Title: Lead-Free Soldering in Electronics
Description: Assessing the scientific and technological aspects of lead-free soldering, this reference considers the necessary background and requirements for proper alloy selection-highlighting the metallurgical and mechanical properties; plating and processing technologies; and evaluation methods vital to the production of lead-free solders in electronics.
Subjects: Engineering, Nonfiction, Electronic packaging, Solder and soldering, Mise sous boîtier (Électronique), Soudure, Solder, TECHNOLOGY & ENGINEERING, Electronics, Microelectronics, Digital