Title: Advanced electronic packaging
Description: An excellent desk reference for practicing engineers or an ideal text for students in interdisciplinary engineering classes, this comprehensive book discusses all aspects of the sciences and technologies involved in the packaging of integrated circuits, specifically, multichip modules (MCMs). In addition, you will find industrial case studies for several MCM technologies along with an assessment of design trade-offs.

Also addressed are the critical role of economics and future trends in electronic packaging.
Subjects: Multichip modules (Microelectronics), Microelectronic packaging, Design and construction, Microelectronics, Electronic packaging