Extended abstracts of the Seventh International Workshop on Junction Technology
Subtitle: June 8-9, 2007, Kyoto, Japan
By: sponsored by Japan Society of Applied Physics/Silicon Technology Division, Chinese Institute of Electronics, and SEMI Japan ; technically cosponsored by IEEE EDS, IEEE EDS Japan Chapter, and IEEE DES Kansai Chapter.
Contributors: Ōyō Butsuri Gakkai. Shirikon Tekunorojī Bunkakai.; Zhongguo dian zi xue hui.; Semiconductor Equipment and Materials International (Japan); IEEE Electron Devices Society.; IEEE Electron Devices Society. Japan Chapter.; IEEE Electron Devices Society. Kansai Chapter.
Publisher: IEEE
Published: 2007
Place of publication: Piscataway, NJ
Language: eng
Number of pages: 146
Subjects: Semiconductors -- Junctions -- Congresses; Semiconductors -- Design and construction -- Congresses; Integrated circuits -- Very large scale integration -- Design and construction -- Congresses
Genres: Congresses.
Other titles: Seventh International Workshop on Junction Technology
Notes: Includes bibliographical references.