Plastic-encapsulated microelectronics
Subtitle: materials, processes, quality, reliability, and applications
By: edited by Michael G. Pecht, Luu T. Nguyen, Edward B. Hakim.
Contributors: Pecht, Michael.; Nguyen, Luu T.; Hakim, Edward B.
Publisher: Wiley; Wiley-Interscience
Published: 1995
Place of publication: New York
Language: eng
Number of pages: 474
Subjects: Microelectronic packaging -- Materials.; Microencapsulation.; Plastics in packaging.
Description: The past twenty years have seen many important advances in plastic encapsulated microelectronics (PEM) technology. Thanks to new packaging materials, improved design, increased reliability testing, and other important developments, PEMs are now perceived as a dependable and, in many cases, more cost-effective option for a wide range of electronic systems applications. Nevertheless, there continues to be a surprising death of authoritative references on the subject.

Until now, professionals in search of detailed information about the latest developments in PEM design and production have had to waste valuable time browsing through countless professional journals, monographs, and databases.

For the first time between two covers, here is a comprehensive, critical review of the state of the art in PEMs and assemblies that incorporate them. The most timely book on the subject, it provides professionals with a systematic, scientific exploration of crucial technical and reliability issues concerning the manufacture and use of PEMs - with special attention focusing on environment-specific applications.

Plastic-Encapsulated Microelectronics is an indispensable resource for researchers and practicing mechanical and electrical engineers working in the electronics, aerospace, and automotive industries, in space agencies, or in the defense industry.
Notes: Includes bibliographical references and index.
"A Wiley-Interscience publication."