Microelectronic Packaging Technology: Materials and Processes 
Subtitle: Proceedings of the 2nd Asm International Electronic Materials and Processing Congres
Publisher: ASM International
Published: August 1989
Language: eng
Format: Hardcover
Number of pages: 479
ISBN-13: 9780871703590
Subjects: Surface mount technology; Electronic Engineering (Specific Aspects); Technology & Industrial Arts; Microelectronics; Electronics - General; Circuits & components; Congresses; Materials; Microelectronic packaging