Third International Conference on Experimental Mechanics and Third Conference of the Asian Committee on Experimental Mechanics
Subtitle: 29 November-1 December, 2004, Singapore
By: Chenggen Quan ... [et al.], editors ; organized by National University of Singapore/Department of Mechanical Engineering (Singapore), Nanyang Technological University/School of Mechanical and Production Engineering (Singapore) ; sponsored by Lee Foundation (Singapore) ... [et al.].
Contributors: Quan, Chenggen.; National University of Singapore. Dept. of Mechanical Engineering.; Nanyang Technological University. School of Mechanical and Production Engineering.; Lee Foundation (Singapore); Society of Photo-optical Instrumentation Engineers.; Asian Committee on Experimental Mechanics. Conference
Series: Proceedings of SPIE,; v. 5852; Proceedings of SPIE--the International Society for Optical Engineering ;; v. 5852.
Publisher: SPIE
Published: 2005
Place of publication: Bellingham, Wash
Language: eng
Number of pages: 972
Subjects: Mechanics, Applied -- Congresses.; Testing -- Congresses.; Materials -- Testing -- Congresses.
Genres: Congresses.
Other titles: Experimental mechanics; Third Conference of the Asian Committee on Experimental Mechanics
Notes: Includes bibliographical references and author index.