Microelectronics failure analysis
Subtitle: desk reference
By: edited by The Electronic Device Failure Analysis Society, Desk Reference Committee.
Contributors: Electronic Device Failure Analysis Society Desk Reference Committee.
Edition: 5th ed.
Publisher: ASM International
Published: 2004
Place of publication: Materials Park, Ohio
Language: eng
Number of pages: 800
Subjects: Electronics -- Materials -- Testing -- Handbooks, manuals, etc.; Microelectronics -- Materials -- Testing -- Handbooks, manuals, etc.; Microelectronics -- Materials -- Defects -- Handbooks, manuals, etc.; Electronic apparatus and appliances -- Testing -- Handbooks, manuals, etc.; Semiconductors -- Defects -- Handbooks, manuals, etc.
Genres: Handbooks, manuals, etc.
Notes: System requirements for accompanying CD-ROM: Windows 95/98/NT/ME/2000/XP ; Macintosh 8/9/Classic.
Includes bibliographical references and index.
Table of contents: title: Introduction; title: Failure analysis process flow; title: Failure verification; title: Failure mode: failure classifications; title: Special devices; title: Non-destructive analysis techniques; title: Depackaging; title: Photon emission (electroluminescence) localization techniques; title: Microthermography; title: Laser and particle beam-based localization techniques; title: Deprocessing; title: General imaging techniques; title: Local deprocessing and imaging; title: Materials analysis techniques; title: Important topics for semiconductor devices; title: FA techniques/tools roadmaps; title: FA operation and management; title: Appendix.