Materials and process characterization for VLSI, 1988 (ICMPC '88)
By: editors X-F Zong, Y-Y Wang, J Chen.
Contributors: Zong, X-F.; Wang, Y-Y.; Chen, J.
Publisher: World Scientific
Published: 1988
Place of publication: Singapore
Language: eng
Number of pages: 531
Subjects: Integrated circuits -- Very large scale integration -- Materials -- Congresses.; Microelectronics -- Materials -- Congresses.; Silicon -- Congresses.
Other titles: Proceedings of the International Conference Materials and process characterization for VLSI.
Notes: Includes bibliographies.