First International Conference on Microchannels and Minichannels
Subtitle: presented at the First International Conference on Microchannels and Minichannels, April 24-25, 2003, Rochester, New York
By: sponsored by the American Society of Mechanical Engineers, ASME, the Rochester Institute of Technology ; principal editor, S.G. Kandlikar ; contributing editors, G.P. Celata ... [et al.].
Contributors: Kandlikar, S. G.; Celata, G. P.; American Society of Mechanical Engineers.; Rochester Institute of Technology.
Publisher: American Society of Mechanical Engineers
Published: 2003
Place of publication: New York, N.Y
Language: eng
Number of pages: 989
Subjects: Heat -- Transmission -- Congresses.; Heat sinks (Electronics) -- Congresses.
Genres: Congresses.
Other titles: Microchannels amd minichannels
Notes: Includes bibliographical references and index.