MCM C/Mixed Technologies and Thick Film Sensors
Subtitle: Proceedings of the NATO Advanced Research Worshop on Advances in Multi-Chip Modules (MCM) and High Performance Electronic Materials Islamorada, Florida, U.S.A. May 23-25, 1994
By: edited by W. Kinzy Jones, Karel Kurzweil, Gábor Harsányi, Sylvia Mergui
Contributors: Kurzweil, Karel; Harsányi, Gábor; Mergui, Sylvia
Series: NATO Science Partnership Sub-Series: 3:, 1388-6576 -- 2; NATO Science Partnership Sub-Series: 3: -- 2.
Publisher: Springer Netherlands
Published: 1995
Place of publication: Dordrecht
Language: eng
Format: [electronic resource] :
Number of pages: 328
ISBN-13: 9789401100793
Other titles: Proceedings of the NATO Advanced Research Workshop on 'Advances in Ceramic Multi-Chip Modules (MCM) and High Performance Electronic Materials', Islamorada, Florida, U.S.A., May 23--25, 1994
Description: Multi-chip modules (MCMs) with high wiring density, controlled impedance interconnects, and thermal management capability have recently been developed to address the problems posed by advances in electronic systems that make demands for higher speeds and complexity. <br/> <em>MCM-C/Mixed Technologies and Thick Film Sensors</em> highlights recent advances in MCM-C technology. Developments in materials and processes which have led to increased interconnection density are reviewed: finer resolution thick film inks, high performance-low temperature dielectric tapes, precision via generation by both laser and mechanical methods, and enhanced screen printing technologies have given us feature resolution to the 50 mum line/space level. Thermal management has greatly benefitted from such new materials as cofire AIN and diamond. <br/> MCM-C technology is compatible with thick film sensors, and work is reviewed on environmental gas sensors, pressure and temperature sensors, and the development of novel materials in this area. <br/>