Reliability, packaging, testing, and characterization of MEMS/MOEMS VI
Subtitle: 23-24 January, 2007, San Jose, California, USA
By: Allyson L. Hartzell, Rajeshuni Ramesham, chairs/editors ; sponsored and published by SPIE--the International Society for Optical Engineering.
Contributors: Hartzell, Allyson L.; Ramesham, Rajeshuni.; Society of Photo-optical Instrumentation Engineers.
Series: Proceedings of SPIE -- v. 6463; Proceedings of SPIE--the International Society for Optical Engineering -- v. 6463.
Publisher: SPIE
Published: 2007
Place of publication: Bellingham, Wash
Language: eng
ISBN-13: 9780819465764
Subjects: Microelectromechanical systems -- Reliability -- Congresses; Microelectromechanical systems -- Testing -- Congresses; Microelectronic packaging -- Congresses
Genres: Congresses.
Other titles: Reliability, testing and characterization of MEMS/MOEMS VI.
Notes: Some previous conferences entitled: Reliability, testing, and characterization of MEMS/MOEMS

Includes bibliographical references and author index.