Proceedings of the International Symposium on Wafer Bonding (Proceedings / Electrochemical Society)
Publisher: Electrochemical Society
Published: January 1997
Language: eng
Format: Hardcover
Number of pages: 618
ISBN-13: 9781566771894
Subjects: Science/Mathematics; Technology; General; Bonding; Congresses; Design and construction; Microelectromechanical systems; Semiconductor wafers; Semiconductors