Title: Integrated circuit, hybrid, and multichip module package design guidelines
Description: Circuit designers, packaging engineers, printed board fabricators, and procurement personnel will find this book's microelectronic package design-for-reliability guidelines and approaches essential for achieving their life-cycle, cost-effectiveness, and on-time delivery goals.

Its uniquely organized, time-phased approach to design, development, qualification, manufacture, and in-service management shows you step-by-step how to define realistic system requirements in terms of mission profile, operating life, performance expectations, size, weight, and cost; define the system usage environment so that all operating, shipping, and storage conditions, including electrical, thermal, radiation, and mechanical loads, are assessed using realistic data; identify potential failure modes, sites, mechanisms, and architecture-stress interactions - PLUS appropriate measures you can take to reduce, eliminate, or accommodate expected failures; characterize materials and processes by the key controllable factors, such as types and levels of defects, variations in material properties and dimensions, and the manufacturing and assembly processes involved; and use experiment, step-stress, and accelerated methods to ensure optimum design before production begins.
Subjects: Multichip modules (Microelectronics), Hybrid integrated circuits, Electronic packaging, Design, Design and construction, Integrated circuits