Applications of experimental mechanics to electronic packaging--1997--
Subtitle: presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas
By: sponsored by the Electrical and Electronic Packaging Division, ASME, the Applied Mechanics Division, ASME ; edited by J.C. Suhling, K.M. Liechti, S. Liu.
Contributors: Suhling, J. C.; Liechti, K. M.; Liu, S. 1963-; American Society of Mechanical Engineers. Electrical and Electronic Packaging Division.; American Society of Mechanical Engineers. Applied Mechanics Division.; International Mechanical Engineering Congress and Exposition (1997 : Dallas, Texas)
Series: EEP ;; vol. 22; AMD ;; vol. 226; EEP (Series) ;; vol. 22.; AMD (Series) ;; v. 226.
Publisher: American Society of Mechanical Engineers
Published: 1997
Place of publication: New York
Language: eng
Number of pages: 136
Subjects: Electronic packaging -- Congresses.; Mechanics, Applied -- Congresses.
Notes: Includes bibliographical references and author index.