Photonics packaging and integration VI
Subtitle: 25-26 January, 2006, San Jose, California, USA
By: Allen M. Earman, Ray T. Chen, chairs/editors ; sponsored and published by SPIE--the International Society for Optical Engineering
Contributors: Society of Photo-optical Instrumentation Engineers
Series: Proceedings of SPIE -- v. 6126; Proceedings of SPIE--the International Society for Optical Engineering -- v. 6126.
Publisher: SPIE
Published: 2006
Place of publication: Bellingham, Wash
Language: eng
Other titles: Optoelectronic interconnects. Photonics packaging and integration.
Notes: Some earlier conferences were part of a larger conference entitled: Optoelectronic interconnects. Photonics packaging and integration.

Includes bibliographical references and author index.