SCHOTT Electronic Packaging (english) change Visitors from North America, please click here... Global Home|follow SCHOTT|Contact About Us Products Applications Technologies Information You are here:Global Home › SCHOTT Electronic Packaging › Products › GTMS & CerTMS › Microelectronic/ Hybrid Packages and Multilayer Ceramic Substrates Microelectronic/ Hybrid Packages and Multilayer Ceramic Substrates Hermetic microelectronic packages, also often referred to as hybrid packages, multi-chip module housings or IC packages are used to ‘package’ and thereby protect sensitive electronic components and complete electrical assemblies from harsh environmental conditions, including high temperature-, shock- and vibration-resistance. At the same time, the vacuum-tight housings and substrates must enable power and signal transmission (electrical and optical) into/ out of the package. Hermetically sealed microelectronic housings and ceramic multilayer substrates are essential to both protect and facilitate the reliable, long-term functionality of sensitive measurement or control electronics in a variety of harsh-environment applications: Defense, Aviation and Aerospace applications: microwave power amplification in aerospace communication, e-Scan radar (TRM transmit and receive modules, microwave and power supply systems), laser warning receivers, cooled IR detection, uncooled IR detection or high-temperature sensors, and more Industrial applications, including sensors, geotectonics, measurement equipment, chemical engineering equipment, and more Oil & Gas applications, for example Wireline and MWD electronics (MWD: measure while drilling) Electronics (motor controllers), and more Medical electronics, including medical treatment and diagnosis systems, and more. ...our products: Multi-Pin MCM Packages - Hermetic IC Packages - Microwave Packages - Amplifier Packages - RF Packages - Power Packages with high thermal conductivity - Fine-Pitch HTCC Substrates and Circuit Boards - Dewar Flanges - TO headers and caps - and many more. Custom-Made Hermetic Fine Pitch HTCC Substrates - HTCC Multilayer Ceramic Circuit Boards Custom-Made Hermetic Lightweight Package with Glass-to-Metal Sealed Feedthroughs for Telecom or Aerospace Applications Customized Hermetic Multi-Pin Glass-to-Metal Sealed Microwave Package for Defense or Radar Applications Custom-Made Hermetic Power Amplifier Package with HTCC Multilayer Ceramic Feedthroughs for Aerospace Applications Customized Glass-to-Metal Sealed Hermetic Package with Co-Axial RF Feedthroughs Customized Hermetic Co-Planar RF Multilayer Ceramic HTCC Package for Aerospace Applications Customized Hermetic Co-Planar RF Multilayer Ceramic Package Customized Hermetic Dewar Flange with HTCC Circuit Board Feedthrough Substrate For Thermal Imaging and Defense Applications Custom-Made Hermetic Glass-to-Metal Sealed High Power Package for Industrial Applications Customized Hermetic High Power Modulator Housing with HTCC Feedthroughs Customized Hermetic HTCC Multilayer Ceramic Connector Feedthroughs Customized Hermetic Microelectronic Package with Co-Planar RF and DC Feedthroughs Customized Hermetic Optical Housing with Glass-to-Metal and Ceramic-to-Metal Sealed High Power Feedthroughs for Defense Laser Warner Applications Customized Hermetic Package or Lid with Multilayer Ceramic High IO Count Pad Array Customized Hermetic Package with Glass-to-Metal Sealed Feedthroughs for Telecom or Aerospace Applications Customized Hermetic Power and Amplifier Package with Ceramic RF Feedthroughs for Aerospace Applications Customized Hermetic Power Package with Optical Interface and Multilayer Ceramic Feedthroughs Customized Hermetic Small Form Factor HTCC Multilayer Ceramic Package for Aerospace Applications Customized Hermetic Titanium Housing with Fine Pitch HTCC Substrate for Industrial Oil Gas Applications Customized High Power Package with Optical Interface and Multilayer Ceramic Feedthroughs for Industrial Applications First-Class Product Quality and Operational Excellence For safety-relevant or mission-critical electronics, uncompromising reliability of microelectronic packages and substrates is of the utmost importance. As a dedicated and decades-long supplier to the industry, SCHOTT manufactures products that meet the highest performance and lifetime expectations, even in working environments with extreme pressure, vibrations and temperatures in