Materials, Technology and Reliability of Low-K Dielectrics and Copper Interconnects
Subtitle: Symposium Held April 18-21, 2006, San Francisco, California, U.S. ... Society Symposium Proceedings (Hardcover))
Publisher: Materials Research Society
Published: January 2006
Language: eng
Format: Hardcover
ISBN-13: 9781558998704
Subjects: Engineering - General; Technology & Industrial Arts