IPACK2007
Subtitle: proceedings of the ASME InterPack Conference--2007 : presented at 2007 ASME InterPack Conference : July 8-12, 2007, Vancouver, BC, Canada
By: sponsored by Electronic and Photonics Packaging Division, ASME ; [Roger Schmidt, General Chair ; Hideo Miura, Co-General Chair Far East ; Jeffrey C. Suhling, Program Chair.]
Contributors: Schmidt, Roger.; Miura, Hideo.; Suhling, J. C.; American Society of Mechanical Engineers. Electronic and Photonic Packaging Division.
Publisher: American Society of Mechanical Engineers
Published: 2007
Place of publication: New York, N.Y
Language: eng
ISBN-13: 9780791842775
Subjects: Electronic packaging -- Congresses
Genres: Congresses.
Other titles: InterPack  '07
Notes: Includes bibliographical references and author index.