High temperature fatigue behavior of tungsten copper composites
By: Michael J. Verrilli, Yonk-Suk Kim, and Timothy P. Gabb ; prepared for the Symposium on Fundamental Relationships Between Microstructure and Mechanical Properties of Metal-Matrix Composites cosponsored by the Metallurgical Society and the American Society for Metals, Indianapolis, Indiana, October 1-5, 1989.
Contributors: Kim, Yonk-Suk.; Gabb, Timothy Paul, 1958-; United States. National Aeronautics and Space Administration.
Series: NASA technical memorandum -- 102404.
Publisher: NASA; For sale by the National Technical Information Service
Published: 1990
Place of publication: [Washington, D.C.]; [Springfield, Va
Language: eng
Format: Microform
Number of pages: 16
Subjects: Metallic composites -- Thermal fatigue.; Copper alloys.; Fiber composites.; High temperature.; Metal fibers.; Metal matrix composites.; Thermal fatigue.; Thermodynamics.; Tungsten alloys.
Notes: Cover title.

Shipping list no.: 90-0857-M.

"E-5156"--P. [1].

Includes bibliographical references (p. 9-11).

Also available via Internet from the NASA Technical Report Server web site. Address as of 2/14/06: http://ntrs.nasa.gov/archive/nasa/casi.ntrs.nasa.gov/19900011822%5F1990011822.pdf; current access available via PURL.

Microfiche. [Washington, D.C.? : National Aeronautics and Space Administration], 1990. 1 microfiche : negative.

510-01-0A.