Scanning electron microsope examination of wire bonds from high-reliability devices
By: Kathryn O. Leedy
Series: NBS technical note -- 785
Publisher: U.S. National Bureau of Standards; For sale by the Supt. of Docs., U.S. Govt. Print. Off.
Published: 1973
Place of publication: [Washington]
Language: eng
Number of pages: 28
Subjects: Metal bonding; Scanning electron microscopes
Notes: Includes bibliographical references (p. 28)