Title: Handbook of Lead-Free Solder Technology for Microelectronic Assemblies
Description: A complete walk-through of the conversion from standard lead-tin to lead-free solder  microelectronic assemblies for low-end and high-end applications, this timely reference analyzes the health risks associated with lead; estimates the environmental benefits of using lead-free substitutes in microelectronics; summarizes new regulations, legislation, and marketplace trends affecting the industry; and outlines changes and challenges on the materials, equipment, and process levels for manufacture of lead-free microelectronics.
Subjects: Engineering, Nonfiction, Solder and soldering, Microelectronics, Green products, Environmental protection, Soudure, Microélectronique, Produits écologiques, Environnement, Protection, Solder, TECHNOLOGY & ENGINEERING, Electronics, Digital