DOWNLOADS CAREERS ABOUT US CONTACT US LANGUAGE HOME EQUIPMENT WLP SERVICES CHEMISTRY NEWS & EVENTS Electroplating HomeWLP ServicesElectroplating Pac Tech offers high quality electro plating processes for Wafer Level RDL for WLCSP, Fine pitch RDL and Copper Pillar. Pac Tech Germany and Pac Tech USA offer the electro plating for low volume with the option to high volume processes at PacTech Asia. PacTech Asia uses a single Wafer Platform as a fully automated tool configurable to optimize capacity. The electro plating processes are supported by Pre-wet, ECD, SRD chambers in high volume configurations. A High Speed Cu plating solution is also available with following capabilities: 200mm & 300mm Wafer capability Wafer thickness: down to 200µm Wafer exclusion zone: ≤ 3mm Integrated UBM Etch with EPD Cu Pillar/RDL Roughness (Ra) µm: 0.05 – 0.5 Throughput Cu RDL: 15 WPH (3-5um thick) / 10 WPH (10um thick) Uniformity Cu Pillar: 2-5% (within wafer/within die) Throughput Cu Pillar: 12 WPH (60um Cu) / 6 WPH (30um Cu) Uniformity Cu RDL: 2-5% (within wafer/within die) Electro Planting & UBM Etch Semsysco Triton Dielectric and Resist Exposure Süss MA200 Sputtering Tango Axcela Contact Us General Overview Solder Bumping Wafer Level Redistribution Flip Chip Test Wafer Test Wafer Pac 2.0 Test Wafer Pac 2.3 Test Wafer Pac 2.7 Wafer Level Photoresist / BCB Coating Wafer Level UBM Plating Electroplating Electroless Plating Wafer Backside Metallization Bonding / Assembly Wafer Thinning Wafer Sawing Die Sort CONTACT Pac Tech – Packaging Technologies GmbH Am Schlangenhorst 7 – 9 14641 Nauen – Germany +49 (0) 3321 4495 – 100 info@pactech.de NEWSLETTER Name Email* SUBSCRIBE MENU Home Contact Us Terms & Conditions Sitemap Imprint Privacy Policy Facebook Youtube © PacTech - Packaging Technologies GmbH 2019. All Rights Reserved. We use cookies to ensure that we give you the best experience on our website. If you continue to use this site we will assume that you are happy with it.OkRead more