High-frequency characterization of electronic packaging
By: by Luc Martens.
Series: Electronic packaging and interconnects series
Publisher: Kluwer Academic Publishers
Published: 1998
Place of publication: Boston
Language: eng
Number of pages: 158
Subjects: Electronic packaging; System analysis
Description: This book gives the reader insight in how high-frequency characterization of electronic packaging should be done and describes the problems that have to be tackled especially in performing accurate measurements on modern IC-packages and in determination of circuit models.

As a comprehensive guide for the start of research and to help in performing high-frequency measurements, important notions in high-frequency characterization such as S-parameters, calibration, probing de-embedding and measurement-based modeling are explained. The techniques described are illustrated with several up-to-date examples.
Notes: Includes bibliographical references and index.