Title: Failure Modes and Mechanisms in Electronic Packages
Description: With the proliferation of packaging technology, failure and reliability have become serious concerns. This invaluable reference details processes that enable detection, analysis and the prevention of failures. It provides a comprehensive account of the failures of device packages, discrete component connectors, PCB carriers, and PCB assemblies.
Subjects: Systems engineering, Computer engineering, Microprogramming, Engineering, Machinery, Electronic packaging, Semiconductors