Advances in Electronic Packaging, 2003: Presented at 2003 International Electronic Packaging Technical Conference and Exhibition
Subtitle: July 6-11, 2003, Mau
Publisher: American Society of Mechanical Engineers
Published: January 2003
Language: eng
Format: Hardcover
Number of pages: 2
ISBN-13: 9780791836910
Subjects: Electronics - General; Technology & Industrial Arts