Application of fracture mechanics in electronic packaging
Subtitle: presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas
By: sponsored by the Applied Mechanics Division, ASME, the Electrical and Electronics Packaging Division, ASME ; edited by William T. Chen, David T. Read.
Contributors: Chen, William T.; Read, D. T.; American Society of Mechanical Engineers. Applied Mechanics Division.; American Society of Mechanical Engineers. Electrical and Electronic Packaging Division.; International Mechanical Engineering Congress and Exposition (1997 : Dallas, Tex.); Symposium on Application of Fracture Mechanics in Electronic Packaging (1997 : Dallas, Tex.)
Series: AMD ;; vol. 222; EEP ;; vol. 20; AMD (Series) ;; v. 222.; EEP (Series) ;; vol. 20.
Publisher: American Society of Mechanical Engineers
Published: 1997
Place of publication: New York, N.Y
Language: eng
Number of pages: 193
Subjects: Electronic packaging -- Materials -- Fracture -- Congresses.; Multichip modules (Microelectronics) -- Materials -- Fracture -- Congresses.; Fracture mechanics -- Congresses.
Other titles: Fracture mechanics in electronic packaging
Notes: Includes bibliographical references and index.
"Papers that were presented at the Symposium on Application of Fracture Mechanics in Electronic Packaging"--P. iii.