9th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces
Subtitle: 2004 Proceedings, March 24-26, 2004, Atlanta, Ga, U
Publisher: Institute of Electrical & Electronics Enginee
Published: January 2004
Language: eng
Format: Hardcover
Number of pages: 281
ISBN-13: 9780780384361
Subjects: Electronics - General; Technology & Industrial Arts