Title: High-frequency characterization of electronic packaging
First published: 1998
Description: This book gives the reader insight in how high-frequency characterization of electronic packaging should be done and describes the problems that have to be tackled especially in performing accurate measurements on modern IC-packages and in determination of circuit models.

As a comprehensive guide for the start of research and to help in performing high-frequency measurements, important notions in high-frequency characterization such as S-parameters, calibration, probing de-embedding and measurement-based modeling are explained. The techniques described are illustrated with several up-to-date examples.
Subjects: System analysis, Electronic packaging
LC classification: TK7870.15 .M37 1998