Title: Influence of temperature on microelectronics and system reliability
First published: 1997
Subjects: Reliability, Electronic apparatus and appliances, Materials, Microelectronics, Thermal properties, Electronic packaging, Microelectronic packaging, Microélectronique, Matériaux, Propriétés thermiques, Mise sous boîtier (Microélectronique), Appareils électroniques, Fiabilité, TECHNOLOGY, Electricity
LC classification: TK7870.25 .L35 1997