Title: Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices
Subjects: Interconnects (Integrated circuit technology), Protection, Solder and soldering, Mechanical properties, Mathematical models, Failure analysis (Engineering), Equipment Failure Analysis, Interconnexions (Technologie des circuits intégrés), Soudure, Propriétés mécaniques, Modèles mathématiques, Analyse des défaillances (Ingénierie), TECHNOLOGY, Electronics, General, Material Science