Electronic and photonic packaging, Integration and packaging of micro/nano/electronic systems--2005
Subtitle: presented at 2005 ASME International Mechanical Engineering Congress and Exposition : November 5-11, 2005, Orlando, Florida, USA
By: sponsored by the Electronic and Photonic Packaging Division, ASME.
Contributors: American Society of Mechanical Engineers. Electronic and Photonic Packaging Division.; International Mechanical Engineering Congress and Exposition (2005  : Orlando, Fla.)
Series: EPP -- vol. 5.; EPP (Series) -- v. 5.
Publisher: ASME
Published: 2005
Place of publication: New York, N.Y
Language: eng
Number of pages: 606
Subjects: Electronic packaging -- Congresses.; Photonics -- Congresses.; Nanotechnology -- Congresses.; Microelectronic packaging -- Congresses.; Surface mount technology -- Congresses.; Microelectromechanical systems -- Congresses.; Integrated circuits -- Wafer-scale integration -- Congresses.
Genres: Congresses.
Notes: Includes bibliographical references and author index.