Title: HOTPAC, programs for thermal analysis including version 3.0 of the TXYZ program, TXYZ 30, and the thermal multilayer program, TML
First published: 1995
Subjects: Data processing, Computer programs, Thermal analysis, Semiconductors, Fourier analysis, Thermal properties
LC classification: QC100 .U57 no. 400-96, TK7871.85 .U57 no. 400-96