Proceedings of International Conference on Electronic Components and Materials
Subtitle: November 7-10, 1989, Beijing, China.
Contributors: CIE Electronic Components Society.
Edition: 1st ed.
Publisher: International Academic Publishers; Pergamon Press
Published: 1989
Place of publication: [Beijing]; Oxford; New York
Language: eng
Number of pages: 593
Subjects: Electronic apparatus and appliances -- Congresses.; Electronics -- Materials -- Congresses.
Other titles: Electronic components and materials.
Notes: Includes bibliographical references.
Sponsored by CIE Electronic Components Society and others.