Electronic and photonics packaging
Subtitle: multi-scale electrical and mechanical systems--2006  presented at 2006 ASME International Mechanical Engineering Congress and Exposition : November 5-10, 2006, Chicago, Illinois, USA
By: sponsored by the Electronic and Photonic Packaging Division, ASME.
Contributors: American Society of Mechanical Engineers. Electronic and Photonic Packaging Division.; International Mechanical Engineering Congress and Exposition (2006  : Chicago, Ill.)
Series: EPP -- vol. 6; EPP (Series) -- v. 6.
Publisher: ASME
Published: 2007
Place of publication: New York, N.Y
Language: eng
Number of pages: 526
ISBN-13: 9780791847695
Subjects: Surface mount technology -- Congresses.; Electronic packaging -- Congresses.; Integrated circuits -- Wafer-scale integration -- Congresses.; Nanotechnology -- Congresses.; Photonics -- Congresses.; Microelectronic packaging -- Congresses.; Microelectromechanical systems -- Congresses.
Genres: Congresses.
Notes: Includes bibliographical references and author index.