New visions in electronic packaging in the 70's.
Contributors: Institute of Electrical and Electronics Engineers. Component Hybrid and Packaging Technologies Group.; Institute of Electrical and Electronics Engineers. Boston Section.
Published: 1970
Place of publication: [New York?
Language: eng
Subjects: Microelectronic packaging -- Congresses.
Notes: Cover title.
Sponsored by the Component Hybrid and Packaging Technologies Group and the Boston Section, IEEE.