Monolithic microwave integrated circuits
Subtitle: interconnections and packaging considerations
By: K.B. Bhasin ... [et al.]
Contributors: Bhasin, K. B; Lewis Research Center
Series: NASA technical memorandum -- 83774
Publisher: Lewis Research Center
Published: 1984
Place of publication: Cleveland, Ohio
Language: eng
Format: Microform
Subjects: Integrated circuits
Notes: "Prepared for the Fourth Annual International Electronics Packaging Conference sponsored by the International Electronics Packaging Society, Baltimore, Maryland, October 29-31, 1984."

"N84-31461"--Microfiche header

Includes bibliographical references

Microfiche. [Washington, D.C.? : National Aeronautics and Space Administration, 1984]. 1 microfiche ; 11 x 15 cm