Fracture mechanics and technology
Subtitle: proceedings of an international conference on fracture mechanics and technology, held at the Convention Centre, Hong Kong, March 21-25, 1977
By: editors, G. C. Sih, C. L. Chow.
Contributors: Sih, G. C.; Chow, C. L.; Lehigh University.; Hongkong. University.
Publisher: Sijthoff and Noordhoff International Publishers
Published: 1977
Place of publication: Alphen aan den Rijn
Language: eng
Subjects: Fracture mechanics -- Congresses.
Notes: Includes bibliographical references.
Sponsored by Lehigh University, Bethlehem, Pa. and the University of Hong Kong, Hongkong.