Twenty Sixth IEEE/CPMT International Electronics Manufacturing Technology Symposium
Subtitle: proceedings : 2000 IEMT Symposium : October 2-3,2000, Santa Clara, CA, USA
By: sponsored by: SEMI, Semiconductor Equipment and Materials International [and] CPM, the Components, Packaging, & Manufacturing Technology Society of the IEEE.
Contributors: Semiconductor Equipment and Materials International.; Components, Packaging & Manufacturing Technology Society.
Publisher: IEEE
Published: 2000
Place of publication: Piscataway, New Jersey
Language: eng
Number of pages: 388
Subjects: Electronic industries -- Congresses; Electronic packaging -- Congresses; Electronic apparatus and appliances -- Design and construction -- Congresses; Semiconductors -- Design and construction -- Congresses; Thin film devices -- Design and construction -- Congresses; Ball grid array technology -- Congresses
Genres: Congresses.
Other titles: International Electronics Manufacturing Technology Symposium.; 2000 IEMT Symposium.
Notes: Cover title.

"IEEE Catalog Number 00CH37146"--verso of T.p.

Includes bibliographic references.