Multichip module design, fabrication, and testing
By: James J. Licari.
Series: Electronic packaging and interconnection series
Publisher: McGraw-Hill
Published: 1995
Place of publication: New York
Language: eng
Number of pages: 381
Subjects: Electronic packaging.; Multichip modules (Microelectronics) -- Design and construction.; Multichip modules (Microelectronics) -- Testing.
Notes: Includes bibliographical references and index.