Title: Polytronic 2006 - 6th International Conference on Polymers and Adhesives in Microelectronics and Photonics
First published: 2007
Subjects: Congresses, Materials, Photonics, Polymers, Microelectronic packaging, Reliability, Integrated circuits, Polymeric composites
LC classification: TK7871.15.P6 I57 2007