlet air) Storage Temperature -40ºC to 85ºC (inlet air) Humidity 5% to 93% Non-condensing General Compliance VITA 46/48.1 REDI to support cooling Electrical Power Supply Astec iMP 1500 Watts Input Voltage 85-264 VAC Frequency 47-440 Hz Physical Dimensions Height 17.22 inches (437.39 mm) Depth 18.56 inches (471.42 mm) Width 11.92 inches (302.77 mm) Weight Will vary depending upon the configuration Slot Pitch 1.0" Copyright © 2014 - CSP Inc. Billerica MA, 01821, Phone: (978) 663-7598 | Fax: (978) 663-0150 Florida Web Design