Proceedings of the 1999 Workshop on Polymeric Materials for Microelectronics and Photonics Applications, Mechanics, Physics, Reliability, Processing, presented at Hotel Concorde Saint-Lazare, December 12-15, 1999, Paris, France
By: sponsored by the Electrical and Electronic Packaging Division, ASME, in cooperation with IEEE Components, Packaging and Manufacturing Technology (CPMT) Society ... [et al.] ; edited by Ephraim Suhir ... [et al.].
Contributors: Suhir, Ephraim.; American Society of Mechanical Engineers. Electrical and Electronic Packaging Division.; Components, Packaging & Manufacturing Technology Society.
Series: EEP ;; vol. 27; EEP (Series) ;; vol. 27.
Publisher: American Society of Mechanical Engineers
Published: 1999
Place of publication: New York, N.Y
Language: eng
Number of pages: 283
Subjects: Polymers -- Congresses.; Microelectronic packaging -- Materials -- Congresses.; Integrated circuits -- Reliability -- Congresses.; Photonics -- Materials -- Congresses.; Polymeric composites -- Congresses.
Genres: Congresses.
Other titles: 1999 Workshop on Polymeric Materials for Microelectronics and Photonics Applications: Mechanics, Physics, Reliability, Processing; Workshop on Polymeric Materials for Microelectronics and Photonics Applications, Mechanics, Physics, Reliability, Processing; Polymeric Materials for Microelectronics and Photonics Applications, Mechanics, Physics, Reliability, Processing; Poly'99
Notes: Includes bibliographical references and index.
"Poly'99"--P. iv.
"Second Workshop"--P. iii.