Search 978-568-1330 HOME ABOUT PRODUCTS CAPABILITIES TECHNICAL DATA NEWS REQUEST A QUOTE CONTACT Centerline can laser drill, scribe or cut a variety of substrates to your specifications. Laser Machining Services Centerline Technologies offers laser machining as a service to our lapping and polishing customers to size their jobs according to the requirements needed. Substrates can be laser drilled, scribed or cut to customer specifications. Notes: A minimum border of five times the thickness should be left between a scribed edge to be broken and an As Fired edge of the plate. Sharp corners should have a radius to reduce stress induced cracking. No two machined features should have edges closer to the other than one material thickness. Tighter tolerances can be achieved upon request. All tolerances are in inches. Tolerances are non-cumulative. Request a Quote Technical Support Download Page as PDF Read about Laser Scribing Tolerances for Ceramic and Aluminum Nitride Scribed edge to scribe lines +/- .003'' cut outs or hole center Cut edge or alignment flats +/- .001'' to scribe line, holes or cut features Internal features to other features +/- .001'' or scribe lines Hole Diameter with pin gage +/- .001'' (go/no-go) Hole Taper .002-.030'' thick .002'' .031-.045'' thick .003'' .046-.100'' thick .004'' Scribe Depth .005-.030'' thick 40% of thickness .031-.100'' thick 45-50% of thickness Pulse Spacing .005-.030'' thick .003-.007'' .031-.100'' thick .005-.009'' Products Alumina BeO Aluminum Nitride Fused Silica/Quartz Sapphire Shop Our Store Capabilities Lapping Polishing Filled Via Planarity Diamond Sawing Laser Machining Specialty Processes Quality Control Small Quantities Technical Data Conversion Tool About Us Why Polish Substrates? Customers News Quality Control Careers Contact Centerline Technologies, LLC 577 Main Street Suite 270 Hudson, MA 01749 Call: 978-568-1330 Fax: 978-568-1334 End-to-End Encryption, Powered by Worldpay © 2021 Centerline Technologies