Advances in electronic materials and packaging
Subtitle: [proceedings of the 3rd International Symposium on Electronic Materials and Packaging 2001 : November 19-22, 2001, Jeju Island, Korea
By: organized by Korea Advanced Institute of Science & Technology ... [et al.] ; in collaboration with Institute of Electrical and Electronics Engineers, IEEE Component, Packaging & Manufacturing Technology] ; S.B. Lee and K.W. Paik, editors.
Contributors: Lee, S. B.; Paik, K. W.; Hanʼguk Kwahak Kisurwŏn.; Institute of Electrical and Electronics Engineers.; Components, Packaging & Manufacturing Technology Society.
Publisher: IEEE
Published: 2001
Place of publication: Piscataway, N.J
Language: eng
Number of pages: 449
Subjects: Electronic packaging -- Congresses
Genres: Congresses.
Other titles: EMAP2001.; Electronic materials and packaging.
Notes: " ... EMAP2001 ..."--Foreword.

Includes advertising material.

Includes bibliographical references and author index.

Also available via the World Wide Web.