Microelectronics Packaging Handbook, 3-part set: Part I: Technology Drivers Part II: Semiconductor Packaging Part III
Subtitle: Subsystem Packaging
Edition: 2nd ed. edition
Publisher: Springer
Published: January 31, 1997
Language: eng
Format: Hardcover
Number of pages: 3000
ISBN-13: 9780412084614
Subjects: Electronics engineering; Reference works; Computers; Technology & Industrial Arts; Computer Books: General; Computer Architecture - General; Electronics - Semiconductors; Engineering - Electrical & Electronic; Computers / Computer Architecture