1st 1997 IEMT/IMC Symposium
Subtitle: April 16-18, 1997, Sonic City-Omiya, Tokyo, Japan
By: sponsored by IEEE CPMT (Components, Packaging, and Manufacturing Technology) Society [and] SHM: The Microelectronics Society--Japan.
Contributors: Components, Packaging & Manufacturing Technology Society.; International Society for Hybrid Microelectronics.; SHM: The Microelectronics Society--Japan.
Publisher: Organizing Committee
Published: 1997
Place of publication: Tokyo, Japan
Language: eng
Number of pages: 415
Subjects: Electronic apparatus and appliances -- Design and construction -- Congresses.; Electronic industries -- Congresses.; Electronic packaging -- Congresses.
Other titles: 1997 IEMT/IMC Symposium.
Notes: Cover title.

"IEEE [and] International Society for Hybrid Microelectronics [and] CPMT: Components, Packaging and Manufacturing Technology Society [and] SHM: Society for Hybrid Microelectronics."

"IEEE Catalog Number 97CH36059"--T.p. verso.

Includes bibliographical references and index.