Advances in electronic packaging, 1995
Subtitle: proceedings of the International Intersociety Electronic Packaging Conference, INTERpack '95 : presented at the International Intersociety Electronic Packaging Conference, March 26-30, 1995, Lahaina, Maui, Hawaii
By: sponsored by the Electrical and Electronic Packaging Division, ASME [and] the Japan Society of Mechanical Engineers ; edited by Tai Ran Hsu, Avram Bar-Cohen, Wataru Nakayama.
Contributors: Hsu, Tai-Ran.; Bar-Cohen, Avram, 1946-; Nakayama, Wataru.; American Society of Mechanical Engineers. Electrical and Electronic Packaging Division.; Nihon Kikai Gakkai.
Series: EEP ;; vol. 10; EEP (Series) ;; vol. 10.
Publisher: American Society of Mechanical Engineers
Published: 1995
Place of publication: New York, N.Y
Language: eng
Number of pages: 1320
Subjects: Electronic packaging -- Congresses.
Notes: Includes bibliographical references and indexes.