Wafer Bonding
Subtitle: Applications and Technology
By: edited by Marin Alexe, Ulrich Gösele
Contributors: Gösele, Ulrich
Series: Springer Series in MATERIALS SCIENCE -- 75; Springer Series in MATERIALS SCIENCE -- 75
Publisher: Springer Berlin Heidelberg
Published: 2004
Place of publication: Berlin, Heidelberg
Language: eng
Format: [electronic resource] :
Number of pages: 504
ISBN-13: 9783642059155; 9783662108277
Subjects: Computer engineering; Physics; Surfaces (Physics); Optical materials
Description: During the past decade direct wafer bonding has developed into a mature materials integration technology. This book presents state-of-the-art reviews of the most important applications of wafer bonding written by experts from industry and academia. The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.
Notes: Online full text is restricted to subscribers.

Also available in print.

Mode of access: World Wide Web.
Table of contents: title: Direct Bonding, Fusion Bonding, Anodic Bonding, Wafer Bonding: A Historical Patent Picture of the Worldwide Moving Front of the State-of-the-Art of Contact Bonding; title: Basics of Silicon-on-Insulator (SOI) Technology; title: Silicon-on-Insulator by the Smart CutTM Process; title: ELTRAN® Technology Based on Wafer Bonding and Porous Silicon; title: Wafer Bonding for High-Performance Logic Applications; title: Application of Bonded Wafers to the Fabrication of Electronic Devices; title: Compound Semiconductor Heterostructures by Smart CutTM: SiC-on-Insulator, QUASICTM Substrates, InP and GaAs Heterostructures on Silicon; title: Three-Dimensional Photonic Bandgap Crystals by Wafer Bonding Approach; title: Wafer Direct Bonding for High-Brightness Light-Emitting Diodes and Vertical-Cavity Surface-Emitting Lasers; title: High-Density Hybrid Integration of III; title: V Compound Optoelectronics with Silicon Integrated Circuits; title: Layer Transfer by Bonding and Laser Lift-Off; title: Single-Crystal Lithium Niobate Films by Crystal Ion Slicing; title: Wafer Bonding of Ferroelectric Materials; title: Debonding of Wafer-Bonded Interfaces for Handling and Transfer Applications.