ICSD '95
Subtitle: proceedings of the 1995 IEEE 5th International Conference on Conduction and Breakdown in Solid Dielectrics, July 10-13, 1995, Leicester, England
By: sponsored by the IEEE Dielectrics and Electrical Insulation Society.
Contributors: IEEE Dielectrics and Electrical Insulation Society.
Publisher: Institute of Electrical and Electronics Engineers; Available from IEEE Service Center
Published: 1995
Place of publication: [New York, N.Y.]; Piscataway, NJ
Language: eng
Number of pages: 720
Subjects: Dielectrics -- Congresses.; Breakdown (Electricity) -- Congresses.; Electric conductivity -- Congresses.
Other titles: ICSD ninety-five.; Proceedings of the 1995 IEEE 5th International Conference on Conduction and Breakdown in Solid Dielectrics.; Proceedings of the 5th International Conference on Conduction and Breakdown in Solid Dielectrics.; 1995 IEEE 5th International Conference on Conduction & Breakdown in Solid Dielectrics.
Notes: "95CH3476-9."

Includes bibliographical references and index.