Title: Modeling of mechanical stress in silicon isolation technology and its influence on device characteristics
Description: <a href="http://uf.catalog.fcla.edu/uf.jsp?st=UF002466766&ix=pm&I=0&V=D&pm=1" rel="nofollow">http://uf.catalog.fcla.edu/uf.jsp?st=UF002466766&ix=pm&I=0&V=D&pm=1</a>
Subjects: Integrated circuits--Design and construction--Simulation methods, Silicon-on-insulator technology.