Chemical-Mechanical Polishing of Low Dielectric Constant Polymers and Organosilicate Glasses
Subtitle: Fundamental Mechanisms and Application to IC Interconnect Technology
Edition: 1 edition
Publisher: Springer
Published: September 30, 2002
Language: eng
Format: Hardcover
Number of pages: 248
ISBN-13: 9781402071935
Subjects: Plastics & polymers technology; Science/Mathematics; Grinding and polishing; Integrated Circuits; Semiconductors; Technology; Technology & Industrial Arts; Polishing; Interconnects (Integrated circuit technology); Chemistry - Organic; Electronics - Semiconductors; Engineering - Electrical & Electronic; Science-Chemistry - Organic; Technology / Electronics / Semiconductors; Technology / Engineering / Industrial; Technology-Engineering - Electrical & Electronic; Electronics - Circuits - Integrated; Interconnects (Integrated circ
First sentence: For many years integrated circuit (IC) interconnect structures were relatively simple, as the main IC processing concern was fabrication of higher density transistors.