Application of Fracture Mechanics in Electronic Packaging
Subtitle: Presented at the 1997 Asme International Mechanical Engineering Congress and Exposition, November ... Dallas, Texas (Amd (Series), Vol. 222.)
Contributors: American Society of Mechanical Engineers. Applied Mechanics Division (Corporate Author); American Society of Mechanical Engineers. Electrical and Electronic Packaging Division (Corporate Author); William T. Chen (Editor); D. T. Read (Editor)
Publisher: American Society of Mechanical Engineers
Published: January 1997
Language: eng
Format: Hardcover
Number of pages: 200
ISBN-13: 9780791818275
Subjects: Electronics engineering; Materials science; Science/Mathematics; Fracture; Congresses; Technology & Industrial Arts; Technology; Multichip modules (Microelectronics); Multichip modules (Microelectr; Fracture mechanics; Electronics - General; Electronic packaging; Materials