Chemical-mechanical polishing of low dielectric constant polymers and organosilicate glasses
Subtitle: fundamental mechanisms and application to IC interconnect technology
By: by Christopher L. Borst, William N. Gill, Ronald J. Gutmann.
Contributors: Gill, William N.; Gutmann, Ronald J.
Publisher: Kluwer Academic Publishers
Published: 2002
Place of publication: Boston
Language: eng
Number of pages: 229
Subjects: Interconnects (Integrated circuit technology); Semiconductors -- Polishing; Grinding and polishing
Notes: Includes bibliographical references and index.