New technology in electronic packaging
Subtitle: proceedings of ASM International's 3rd Electronic Materials & Processing Congress, San Francisco, California, USA, 20-23 August 1990
By: edited by B.R. Livesay and M.D. Nagarkar ; sponsored by the Electronic Materials and Processing Division of ASM International.
Contributors: Livesay, B. R.; Nagarkar, M. D.; ASM International. Electronic Materials and Processing Division.
Publisher: ASM International
Published: 1990
Place of publication: Materials Park, Ohio
Language: eng
Number of pages: 378
Subjects: Electronic packaging -- Congresses.; Microelectronic packaging -- Congresses.; Microelectronics -- Corrosion -- Congresses.
Notes: Includes bibliographical references.