Materials, processes, integration and reliability in advanced interconnects for micro- and nanoelectronics
Subtitle: symposium held April 10-12, 2007, San Francisco, California, U.S.A.
By: editors, Q. Lin ... [et al.].
Series: Materials Research Society symposium proceedings -- v.990.
Publisher: Materials Res Soc
Published: 2007
Place of publication: United States
Language: eng
Number of pages: 338