ISTFA 2000
Subtitle: proceedings of the 26th International Symposium for Testing and Failure Analysis : 12-16 November 2000, Meydenbauer Convention Center, Bellevue, Washington.
Contributors: ASM International.; Electronic Device Failure Analysis Society.
Publisher: ASM International
Published: 2000
Place of publication: Materials Park, Ohio
Language: eng
Number of pages: 577
Subjects: Electronics -- Materials -- Testing -- Congresses.; Electronic apparatus and appliances -- Testing -- Congresses.
Genres: Congresses.
Other titles: Proceedings of the 26th International Symposium or Testing and Failure Analysis; Conference Proceedings from the 26th International Symposium for Testing and Failure Analysis
Notes: Sponsored by EDFAS, ISTFA.

Includes bibliographical references and index.