Optoelectronic packaging
Subtitle: 1-2 February 1996, San Jose, California
By: Michael R. Feldman, Yung-Cheng Lee, chairs/editors ; sponsored and published by SPIE--the International Society for Optical Engineering ; cooperating organization, ARPA, Advanced Research Projects Agency.
Contributors: Feldman, Michael R.; Lee, Yung-Cheng.; Society of Photo-optical Instrumentation Engineers.; United States. Advanced Research Projects Agency.
Series: Proceedings / SPIE--the International Society for Optical Engineering ;; v. 2691; Proceedings of SPIE--the International Society for Optical Engineering ;; v. 2691.
Publisher: SPIE
Published: 1996
Place of publication: Bellingham, Wash
Language: eng
Number of pages: 196
Subjects: Optoelectronic devices -- Design and construction -- Congresses.; Microelectronic packaging -- Congresses.; Integrated optics -- Congresses.
Notes: Includes bibliographic references and index.