Non-volatile flux for chip-sealing
Subtitle: laboratory study interim report
By: P.R. Herrington ... [et al.].
Contributors: Herrington, P. R.
Series: Transfund New Zealand research report,; no. 71
Publisher: Transfund New Zealand
Published: 1997
Place of publication: Wellington, N.Z
Language: eng
Number of pages: 32
Subjects: Roads -- Maintenance and repair -- Materials -- New Zealand.; Sealing compounds -- Testing.; Waste products as road materials.
Notes: Includes bibliographical references (p. 32).