Low thermal expansion alloys and composites
Subtitle: proceedings of a symposium co-sponsored by the Refractory Metals Committee of the Structural Materials Division (SMD) and the Electronic Packaging and Interconnection Materials Committee of the Electronic, Magnetic, and Photonics Materials Division (EMPMD), held at the Fall Meeting of the Minerals, Metals and Materials Society in Chicago, Illinois, November 2-5, 1992
By: edited by John J. Stephens and Darrel R. Frear.
Contributors: Stephens, John J.; Frear, D. R.; Minerals, Metals and Materials Society. Refractory Metals Committee.; Minerals, Metals and Materials Society. Electronic Packaging and Interconnection Materials Committee.
Publisher: Minerals, Metals & Materials Society
Published: 1994
Place of publication: Warrendale, Pa
Language: eng
Number of pages: 225
Subjects: Alloys -- Expansion and contraction -- Congresses; Iron-nickel-cobalt alloys -- Expansion and contraction -- Congresses; Composite materials -- Expansion and contraction -- Congresses
Notes: Includes bibliographical references and indexes.