Proceedings
Subtitle: 1997 International Conference on Multichip Modules, April 2-4, 1997, The Adam's Mark Hotel, Denver, Colorado
By: sponsored by ISHM--the Microelectronics Society ... [et al. ; assembled and edited by the Technical Program Committee and the IMAPS staff].
Contributors: International Society for Hybrid Microelectronics.
Publisher: Institute of Electrical and Electronics Engineers; IMAPS
Published: 1997
Place of publication: [New York, N.Y.]; Reston, Va
Language: eng
Number of pages: 379
Subjects: Multichip modules (Microelectronics) -- Congresses.; Microelectronic packaging -- Congresses.
Other titles: Proceedings, 6th International Conference and Exhibition on Multichip Modules, MCM '97; 1997 Proceedings, International Conference on Multichip Modules; 1997 International Conference on Multichip Modules; 6th International Conference and Exhibition on Multichip Modules; Multichip modules; MCM '97
Notes: Includes bibliographical references and index.
"IEEE catalog number: 97TH8258"--T.p. verso.