1996 International Conference on Simulation of Semiconductor Processes and Devices
Subtitle: SISPAD '96, September 2-4, 1996, Toyo University, Hakusan Campus, Tokyo, Japan
By: sponsored by Japan Society of Applied Physics, IEEE Electron Devices Society in cooperation with Institute of Electronics, Communication and Information Engineers, IEEE Electron Devices Tokyo Chapter.
Contributors: Ōyō Butsuri Gakkai.; IEEE Electron Devices Society.
Publisher: Business Center for Academic Societies; Copies available at IEEE Service Center
Published: 1996
Place of publication: Tokyo, Japan; Piscataway, N.J
Language: eng
Number of pages: 184
Subjects: Semiconductors -- Mathematical models -- Congresses.
Notes: Includes bibliographical references and index.
"IEEE catalog number 96TH8095"--T.p. verso.