Inelastic strain analysis of solder joint in NASA fatigue specimen
Subtitle: final report
By: prepared by Abhijit Dasgupta, Chen Oyan.
Contributors: Oyan, Chen.; University of Maryland, College Park.; Goddard Space Flight Center.
Series: NASA-CR -- 187864.; NASA contractor report -- NASA CR-187864.
Publisher: University of Maryland; NASA Goddard Space Flight Center
Published: 1991
Place of publication: College Park, MD; [Greenbelt, MD]
Language: eng
Format: Microform
Subjects: Strains and stresses.; Solder and soldering.; Creep analysis.; Elastic properties.; Fatigue (Materials); Fatigue life.; Finite element method.; Plastic properties.; Solders.; Thermal cycling tests.; Viscoplasticity.
Notes: Microfiche. [Washington, D.C.] : National Aeronautics and Space Administration, [1991]. 1 microfiche.