2003 IEEE International Conference on Simulation of Semiconductor Processes and Devices
Subtitle: SISPAD 2003 : Boston, Massachusetts, USA, 3-5 September, 2003
By: sponsored by IEEE Electron Devices Society.
Contributors: IEEE Electron Devices Society
Publisher: IEEE
Published: 2003
Place of publication: Piscataway, N.J
Language: eng
Number of pages: 329
Subjects: Semiconductors -- Mathematical models. -- Congresses.
Genres: Congresses.
Other titles: Simulation of semiconductor processes and devices; SISPAD 2003
Notes: Also available via the World Wide Web.
Includes bibliographic references and index.
"IEEE Catalog Number 03TH8679"--T.p. verso.