Electronic and photonic packaging, electrical systems and photonic design, and nanotechnology
Subtitle: presented at the 2002 ASME International Mechanical Engineering Congress and Exposition, November 17-22, 2002, New Orleans, Louisiana
By: sponsored by the Electronic and Photonic Packaging Division, ASME.
Contributors: American Society of Mechanical Engineers. Electronic and Photonic Packaging Division.; International Mechanical Engineering Congress and Exposition (2002 : New Orleans, La.)
Series: EPP ;; vol. 2; EPP (Series) ;; v. 2.
Publisher: American Society of Mechanical Engineers
Published: 2002
Place of publication: New York
Language: eng
Number of pages: 572
Subjects: Electronic packaging -- Congresses.; Photonics -- Congresses.; Nanotechnology -- Congresses.; Microelectronic packaging -- Congresses.; Surface mount technology -- Congresses.; Microelectromechanical systems -- Congresses.; Integrated circuits -- Wafer-scale integration -- Congresses.
Genres: Congresses.
Notes: Includes bibliographical references and index.