Thermal conductivity 24
Subtitle: thermal expansion 12 : joint conferences, October 26-29, 1997, Pittsburgh, Pennsylvania, USA
By: Peter S. Gaal, editor of proceedings ; Daniela E. Apostolescu, co-editor of proceedings ; conference host, Anter Corporation, Pittsburgh, Pennsylvania, USA.
Contributors: Gaal, Peter S.; Apostolescu, Daniela E.; International Thermal Conductivity Conference (24th : 1997 : Pittsburgh, Pa.); International Thermal Expansion Symposium (12th : 1997 : Pittsburgh, Pa.)
Publisher: Technomic Pub. Co.
Published: 1999
Place of publication: Lancaster, PA
Language: eng
Number of pages: 806
Subjects: Thermal conductivity -- Congresses.; Materials -- Thermal properties -- Congresses.; Expansion (Heat) -- Congresses.
Genres: Congresses.
Other titles: Thermal expansion 12; Thermal conductivity 24, thermal expansion 12; Thermal conductivity twenty-four; Thermal expansion twelve; Proceedings of the Twenty-fourth International Thermal Conductivity Conference; Proceedings of the Twelfth International Thermal Expansion Symposium
Notes: Includes bibliographical references and indexes.