Advanced materials for thermal management of electronic packaging
By: Xingcun Colin Tong
Series: Springer series in advanced microelectronics -- 30; Springer series in advanced microelectronics -- 30.
Publisher: Springer
Published: 2011
Place of publication: New York; London
Language: eng
Number of pages: 616
ISBN-13: 9781441977588; 9781441977595
Subjects: Temperature control; Materials; Electronic apparatus and appliances; Electronic packaging
Notes: Includes bibliographical references and index.
Table of contents: title: Thermal management fundamentals and design guides in electronic packaging; title: Characterization methodologies of thermal management materials; title: Electronic packaging materials and their functions in thermal managements; title: Monolithic carbonaceous materials and carbon matrix composites; title: Thermally conductive polymer matrix composites; title: HIgh thermal conductivity metal matrix composites; title: Thermally conductive ceramic matrix composites; title: Thermal interface materials in electronic packaging; title: Materials and design for advanced heat spreader and air cooling heat sinks; title: Liquid cooling devices and their materials selection; title: Thermoelectric cooling through thermoelectric materials; title: Development and application of advanced thermal management materials; title: Standards and specifications for evaluation of thermal management in electronic industry.