Effects of thermal treatment on tensile creep and stress-rupture behavior on Hi-Nicalon SiC fibers
By: H.M. Yun, J.C. Goldsby, adn J.A. DiCarlo.
Contributors: Goldsby, Jon C.; DiCarlo, James A.; United States. National Aeronautics and Space Administration.
Series: NASA technical memorandum -- 107087.
Publisher: National Aeronautics and Space Administration; National Technical Information Service, distributor
Published: 1995
Place of publication: [Washington, D.C.]; [Springfield, Va
Language: eng
Format: Microform
Subjects: Annealing.; Creep properties.; Creep rupture strength.; Silicon carbides.; Tensile creep.
Notes: Distributed to depository libraries in microfiche.

Shipping list no.: 96-0245-M.

Microfiche. [Washington, D.C. : National Aeronautics and Space Administration, 1995] 1 microfiche.