Advanced metallization and interconnect systems for ULSI applications in 1995
Subtitle: proceedings of the conference held October 3-5, 1995 in Portland, Oregon, sponsored by Continuing Education in Engineering, University Extension, University of California at Berkeley, U.S.A., a parallel session of the conference was held from October 24- 25, 1995 in Tokyo, Japan
By: editors, Russell C. Ellwanger, Shi-Qing Wang.
Contributors: Ellwanger, Russell C.; Wang, Shi-Qing.; University of California, Berkeley. Continuing Education in Engineering.
Series: Conference proceedings,; Materials Research Society conference proceedings.
Publisher: Materials Research Society
Published: 1996
Place of publication: Pittsburgh, Pa
Language: eng
Number of pages: 767
Subjects: Integrated circuits -- Ultra large scale integration -- Design and construction -- Congresses.; Vapor-plating -- Congresses.; Electrochemical metallizing -- Congresses.; Dielectrics -- Congresses.; Titanium nitride -- Congresses.
Notes: Includes bibliographical references and indexes.