Wafer bonding
Subtitle: applications and technology
By: M. Alexe, U. Gösele (eds.).
Contributors: Alexe, M.; Gösele, U.
Series: Springer series in materials science
Publisher: Springer
Published: 2004
Place of publication: Berlin; New York
Language: eng
Number of pages: 499
ISBN-13: 9783540210498
Subjects: Semiconductors -- Bonding; Semiconductor wafers
Notes: Includes bibliographical references and index.