Capabilities Facilities Quality Careers Resources Request a Quote Die Preparation From wafer thinning, polishing and dicing to pick and place and die inspection, we offer 100% U.S.-based, end-to-end solutions for all your die preparation needs. Request a Quote Wafer Dicing Our in-house engineers have carefully researched and isolated the most common causes of die chipping, low die strength and poor yields. At the end of the day, it usually comes down to subpar dicing. To avoid that, we use world-class, fully automatic DISCO wafer dicing systems. This allows us to handle wafer sizes ranging from mere fragments to 300 mm in diameter, with cut lines as small as 15 µm. Dice Before Grind (DBG) Our proprietary DBG techniques allow for the safe singulation of IC devices from wafers as thin as 25 µm, in cases in which normal sawing would create high levels of chipping and edge damage. Die Attach Film (DAF) Custom Parameters Complex Die Patterns Cleanliness & Electrostatic Discharge Elimination Assembly Service Guide Learn how to make your products cost effective and ready for manufacture with this detailed guide. Want to learn more? Contact our team today to learn more about our die prep services, tell us about your project needs and get your free quote, 100% risk-free. Get a free quote 800-622-2382 Request a Quote Capabilities Die Prep Packaging & Assembly Electrical Test Reliability & Qualification DPA & FA Counterfeit Detection Other Services Resources Blog Press Releases Webinars Videos Guides FAQ Contact Us Facilities Standard Products About Us Careers Technical Hotline Terms & Conditions Privacy Policy © 2021 Integra Technologies