Fundamentals of Lead-Free Solder Interconnect Technology
Subtitle: From Microstructures to Reliability
Publisher: Springer; Springer-Verlag New York Inc.
Published: Nov 06, 2014
Format: hardcover
Number of pages: 253
ISBN-13: 9781461492658
Notes: Source title: Fundamentals of Lead-Free Solder Interconnect Technology: From Microstructures to Reliability