Title: Proceedings of the 1998 Workshop on Mechanical Reliability of Polymeric Materials and Plastic Packages of IC Devices
First published: 1998
Subjects: Congresses, Mechanical properties, Polymers, Testing, Electronic packaging, Reliability, Integrated circuits, Materials, Polymeric composites, Electric power-plants, Electric power production, Nuclear power plants, Power-plants
LC classification: TK7871.15.P6 W67 1998, TK7871.15.P6 W67 1998