Performing repair rework on SMT, fine pitch, and BGA
Edition: 5th ed edition
Publisher: SMT Plus, Inc
Published: 1996
Language: eng
Format: Unknown Binding
ISBN-13: 9781882812172
Subjects: Ball grid array technology; Electronic packaging; Fine pitch technology; Integrated circuits; Maintenance and repair; Microelectronic packaging; Solder and soldering; Surface mount technology