RF and microwave microelectronics packaging
By: Ken Kuang, Franklin Kim, Sean S. Cahill, editors
Publisher: Springer
Published: 2010
Place of publication: New York; London
Language: eng
Number of pages: 285
ISBN-13: 9781441909831
Subjects: Microelectronic packaging
Other titles: Radio frequency and microwave microelectronics packaging
Notes: Includes bibliographical references and index.