Title: Thermal design of electronic equipment
First published: 2001
Subjects: Electronic apparatus and appliances, Heat, Transmission, Design and construction, Thermal properties, Electronic packaging, Electronic apparatus and appliances, design and construction, Heat, transmission, Appareils électroniques, Conception et construction, Mise sous boîtier (Électronique), Chaleur, Heat transmission, TECHNOLOGY & ENGINEERING, Electronics, Microelectronics, Digital
LC classification: TK7870.25 .R46 2001