English 日本語 한국어 简体中文 Deutsch Español Русский MENU Home Capabilities by Industry Molex Capabilities by Industry We equip the brightest minds to solve customers’ toughest engineering challenges by leveraging our proven capabilities and newest innovations. Learn more about how Molex’s capabilities are used and the advantages they bring our customers by selecting from the list of industries below. Choose an Industry... 5G Automotive Commercial Aviation Commercial Vehicle Connected Home Appliances Connected Mobility Solutions Consumer CoreSync Network Connected Solutions Data Center Solutions Data/Computing Defense Electrical and Industrial Home Appliance Industrial Industrial Automation IT Infrastructure Solutions MedTech Mobile Devices Telecom Infrastructure Telecommunications/Networking 5G We believe in making possible a brighter tomorrow. 2-Shot LSR Molding Automotive As your automotive solutions provider, we develop and enable technology that meets ever-changing customer connectivity needs. 2-Shot LSR Molding Bare Die Assembly Capacitive Switches ConnTAK50 Connector System Display Panel Backlighting Electromechanical FPC Design Flexible Printed Circuitry (Cu Flex Materials Experts) High-Speed Data Transfer In Vehicles Integrated Circuit (IC) Obsolescence MID / LDS Technology Magnesium Thixomolding Metal Injection Molding Microelectronics Printed Electronic Inks Printed Electronic Substrates Printed Electronics Design and Development Printed Electronics Manufacturing RF/Microwave Production Capabilities Stamped Case Technology Terminal Design and Manufacturing Thermal Management Systems Thermal Simulation Commercial Aviation A wide array of products that meet many essential elements (reliability, high performance, ruggedized) for the Commercial Aviation industries Bare Die Assembly Integrated Circuit (IC) Obsolescence Microelectronics RF Microwave Solutions RF Precision Machining RF Testing Capabilities Thermal Management Systems Thermal Simulation Commercial Vehicle Whether you are designing next-gen tractors, trucks, or boats, our broad range of transportation solutions make innovation possible 2-Shot LSR Molding Bare Die Assembly Busbars: Power Solutions Made Simple Capacitive Switches Display Panel Backlighting Electromechanical FPC Design Flexible Printed Circuitry (Cu Flex Materials Experts) High-Speed Data Transfer In Vehicles Integrated Circuit (IC) Obsolescence Magnesium Thixomolding Microelectronics Printed Electronic Inks Printed Electronic Substrates Printed Electronics Design and Development Printed Electronics Manufacturing RF/Microwave Production Capabilities Stamped Case Technology Terminal Design and Manufacturing Connected Home Appliances Capacitive Switches Display Panel Backlighting Integrated Circuit (IC) Obsolescence Molex and 5G Technologies: Planning for RF Success Printed Electronic Inks Printed Electronic Substrates Printed Electronics Design and Development RF Microwave Solutions RF Precision Machining RF Testing Capabilities Connected Mobility Solutions Developing the technology foundation for automotive OEMs and Tier Ones in their drive towards the fully autonomous vehicle and the intelligent vehicles of the future. Molex and 5G Technologies: Planning for RF Success Consumer Electromagnetic Compatibility: Testing and Analysis Electromechanical FPC Design Flexible Printed Circuitry (Cu Flex Materials Experts) Integrated Circuit (IC) Obsolescence MID / LDS Technology Magnesium Thixomolding Molex and 5G Technologies: Planning for RF Success Printed Electronic Inks Printed Electronic Substrates Printed Electronics Design and Development Printed Electronics Manufacturing RF Microwave Solutions RF Precision Machining RF Testing Capabilities RF/Microwave Production Capabilities Thermal Management Systems Thermal Simulation CoreSync Network Connected Solutions Smart Buildings Data Center Solutions Addressing expanding hyper-scale requirements including higher bandwidth and increasing data rates, Molex Data Center Solutions provide reliable, customizable solutions to meet tomorrow’s needs. Busbars: Power Solutions Made Simple Data Center Cable Assembly Testing Electromagnetic Compatibility: Testing and Analysis FPGA Acceleration High-Density Fiber Management High-Speed Channel Design Integrated Circuit (IC) Obsolescence Mechanical Chassis Optimization Molex and 5G Technologies: Planning for RF Success RF Microwave Solutions Signal Integrity Analysis Thermal Management Systems Thermal Simulation Wavelength Management Data/Computing The broadest selection of solutions for high-end servers and workstations to leading-edge storage devices Busbars: Power Solutions Made Simple Data Center Cable Assembly Testing