Emerging food packaging technologies
Subtitle: principles and practice
By: edited by Kit L. Yam and Dong Sun Lee
Series: Woodhead Publishing series in food science, technology and nutrition -- no. 230; Woodhead Publishing in food science, technology, and nutrition -- no. 230.
Publisher: Woodhead Pub.
Published: 2012
Place of publication: Oxford; Philadelphia, PA
Language: eng
Number of pages: 482
ISBN-13: 9781845698096
Subjects: Food; Packaging
Notes: Includes bibliographical references and index.