Electronic Packaging Materials Science
Subtitle: Symposium Held November 27-29, 1984, Boston, Massachusetts, U.S.A. (Electronic Packaging Materials Science)
Publisher: Materials Research Society
Published: April 1985
Language: eng
Format: Hardcover
Number of pages: 417
ISBN-13: 9780931837050
Subjects: Electronics - General; Technology & Industrial Arts; Congresses; Electronic packaging; Materials