ISTFA '93
Subtitle: proceedings of the 19th International Symposium for Testing and Failure Analysis, 15-19 November 1993, Los Angeles, California
By: sponsored by the Electronic Materials and Processing Division, ASM International.
Contributors: ASM International. Electronic Materials and Processing Division
Publisher: ASM International
Published: 1993
Place of publication: Materials Park, OH
Language: eng
Number of pages: 436
Subjects: Electronics -- Materials -- Testing -- Congresses; Electronic apparatus and appliances -- Testing -- Congresses
Notes: 16