Materials, integration and packaging issues for high-frequency devices II
Subtitle: symposium held November 29-December 1, 2004, Boston, Massachusetts, U.S.A.
By: editors: Yong S. Cho ... [et al.].
Contributors: Cho, Yong S.; Materials Research Society.; Materials Research Society. Meeting; Symposium on Materials, Integration and Packaging Issues for High-Frequency Devices (2004 : Boston, Mass.)
Series: Materials Research Society symposium proceedings ;; v. 833; Materials Research Society symposia proceedings ;; v. 833.
Publisher: Materials Research Society
Published: 2005
Place of publication: Warrendale, Pa
Language: eng
Number of pages: 270
Subjects: Electronic packaging -- Materials -- Congresses.
Genres: Congresses.
Notes: Includes bibliographical references and indexes.
"This volume presents papers from Symposium G, 'Materials, Integration and Packaging Issues for High-Frequency Devices II, ' held November 29-December 1 at the 2004 MRS Fall Meeting in Boston, Massachusetts ..."--Pref.