Advanced metallization for ULSI applications
Subtitle: proceedings of the conference held October 8-10, 1991, at AT&T Bell Laboratories, Murray Hill, New Jersey, U.S.A., and October 28-30, 1991, Tokyo, Japan
By: sponsored by Continuing Education in Engineering, University Extension, University of California, Berkeley, U.S.A. ; editors, Virendra V.S. Rana, Rajiv V. Joshi, Iwao Ohdomari ; associate editors, Robert S. Blewer ... [et al.].
Contributors: Rana, Virendra Vir Singh.; Joshi, Rajiv V.; Ohdomari, I.; University of California, Berkeley. Continuing Education in Engineering.
Series: Materials Research Society conference proceedings,
Publisher: Materials Research Society.
Published: 1992
Place of publication: Pittsburgh
Language: eng
Number of pages: 580
Subjects: Integrated circuits -- Ultra large scale integration -- Materials -- Congresses.; Tungsten -- Congresses.; Vapor-plating -- Congresses.; Electrochemical metallizing -- Congresses.
Notes: Includes bibliographical references and indexes.
"Formerly Workshop on Tungsten and Other Advanced Metals for ULSI Applications."