Advanced metallization and interconnect systems for ULSI applications in 1997
Subtitle: proceedings of the conference held September 30-October 2,1997, in San Diego, California, sponsored by Continuing Education in Engineering, University Extension, University of California at Berkeley, California, U.S.A., a parallel session of the conference was held from October 21-22, 1997, in Tokyo, Japan
By: editors, Robin Cheung ... [et al.].
Contributors: Cheung, Robin.; University of California, Berkeley. Continuing Education in Engineering.
Series: Conference proceedings,; Materials Research Society conference proceedings.
Publisher: Materials Research Society
Published: 1998
Place of publication: Warrendale, Pa
Language: eng
Number of pages: 765
Subjects: Integrated circuits -- Ultra large scale integration -- Design and construction -- Congresses.; Integrated circuits -- Ultra large scale integration -- Materials -- Congresses.; Vapor-plating -- Congresses.; Electrochemical metallizing -- Congresses.; Dielectrics -- Congresses.
Notes: Includes bibliographical references and indexes.