Structural analysis in microelectronics and fiber optics, 1996
Subtitle: presented at the 1996 ASME International Mechanical Engineering Congress and Exposition, November 17-22, 1996, Atlanta, Georgia
By: sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by E. Suhir.
Contributors: Suhir, Ephraim.; American Society of Mechanical Engineers. Electrical and Electronic Packaging Division.; International Mechanical Engineering Congress and Exposition (1996 : Atlanta, Ga..)
Series: EEP ;; vol. 16; EEP (Series) ;; vol. 16.
Publisher: American Society of Mechanical Engineers
Published: 1996
Place of publication: New York
Language: eng
Number of pages: 225
Subjects: Microelectronic packaging -- Congresses.; Fiber optics -- Congresses.; Structural analysis (Engineering) -- Congresses.
Notes: Includes bibliographical references and index.