Proceedings
Subtitle: Second International Conference on Properties and Applications of Dielectric Materials, Beijing, China, September 12-16, 1988
By: cosponsored by IEEE Dielectrics and Electrical Insulation Society, Chinese Electrotechnical Society-Dielectric Committee, Tsinghua University, China.
Contributors: IEEE Dielectrics and Electrical Insulation Society.; Chʻing hua ta hsüeh (Beijing, China); Chinese Electrotechnical Society. Dielectric Committee
Publisher: Tsinghua University Press
Published: 1988
Place of publication: Beijing, China
Language: eng
Number of pages: 779
Subjects: Dielectrics -- Congresses.; Dielectric measurements -- Congresses.; Electric insulators and insulation -- Congresses.
Notes: "88CH2587-4."

Includes bibliographical references and indexes.