Proceedings of the Symposium on Polymeric Materials for Electronic Packaging and High Technology Applications
By: edited by J.R. Susko, R.W. Snyder, R.A. Susko ; Dielectrics and Insulation and Electronics divisions.
Contributors: Susko, J. R.; Snyder, R. W.; Susko, R. A.; Electrochemical Society. Dialectrics and Insulation Division.; Electrochemical Society. Electronics Division.
Series: Proceedings / The Electrochemical Society, Inc. ;; v. 88-17; Proceedings (Electrochemical Society) ;; v. 88-17.
Publisher: Electrochemical Society
Published: 1988
Place of publication: Pennington, NJ (10 S. Main St., Pennington 08534-2896)
Language: eng
Number of pages: 213
Subjects: Integrated circuits -- Very large scale integration -- Congresses.; Electronic packaging -- Congresses.; Polymers -- Congresses.
Notes: Includes bibliographical references and indexes.