Title: The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages
First published: April 30, 1999
Description: "This book is motivated by the need to understand and predict the complex stress distributions, transfer mechanisms, warpage, and potential failures arising from the encapsulation of devices in plastic. Failures like delaminations, package cracking, and metal shift occur due to the build up of residual stress and warpage in the packages because of the TCE mismatch between the package materials as the package cools from its molding temperature to room temperature.

The correct use of finite element tools for these problems is emphasised."--BOOK JACKET.
Subjects: Integrated circuits, Materials, Thermomechanical properties, Plastic embedment, Stress corrosion, Microelectronic packaging, Electronic apparatus and appliances, Microelectronics