Title: Mechanical analysis of electronic pakaging systems
Description: "This useful reference fills the niche between purely technical engineering texts and sophisticated engineering software guides - providing a pragmatic, common sense approach to analyzing and remedying electronic packaging configuration problems."--BOOK JACKET.

"Featuring helpful checklists at the end of each chapter and sample problems (with solutions), this eminently practical resource deserves a place on the bookshelves of all engineers in electronic packaging and related fields. Mechanical Analysis of Electronic Packaging Systems is indispensable for mechanical, electrical, and quality control engineers, and upper-level undergraduate and graduate students in these disciplines."--BOOK JACKET.
Subjects: Electronic packaging, Mechanical engineering, System analysis, Mise sous boîtier (Électronique), Génie mécanique, Analyse de systèmes, Systems analysis, TECHNOLOGY & ENGINEERING, Electronics, Microelectronics, Digital, Elektronisches Bauelement, Gehäuse, Mechanische Beanspruchung