EN Home Products Electronics Surface treatment Surface treatment Integrated wet chemical process and equipment solutions for package substrates and printed circuit boards (HDI/MLB and Flex/Flex-Rigid) Quick facts Global market leader in I/L bonding Bespoke solutions for high frequency applications (5G/6G) Best in class surface preparation Most advanced fine line solutions Speciality chemistry designed for the high voltage market Applications PCB / MLB / HDI PCB / Advanced HDI PCB Package Substrates Flex PCB / Flex-Rigid PCB Automotive Product portfolio Inner layer bonding enhancement BondFilm® Part A: Atotech’s cost-effective and long-time proven oxide alternative process for improved inner layer bonding. With over 400 lines and installations worldwide Atotech leads this market segment globally and contributes to the success of many key PCB manufacturers and OEMs. BondFilm® MS 1000: As one of the newest BondFilm® updates, MS 1000 gives great operational benefits, significantly reduce equipment maintenance, sludge formation and downtime frequency. BondFilm® HP: Our high performing BondFilm® HP reduces sludge to an absolute minimum thus reducing the environmental footprint to a bare minimum while maintaining the excellent performance our BondFilm® series is known for. It is a perfect choice for demanding high voltage applications or solutions where durability play a significant role. 5G / 6G / high frequency applications Advanced surface preparation Photoresist stripping Metal stripping Direct metal deposition Plating on glass Featured products BondFilm® HP High Performance adhesion promotor for inner layer bonding Read more BondFilm® EX-S2 Advanced high frequency adhesion promotor Read more CupraEtch® SR 8000 Reliable photoresist and soldermask adhesion, surface roughness Read more NovaBond® EX-S2 Advanced high frequency adhesion promotor Read more Horizon® BondFilm Integrated production solution for bonding enhancement and surface treatment technologies The Horizon® BondFilm system offers Atotech’s latest technology package in chemical processing, thin material conveyance and fluid delivery. Horizon® BondFilm LDD – a unique process to improve CO2 laser absorption of surfaces prior to laser direct drilling applications at maximum reliability CupraEtch® – a unique multipurpose micro-etch system for best adhesion of primary imaging resists or solder masks in the production of high quality printed circuits Read more Polygon ST Line ® Integrated production solution for bonding enhancement and surface treatment technologies An innovative horizontal system designed for the latest requirements on solder mask and dry film treatment during the production of printed circuit boards. Fully compatible with our CupraEtch® process chemistry series and in combination provides a state-of-the-art solutions-based package that combines chemistry, equipment, software and service Optimized for high volume manufacturing, provides maximum yield and best-in-class uniformity over the panel Read more “We provide a wide selection of process chemistries across the full manufacture process, with our core business targeted upon Advanced Surface Preparation and Bonding Enhancement Technology. Our focus is to develop and supply sustainable and functionally reliable systems.” Patrick Brooks Global Product Director Surface Treatment at Atotech Germany Recent publications Advanced adhesion promotor system for IC substrate packaging This paper highlights the development of a low etching treatment process which meets all of the challenges of Enhanced functional performance together with lowest signal insertion loss to be suitable for so called 5G applications. EXPT NovaBond EX is a system developed to meet these challenges, with the formation of a smooth copper surface with minimal copper loss (less than 200-nm), which is subsequently treated with a coating of adhesion promotor to provide the strongest possible bond strength. 2019, PDF, 240 KB New, advanced soldermask and photoresist pretreatment for significant waste water benefits and low etch depth requirement Atotech has developed a new ferric-sulfate based microetching process which is both technically and commercially superior to existing POR pretreatment chemistries for Soldermask and Photoresist pretreatment. The excellent adhesion for ultra-low etch depth together with a high copper loading provide important advantages for the process, because they allow the process to have low bleed within the range of the drag-out, which signicantly reduces waste water volumes. 2017, PDF, 1,000 KB Electronics portfolio overview Desmear and metallization Electrolytic plating Final finishing Leadframe and connector Semiconductor Equipment Contact Us Country Name Email By entering your email address, you agree that we will answer your request via email. Your message I have read the privacy policy and I agree to the data storage and use as described there. Atotech 2021 Legal information & privacy policy