Lead free solder
Subtitle: mechanics and reliability
By: John Hock Lye Pang
Publisher: Springer
Published: 2012
Place of publication: New York, NY
Language: eng
Number of pages: 175
ISBN-13: 9781461404620; 9781461404637
Subjects: Lead-free electronics manufacturing processes; Green electronics; Solder and soldering
Notes: Includes bibliographical references and index.