Workshop on temperature measurement of semiconductor wafers using thermocouples
By: K.G. Kreider ... [et al., editors]
Contributors: Kreider, Kenneth G; National Institute of Standards and Technology (U.S.)
Series: NISTIR -- 6566
Publisher: U.S. Dept. of Commerce, Technology Administration, National Institute of Standards and Technology
Published: 2001
Place of publication: Gaithersburg, MD
Language: eng
Format: Microform
Subjects: Thermocouples -- Industrial applications -- Congresses; Semiconductor wafers -- Thermal properties -- Measurement -- Congresses
Genres: Congresses
Description: Presentation materials from the satellite workshop held at NIST, September 19, 2000 in collaboration with the 8th International Conference on Advanced Thermal Processing of Semiconductors-- RTP'2000 outlining how to use thermocouples for measurements of temperature in semiconductor processing and how to achieve the highest accuracy
Notes: "January 5, 2001."

Shipping list no.: 2003-0523-M

Includes bibliographical references

Microfiche. [Washington, D.C.] : Supt. of Docs., U.S. G.P.O., 2002. 2 microfiches : negative.