Home » Reflow Oven » Pyramax TrueFlat Home Contact Us PARTS LOCATOR WHY BTU PRODUCTS ABOUT US CUSTOMER SUPPORT CAREERS NEWS & EVENTS PYRAMAX TRUEFLAT NEW REFLOW OVEN TECHNOLOGY FOR SUBSTRATE FLATNESS Easy process transfer Low maintenance, no vacuum pump Superior thermal uniformity Built on the industry-leading Pyramax platform, TrueFlat is a unique reflow oven configuration to stop substrate warpage. Designed for substrate thicknesses of 0.15 to 0.30mm, TrueFlat technology ends die tilt. The result is consistent and repeatable flatness, and superior thermal uniformity due to the Pyramax’s closed-loop convection heating. The new Pyramax with TrueFlat technology does not impact reflow oven footprint, making it easy to transition from existing reflow processes. Easy to maintain with no vacuum pump, the system offers simple operation and full integration with BTU’s proprietary WINCON™ Windows-based software including factory host/MES interface for Industry 4.0 compliance. Uniform flatness through consistent suction force throughout the entire thermal process Watch the video below to see the TrueFlat in action – thin substrates are pulled flat by the suction force. Contact BTU to learn more about how the Pyramax TrueFlat reflow oven can end die tilt on your thin substrates. CONFIGURE A REFLOW OVEN Which model is best? CONFIGURE CONTACT US How can we help you? Email Customer Support CORPORATE BROCHURES BTU Capabilities Download Health Check Download PYRAMAX DATASHEETS Pyramax Download Pyramax TrueFlat Download Pyramax Vacuum Download Pyramax ZeroTurn Download Aqua Scrub Flux Management Download REFLOW PAPERS AND ARTICLES Operation of a Vacuum Reflow Oven Download Reducing CTE Mismatch Defects in Flip Chip Reflow Download SMT Reflow Oven-to-Oven Repeatability Download Youtube LinkedIn © 2021 BTU An AMTECH Company All Rights Reserved Privacy Policy Site Map