excess of 175 degrees Celsius (347° F). When it comes to reliability, SCHOTT offers quality beyond just the product: we have a flexible internal set-up and place high importance on operational excellence across the board, including R&D, production, and administrative services. Unmatched Technical Design Support and Consultation When working with customers, SCHOTT’s experts draw on more than 75 years of experience in developing and manufacturing hermetically-sealed packages. Our technical know-how and design capabilities encompass Glass-to-Metal-, Ceramic-to-Metal- (CerTMS®) and Multilayer High-Temperature Co-Fired Ceramic (HTCC) technologies. Utilizing decades of comprehensive expertise, SCHOTT can cater to customer-specific interface needs, resulting in fully customized microelectronic packages and substrates optimized to fulfill electrical, mechanical, optical and thermal requirements. Miniaturization and Thermal Management: The Advantages of HTCC Multilayer Ceramics In addition to its signature Glass-to-Metal Sealing technology expertise, SCHOTT has significant in-house capabilities in HTCC (High-Temperature Co-Fired Ceramics) technology. Multilayer design enables the production of miniature 3D interconnect solutions, paving the way for high-density input/output capability in small-form-factor hermetic packages for both feedthroughs and multilayer ceramic circuit board substrates. Superior thermal conductivity of HTCC multilayer ceramics and temperature resistance beyond 300 degrees Celsius (572° F) make HTCC substrates a perfect fit for high-power applications. High-Speed Products. Integrated Solutions. Catering to the increased need for high-speed microelectronic housings, SCHOTT offers its hybrid packages with high-frequency ports, in the form of either coaxial Glass-to-Metal- or coplanar Ceramic-to-Metal sealed connections. SCHOTT also offers integrated features, such as standard connectors or circuits that are incorporated in the HTCC feedthrough substrate. Such offerings enable reduced headaches and increased efficiency for customers, who can remove these steps from their own production processes. Long-Term Supply Security from a Reliable European Partner Due to the nature of their projects, many customers are reliant on long-term partnerships with well-established, financially stable suppliers. SCHOTT’s 130-year history includes its ownership by the Carl Zeiss foundation – an arrangement that signifies a focus on sustainable growth and innovation-minded customer relationships. All microelectronic housings and substrates are developed and manufactured by a specialized and dedicated team at SCHOTT’s site in Landshut, near Munich. This designates SCHOTT microelectronic components as 100% Made in Germany. Microelectronic Packages with Glass-to-Metal-Sealing Microelectronic Packages with Ceramic-to-Metal-Sealing HTCC Multilayer Packages & Substrates News 12. March News 50G: Breakthrough in Transistor Outline Technology 13. December News SCHOTT fully acquired NEC SCHOTT Components Corporation 30. November News Nuclear Applications: Smart component selection enhances safety and lowers ownership costs 29. November News World’s First Glass-to-Aluminium Seal: SCHOTT’s New Lid Technology Boosts Capacitor Performance More News Trade Fairs & Events 17. September Trade fair Gastech, Barcelona, Spain, 17.09 - 20.09.2018 13. November Trade fair electronica, Munich, Germany, 13.11 - 16.11.2018 More Trade Fairs Contact SCHOTT AG Christoph-Dorner-Strasse 29 84028 Landshut Germany E-Mail to SCHOTT +49 (0)871/826-0 Directions More Contacts NewsTrade Fairs & EventsDownloads About Us Locations Quality & Certifications Exhibitions Feedback / Contact Products Overview GTMS & CerTMS Special Glass Thermal Cutoffs Applications Automotive Electronics Consumer Electronics Datacom / Telecom Defense, Aviation & Aerospace Dental & Life Sciences Energy & Nuclear Safety Energy Storage Home Appliances Medical Electronics Sensors Technologies GTMS Technology CerTMS Technology Multilayer Ceramics Technology (HTCC and LTCC) Glass Powder Technology Tubing Technology Thermal Cutoff Technology Wafer Technology Information News Downloads Glossary © 2018 SCHOTT AG | Print | Disclaimer | Privacy Policy | Imprint | Help ChangeOK SCHOTT uses Cookies on this Website to enhance the user experience and provide the best possible Service. 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