Structural analysis in microelectronics and fiber optics
Subtitle: presented at the 1993 ASME Winter Annual Meeting, New Orleans, Louisiana, November 28-December 3, 1993
By: sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by E. Suhir.
Contributors: Suhir, Ephraim.; American Society of Mechanical Engineers. Electrical and Electronic Packaging Division.
Series: EEP ;; vol. 7; EEP (Series) ;; vol. 7.
Publisher: American Society of Mechanical Engineers
Published: 1993
Place of publication: New York
Language: eng
Number of pages: 165
Subjects: Microelectronics -- Congresses.; Fiber optics -- Congresses.; Structural analysis (Engineering) -- Congresses.
Notes: Includes bibliographical references and index.