A method to predict the thermal performance of printed circuit board mounted solid state devices
By: by Matthew D. Kelleher
Contributors: Naval Postgraduate School (U.S.)
Publisher: Naval Postgraduate School
Published: 1975
Place of publication: Monterey, Calif
Language: eng
Number of pages: 53
Subjects: Heat sinks (Electronics); Cooling; Electronic apparatus and appliances; Semiconductors
Description: The objective was to formulate a design procedure to be used in the prediction of the thermal performance of printed circuit board mounted solid state devices (specifically 14 and 16 pin DIP's and TO-3 and TO-66 transistor cases). The project consists of an analytical phase which constitutes the actual formulation of the design procedure in the form of a digital computer program with appropriate documentation and an experimental phase which involves testing of actual P-C boards to verify the analytical model.
Notes: Title from cover.

"Prepared for: Naval Electronics Laboratory, San Diego, California"--Cover.

"31 July 1975"--Cover.

"NPS-59KK75071"--Cover.

DTIC Descriptors: solid state devices, FORTRAN 4 programming language.

Author(s) subject terms: electronics cooling, thermal network analysis.

Includes bibliographical references (p. 28)

"Approved for public release; distribution unlimited"--Cover.

Technical report; 1975.

ck/ 8/10/09.