Advances in electronic packaging, 1997
Subtitle: proceedings of the Pacific Rim/ASME International Intersociety Electronic & Photonic Packaging Conference, INTERpack '97 : presented at the Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference, June 15-19, 1997, Kohala Coast, Hawaii
By: sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by E. Suhir ... [et al.]
Contributors: Suhir, Ephraim.; American Society of Mechanical Engineers. Electrical and Electronic Packaging Division.
Series: EEP ;; vol. 19; EEP (Series) ;; vol. 19.
Publisher: American Society of Mechanical Engineers
Published: 1997
Place of publication: New York, N.Y
Language: eng
Subjects: Electronic packaging -- Congresses.
Other titles: Proceedings of the Pacific Rim/ASME International Intersociety Electronic & Photonic Packaging Conference; INTERpack '97
Notes: Includes bibliographic references and indexes.