Reliability, yield, and stress burn-in
Subtitle: a unified approach for microelectronics systems manufacturing & software development
By: by Way Kuo, Wei-Ting Kary Chien, Taeho Kim.
Contributors: Chien, Wei-Ting Kary, 1965-; Kim, Taeho, 1960-
Publisher: Kluwer Academic Publishers
Published: 1998
Place of publication: Boston, Mass
Language: eng
Number of pages: 394
Subjects: Integrated circuits -- Design and construction -- Reliability; Microelectronics -- Reliability; Computer software -- Development -- Reliability; Semiconductors -- Computer programs -- Reliability
Description: Reliability, Yield, and Stress Burn-In explains reliability issues in Microelectronics Systems Manufacturing and Software Development with an emphasis on evolving manufacturing technology for the semiconductor industry.

Since most microelectronics components have their infant mortality period for about one year under the ordinary operating conditions, and many of the modern systems, such as the PC's, are heavily used in the first few years, the reliability problem at the infant mortality period becomes extremely important. Burn-in is an accelerated screening procedure that eliminates early on the infant mortalities in the shop before shipping out the products to the customers.

This book will also help readers to analyze systems that exhibit high failure rate during a long infant mortality period.

Reliability, Yield, and Stress Burn-In presents ways to systematically analyze burn-in policy at that component, sub-system, and system levels. Various statistical methods are addressed including parametric, nonparametric, and Bayesian approaches. Many case studies are introduced in combination with the developed theories. Included in the book is an introduction to software reliability.
Notes: Includes bibliographical references (p. [333]-361) and index.