Heat transfer enhancement in electronics cooling
Subtitle: presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, Atlanta, Georgia, December 1-6, 1991
By: sponsored by the Heat Transfer Division, ASME ; edited by S.H. Bhavnani, M. Greiner.
Contributors: Bhavnani, S. H.; Greiner, M.; American Society of Mechanical Engineers. Winter Meeting; American Society of Mechanical Engineers. Heat Transfer Division.
Series: HTD ;; vol. 183; HTD (Series) ;; v. 183.
Publisher: ASME
Published: 1991
Place of publication: New York, N.Y
Language: eng
Number of pages: 59
Subjects: Electronic packaging -- Cooling -- Congresses.; Heat -- Transmission -- Congresses.; Electronic apparatus and appliances -- Cooling -- Congresses.
Notes: Includes bibliographical references and index.