NCAB Group France Who are we? Our activities Sustainable business PCB technology Career Investors Contact Choose language HDI PCB (HDI Printed Circuit Board) PCB wallet HDI PCB NCAB has extensive experience in manufacturing HDI boards as well as a panel of factories with in-depth expertise in HDI production for different market applications. These production sites, combined with our global technical expertise, provide in-depth knowledge of the requirements and manufacturing methods required for HDI products. What Defines an HDI Printed Circuit Board (HDI PCB)? The IPC-2226 defines an HDI PCB as having a higher connection density per unit area than traditional PCBs. There are different types of HDI functions: type I, type II and type III. Visit our FAQ to learn more about these different types. For more information, please contact NCAB Group . We will be happy to answer all of your questions. 8L HDI – materials: FR-4 Shengyi S-1000-2; finished thickness: 1.60mm +/- 10%; BGA size: 0.25mm; line width and space: 0.10/0.10 mm; surface treatment: ENIG; features: fine pitch, copper filled via technology HDI PCBs – Technical specification Feature NCAB´s technical specification Number of layers 4 – 22 layers standard, 30 layers advanced Technology highlights Multilayer boards with a higher connection pad density than standard boards, with finer lines/spaces, smaller via holes and capture pads allowing microvias to only penetrate select layers and also be placed in surface pads. HDI builds 1+N+1, 2+N+2, 3+N+3,4+N+4, any layer in R&D Materials FR4 standard, FR4 high performance, Halogen free FR4, Rogers Copper weights (finished) 18μm – 70μm Minimum track and gap 0.075mm / 0.075mm PCB thickness 0.40mm – 3.20mm Maxmimum dimensions 610mm x 450mm; dependant upon laser drilling machine Surface finishes available OSP, ENIG, Immersion tin, Immersion silver, Electrolytic gold, Gold fingers Minimum mechanical drill 0.15mm Minimum laser drill 0.10mm standard, 0.075mm advanced Qu’est-ce qu’un PCB HDI? La norme IPC-2226 définit un PCB HDI comme une carte de circuit imprimé à la densité d’interconnexions par unité de surface supérieure aux circuits imprimés (PCB -Printed Circuit Board) conventionnels. Ces cartes présentent des pistes et des isolements plus fins ≤ 100 µm / 0,10 mm, des vias (< 150 µm) et des pastilles 20 pastilles/cm²) par rapport à la technologie de PCB conventionnelle. FAQ Télécharger nos règles de conception pour les cartes HDI Pour éviter de partir sur de mauvaises bases, nous avons mis au point des règles de conception, que nous utilisons comme liste de contrôle. Design rules Who are we? Organization Vision Values Key figures Story Politics Terms of Sales Downloads Hurry Our activities Benefits of working with us Our approach to reliable PCBs Our PCB portfolio The sectors we work with Our clients Sustainable business Our sustainable development strategy Supply Chain Employees Clients Downloads PCB technology Our PCB portfolio Our technological capacity PCB specification PCB Design Tools Design support PCB surface finishes Materials Faq Seminars NCAB Group Laboratories Production process Downloads Career Investors Contact Contact your local office Head office Factory Management Benelux China Denmark Finland France Germany Italy Malaysia North Macedonia Norway Poland Russia Spain Sweden United Kingdom USA © 2011-2021 NCAB GROUP CORPORATION FOLLOW US HERE