Manufacturing processes and materials challenges in microelectronic packaging
Subtitle: presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, Atlanta, Georgia, December 1-6, 1991
By: sponsored by the Applied Mechanics Division, ASME, the Electrical and Electronic Packaging Division, ASME ; edited by W.T. Chen, P. Engel, W.E. Jahsman.
Contributors: Chen, W. T.; Engel, Peter A.; Jahsman, W. E.; American Society of Mechanical Engineers. Winter Meeting; American Society of Mechanical Engineers. Applied Mechanics Division.; American Society of Mechanical Engineers. Electrical and Electronic Packaging Division.
Series: AMD ;; vol. 131; EEP ;; vol. 1; AMD (Series) ;; v. 131.; EEP (Series) ;; vol. 1.
Publisher: The Society
Published: 1991
Place of publication: New York, N.Y
Language: eng
Number of pages: 153
Subjects: Electronic packaging -- Congresses.; Microelectronic packaging -- Congresses.
Notes: Includes bibliographical references and index.