Enhanced cooling techniques for electronics applications
Subtitle: presented at the 1993 ASME Winter Annual Meeting, New Orleans, Louisiana, November 28-December 3, 1993
By: sponsored by the Heat Transfer Division, ASME ; edited by S.V. Garimella ... [et al.].
Contributors: Garimella, S. V.; American Society of Mechanical Engineers. Heat Transfer Division.
Series: HTD ;; vol. 263; HTD (Series) ;; v. 263.
Publisher: American Society of Mechanical Engineers
Published: 1993
Place of publication: New York, N.Y
Language: eng
Number of pages: 143
Subjects: Electronic apparatus and appliances -- Cooling -- Congresses.; Heat -- Convection -- Congresses.; Heat -- Transmission -- Congresses.; Heat -- Radiation and absorption -- Congresses.; Electronics -- Materials -- Congresses.
Notes: Includes bibliographical references and index.
"Book no. H00841."