Title: Hermeticity of electronic packages
First published: 1999
Subjects: Electronic packaging, Electronics, Materials, Permeability, Sealing (Technology), Electronics, materials, Sealing (technology), Mise sous boîtier (Électronique), Électronique, Matériaux, Perméabilité, Étanchéité, TECHNOLOGY & ENGINEERING, Microelectronics, Digital, Dichtung, Elektronisches Bauelement