Printed wiring board industry and use cluster profile
Contributors: Design for the Environment Program (U.S.); Microelectronics and Computer Technology Corporation.; Institute for Interconnecting and Packaging Electronic Circuits (Evanston, Ill.)
Series: Design for the environment
Publisher: Design for the Environment Program, Economics, Exposure, and Technology Division, Office of Pollution Prevention and Toxics, U.S. Environmental Protection Agency
Published: 1995
Place of publication: Washington, DC
Language: eng
Format: Microform
Subjects: Printed circuits industry -- United States.; Printed circuits -- Standards -- United States.; Manufacturing processes -- United States.
Notes: "Design for the Environment printed wiring board project"--Cover.

"Prepared by Microelectronics and Computer Technology Corporation and the Institute for Interconnecting and Packaging Electronic Circuits"--1st prelim. p.

Shipping list no.: 97-0792-M.

"September 1995"--Cover.

"This document was produced under grant #X 823856-01-0 from EPA's Environmental Technology Initiative program."

"EPA 744-R-95-005"--Cover.

Includes bibliographical references.

Microfiche. [Washington, D.C.] : Supt. of Docs., U.S. G.P.O., [1997] 1 microfiche : negative.