The Destructive bond pull test
By: John Albers, editor.
Contributors: Albers, John.
Series: Semiconductor measurement technology; National Bureau of Standards special publication ; 400-18; NBS special publication ;; 400-18.
Publisher: U.S. Dept. of Commerce, National Bureau of Standards : for sale by the Supt. of Docs., U.S. Govt. Print. Off.
Published: 1976
Place of publication: [Washington]
Language: eng
Number of pages: 44
Subjects: Aluminum wire -- Testing.; Aluminum wire -- Bonding.; Semiconductors -- Bonding.
Notes: Includes bibliographical references.
"Jointly supported by: the National Bureau of Standards, the Defense Nuclear Agency, and the Navy Strategic Systems Project Office."