Troubleshooting for printed board manufacture and assembly
By: developed by the Process Effects Handbook Subcommittee of the Process Control Management Committee of the Institute for Interconnecting and Packaging Electronic Circuits.
Contributors: Institute for Interconnecting and Packaging Electronic Circuits (Northbrook, Ill.)
Publisher: IPC
Published: 1997
Place of publication: Northbrook, Ill
Language: eng
Subjects: Printed circuits -- Design and construction.
Notes: Includes index.
"IPC-PE-740."