Microelectronics packaging handbook
By: edited by Rao R. Tummala, Eugene J. Rymaszewski, Alan G. Klopfenstein.
Contributors: Tummala, Rao R., 1942-; Rymaszewski, Eugene J.
Edition: 2nd ed.
Publisher: Chapman & Hall
Published: 1997
Place of publication: New York
Language: eng
Subjects: Microelectronic packaging -- Handbooks, manuals, etc.
Notes: Includes bibliographical references and index.
Table of contents: value: pt. 1. Technology drivers; value: pt. 2. Semiconductor packaging; value: pt. 3. Subsystem packaging.