Simulation, remodeling, and analysis of printed circuit board assembly equipment
By: by Flor Maria Caballero Fortuno.
Series: Master's theses (State University of New York at Binghamton) -- no. 2137
Published: 1995
Language: eng
Number of pages: 197
Subjects: Manufacturing processes -- Computer simulation.; Simulation methods.; Mathematical models.; Electronic packaging.; Surface mount technology.
Notes: Thesis (M.A.)--State Univesity of New York at Binghamton, Watson School of Engineering, Department of Systems Science and Industrial Engineering.

Includes bibliographical references (leaves 111-114).