Solder joint reliability of BGA, CSP, flip chip, and fine pitch SMT assemblies
By: John H. Lau, Yi-hsin Pao.
Contributors: Pao, Yi-hsin.
Series: Electronic packaging and interconnection series
Publisher: McGraw-Hill
Published: 1997
Place of publication: New York
Language: eng
Number of pages: 408
Subjects: Microelectronic packaging -- Reliability.; Solder and soldering -- Testing.; Multichip modules (Microelectronics) -- Testing.
Notes: Includes bibliographical references and index.