ISTFA 2011
Subtitle: conference proceedings from the 37th International Symposium for Testing and Failure Analysis, November 13-17, 2011, San Jose Convention Center, San Jose, California
By: sponsored by EDFAS, ISTFA/2011, ASM International
Contributors: Electronic Device Failure Analysis Society; International Symposium for Testing and Failure Analysis/2011; ASM International
Publisher: ASM International
Published: 2011
Place of publication: Materials Park, OH
Language: eng
Number of pages: 456
ISBN-13: 9781615038268
Subjects: Electronics; Testing; Congresses; Electronic apparatus and appliances; Materials
Other titles: International Symposium for Testing and Failure Analysis 2011; Conference proceedings of the 37th International Symposium for Testing and Failure Analysis; 37th International Symposium for Testing and Failure Analysis; Thirty-seventh International Symposium for Testing and Failure Analysis
Notes: Includes bibliographical references and index.