Electronic packaging and corrosion in microelectronics
Subtitle: proceedings of ASM's Third Conference on Electronic Packaging: Materials and Processes & Corrosion in Microelectronics, Minneapolis, Minnesota, 28-30 April 1987
By: edited by Morris E. Nicholson ; sponsored by Electronic Materials and Processing Division of ASM International and Corrosion Research Center of the University of Minnesota in cooperation with the Minnesota Chapter of ASM International ; supported by Twin City Section of NACE, IEEE Reliability Society, IEEE Components, Hybrids and Manufacturing Technology Society.
Contributors: Nicholson, Morris E.; ASM International. Electronic Materials and Processing Division.; University of Minnesota. Corrosion Research Center.; ASM International. Minnesota Chapter.
Publisher: ASM International
Published: 1987
Place of publication: [Metals Park, Ohio]
Language: eng
Number of pages: 296
Subjects: Microelectronic packaging -- Congresses.; Microelectronics -- Corrosion -- Congresses.
Notes: Includes bibliographies.