Characterization of integrated circuit packaging materials
By: editors, Thomas M. Moore and Robert G. McKenna ; managing editor, Lee E. Fitzpatrick.
Contributors: Moore, Thomas M.; McKenna, Robert G.
Series: Materials characterization series
Publisher: Butterworth-Heinemann
Published: 1993
Place of publication: Boston
Language: eng
Number of pages: 274
Subjects: Electronic packaging -- Materials.; Integrated circuits -- Design and construction.
Description: Characterization of Integrated Circuit Packaging Materials deals with the systems of materials that comprise IC packages. Chapters in this volume address important characteristics of IC packages. It demonstrates analytical techniques appropriate for IC package characterization through examples of the measurement of critical performance parameters and the analysis of key technological problems of IC packages.

This book discusses issues which affect a variety of package types, including plastic surface-mount packages, hermetic packages, and advanced designs such as flip-chip, chip-on-board, and multi-chip models.
Notes: Includes bibliographical references and index.