Ceramic substrates and packages for electronic applications
By: edited by Man F. Yan ... [et al.].
Contributors: Yan, Man F.; American Ceramic Society. Electronics Division.; Yōgyō Kyōkai (Japan)
Series: Advances in ceramics ;; v. 26
Publisher: American Ceramic Society
Published: 1989
Place of publication: Westerville, Ohio
Language: eng
Number of pages: 608
Subjects: Electronic ceramics -- Congresses.; Electronic packaging -- Congresses.
Notes: Includes bibliographical references.
"Proceedings of the International Symposium on Ceramic Substrates and Packages, sponsored by the Electronics Division of the American Ceramic Society and the Ceramic Society of Japan, held in Denver, CO, on October 18-21, 1987"--T.p. verso.