MENU English TÜV NORD GROUPWeb Project OfficeContact formSitemap Search Company Our Responsibility Services Career News Packaging and Assembly Home Services Packaging and Assembly Providing contract package design and assembly service We provide contact package design and precision assembly services for a wide range of optoelectronic, microelectronic and MEMS devices. We offer end to end backend semiconductor manufacturing from wafer singulation to assembled product. Our process and design IP and know-how enable our customers to reduce development and manufacturing costs, accelerate time to market and reduce risk with any new product development. Our expertise in semiconductor packaging solutions spans the full product life-cycle: from design through prototyping, process optimisation, product qualification, failure analysis, volume manufacturing and transfer to low-cost volume manufacture. APPLICATIONS Photonic Integrated Circuit Packaging Quantum Chip on Board Flip Chip System in Package LED Chip on Board Image Sensor Assembly Fast-turn IC Assembly Laser Diode Packaging Photonic Packaging RF and Microwave MEMS Space and Hi-Rel Assembly DESIGN Understanding the required environmental operating conditions, thermal, optical, mechanical and electrical requirements are the key to any successful package design activity for semiconductor devices. We have extensive design capability in all these areas for a large number of product types and markets. Optical Design Package Design and Modelling ASSEMBLY PROCESSES Wafer Sawing Pick and Place Die Bonding Wire Bonding Flip Chip Stud Bumping Encapsulation and Hermetic Sealing Optical alignment PRODUCTS Narrow linewidth lasers are a key enabling technology in application areas as diverse as holography, remote sensing, spectroscopy and quantum technologies. In the quantum technology area alone, these sources are at the heart of atomic clocks, gravitometers and inertial navigation sensors empowered by laser-cooled atoms. With the launch of the FLAME and REMOTE product lines, we have applied our pedigree in telecoms and space qualified devices to narrow linewidth lasers. This new generation of compact, stable and reliable lasers opens the door to real world applications of narrow linewidth lasers outside of the laboratory environment. Frequency–Stabilised Laser Modules with Integrated Reference Cell FLAME Datasheet 410 KB PDF Rugged Micro-ECDL Technology for Cold Atom Applications in Space REMOTE_780 datasheet 1 MB PDF FLAME Datasheets Miniaturised narrow linewidth lasers 3 MB PDF Miniaturised RGB laser module 4 MB PDF Quantum photonic projects 3 MB PDF Packaging and assembly services 3 MB PDF Related News Laser Modules for Quantum Tech applications Stephen Duffy, Optocap's CEO, talks about how Fraunhofer's laser design expertise and Optocap's manufacturing skills HEATPACK's project Heatpack is the European effort to develop the next generation of low thermal resistance packages. 'Global first' laser developed at Strathclyde University A team of Scottish scientists has developed a unique high-precision laser. LASER World of Photonics 2019 Come and see us at the LASER World of Photonics 2019 trade show in Munich, Germany on June 24th to 27th: Hall B2, booth 129. KAIROS project wins Innovate UK grant to commercialise quantum technologies Gravity Pioneer Industry leaders enter partnership to develop new industry of quantum gravity sensors DLINK Project A new research project aims to put the UK at the forefront of the next generation of millimetre wave wireless communications technology. FLAME & REMOTE papers Our new FLAME and REMOTE narrow linewidth laser modules Presentation at Photonics West. ORIONAS The European project ORIONAS (Lasercom-on-chip for next generation, high-speed satellite constellation interconnectivity) was launched. Miniaturised RGB laser sources Scotland-based photonics consortium to develop an integrated photonic package with a step-change reduction in component size. ALTER TECHNOLOGY UK 5 Bain Square EH54 7DQ Livingston, Scotland, UK +44(0)1506 403 550 info@uk.altertechnology.com Send email Contact Form Address ALTER TECHNOLOGY TÜV NORD c/ Tomas A. Edison, 4 41092 Sevilla (SPAIN) Your contact Send email Contact form Our sites Location Finder The subsidiaries of the TÜV NORD GROUP operate as safety experts and technology advisors in more than 100 countries. Find a location near you! Search SOCIAL MEDIA Join us and watch our Social Media profiles: brand_facebook brand_twitter brand_linkedin © TÜV NORD GROUP Our Locations Editorial information Data protection