Electronics Packaging Forum
Subtitle: Multichip Module Technology Issues
Publisher: Institute of Electrical & Electronics Enginee
Published: March 1994
Language: eng
Format: Hardcover
Number of pages: 392
ISBN-13: 9780780304390
Subjects: Circuits & components; Multichip modules (Microelectr; Electronic Engineering (Specific Aspects); Technology & Industrial Arts; Computer Books: General; Multichip modules (Microelectronics); Electronics - General; Design and construction; Design; Electronic packaging