Thermomechanical couplings in solids
Subtitle: Jean Mandel memorial symposium, Paris France, 1-5 September, 1986
By: edited by H.D. Bui and Q.S. Nguyen.
Contributors: Mandel, Jean.; Bui, Huy Duong.; Nguyen, Quoc Son.; International Union of Theoretical and Applied Mechanics.; I.U.T.A.M. Symposium on "Thermomechanical Couplings in Solids" (1986 : Paris, France)
Publisher: North-Holland; Sole distributors for the U.S.A. and Canada, Elsevier Science Pub. Co.
Published: 1987
Place of publication: Amsterdam; New York; New York, N.Y., U.S.A
Language: eng
Number of pages: 425
Subjects: Thermal stresses -- Congresses.; Thermoelasticity -- Congresses.; Coupled problems (Complex systems) -- Congresses.; Materials -- Testing -- Congresses.
Notes: Includes bibliographies.
Lectures presented at the I.U.T.A.M. Symposium on "Thermomechanical Couplings in Solids," held in Paris, Sept. 1986.