Electromechanical FPC Design FPGA Acceleration Flexible Printed Circuitry (Cu Flex Materials Experts) High-Speed Channel Design Mechanical Chassis Optimization Metal Injection Molding RF/Microwave Multi-Port Connectors Signal Integrity Analysis Thermal Management Systems Thermal Simulation Defense A wide array of products that meet many essential elements (reliability, high performance, ruggedized) for the Defense industries Bare Die Assembly FPGA Acceleration Integrated Circuit (IC) Obsolescence Magnesium Thixomolding Metal Injection Molding Microelectronics RF Precision Machining RF Testing Capabilities RF/Microwave Multi-Port Connectors Thermal Simulation Electrical and Industrial Reliable Woodhead products range from portable lighting to power distribution and are designed to support today's harsh duty environments 2-Shot LSR Molding Magnesium Thixomolding Home Appliance Capacitive Switches Display Panel Backlighting Magnesium Thixomolding Printed Electronics Manufacturing RF Precision Machining Industrial Designed for the harshest environmental conditions to provide safe and reliable connections and protection from contamination, moisture or vibration. Bare Die Assembly Busbars: Power Solutions Made Simple Electromechanical FPC Design FPGA Acceleration Flexible Printed Circuitry (Cu Flex Materials Experts) Integrated Circuit (IC) Obsolescence Metal Injection Molding Microelectronics Molex and 5G Technologies: Planning for RF Success Printed Electronic Inks Printed Electronic Substrates Industrial Automation Ruggedly designed, engineered, and constructed infrastructure solutions for harsh-duty manufacturing environments such as automotive, food and beverage, material handling and commercial vehicles Busbars: Power Solutions Made Simple Cordset Coupling Flamar Custom Cable Capability MID / LDS Technology Molex and 5G Technologies: Planning for RF Success Printed Electronics Design and Development IT Infrastructure Solutions Smart Buildings MedTech A broad portfolio of innovative and reliable interconnect products provide unlimited possibilities for the medical electronics industry 2-Shot LSR Molding Bare Die Assembly Capacitive Switches Display Panel Backlighting Electromagnetic Compatibility: Testing and Analysis Electromechanical FPC Design Flexible Printed Circuitry (Cu Flex Materials Experts) Integrated Circuit (IC) Obsolescence MID / LDS Technology Metal Injection Molding Microelectronics Molex and 5G Technologies: Planning for RF Success Printed Electronic Inks Printed Electronic Substrates Printed Electronics Design and Development Printed Electronics Manufacturing RF Microwave Solutions RF Precision Machining RF Testing Capabilities RF/Microwave Multi-Port Connectors RF/Microwave Production Capabilities Thermal Management Systems Thermal Simulation Mobile Devices Building on decades of innovation, passion and expertise. Magnesium Thixomolding Printed Electronics Manufacturing RF/Microwave Multi-Port Connectors Telecom Infrastructure Microwave and RF solutions that deliver unparalleled service, dependability and performance at competitive prices, from high-volume manufacturing facilities Bare Die Assembly FPGA Acceleration Integrated Circuit (IC) Obsolescence Molex and 5G Technologies: Planning for RF Success RF Filters RF Microwave Solutions RF Precision Machining Telecommunications/Networking High-speed signal and high-power connectors along with participation in industry standards deliver a broad offering of telecom and networking solutions Bare Die Assembly Data Center Cable Assembly Testing Electromagnetic Compatibility: Testing and Analysis Electromechanical FPC Design FPGA Acceleration Flexible Printed Circuitry (Cu Flex Materials Experts) High-Density Fiber Management High-Speed Channel Design Integrated Circuit (IC) Obsolescence Magnesium Thixomolding Mechanical Chassis Optimization Metal Injection Molding Microelectronics Molex and 5G Technologies: Planning for RF Success Printed Electronic Inks Printed Electronic Substrates RF Filters RF Microwave Solutions RF Precision Machining RF Testing Capabilities RF/Microwave Multi-Port Connectors RF/Microwave Production Capabilities Signal Integrity Analysis Thermal Simulation Wavelength Management PRODUCTS + QUICK LINKS + RESOURCES + STAY CONNECTED Cookies Settings Molex® is a registered trademark of Molex, LLC in the United States of America and may be registered in other countries; all other trademarks listed herein belong to their respective owners. © Copyright 2021 We use cookies to offer you a better browsing experience, analyze site traffic, personalize content, and serve targeted advertisements. 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