Through-hole solder joint evaluation desk reference manual
Edition: Rev. 1.1.
Publisher: IPC, Institute for Interconnecting and Packaging Electronic Circuits
Published: 1997
Place of publication: Northbrook, IL
Language: eng
Number of pages: 31
Subjects: Electronic apparatus and appliances; Handbooks, manuals; Design and construction; Welded joints; Solder and soldering
Notes: Cover title.