MEMS/MOEMS packaging
Subtitle: concepts, designs, metarials, and processes
By: Ken Gilleo
Publisher: McGraw-Hill
Published: 2005
Place of publication: New York
Language: eng
Number of pages: 220
Subjects: Microelectronic packaging; Microelectromechanical systems; Optoelectronic devices
Notes: Includes bibliographical references (p. 203-213) and index