Semiconductor wafer bonding : science, technology, and applications V
Subtitle: proceedings of the International Symposia
By: editors, Charles E. Hunt ... [et al.] ; Electronics Division [of the Electrochemical Society].
Contributors: Hunt, C. E.; Electrochemical Society. Electronics Division.; Electrochemical Society. Meeting; International Symposium on Semiconductor Wafer Bonding (5th : 1999 : Honolulu, Hawaii)
Series: Proceedings / Electrochemical Society -- v. 99-35; Proceedings (Electrochemical Society) -- v. 99-35.
Publisher: Electrochemical Society
Published: 2001
Place of publication: Pennington, New Jersey
Language: eng
Number of pages: 480
Subjects: Semiconductors -- Bonding -- Congresses; Semiconductor wafers -- Congresses; Microelectromechanical systems -- Design and construction -- Congresses
Genres: Congresses.
Notes: "The Fifth International Symposium on Wafer Bonding was held mid-October of 1999, returning to the ECS Meeting venue in Honololu."--Preface.

Includes bibliographic references and indexes.