10th IEEE Workshop on Signal Propagation on Interconnects
Subtitle: May 09-12, 2006, "Dorint Sofitel Schweizerhof Berlin", Berlin, Germany : proceedings
By: co-sponsored by IEEE Components, Packaging and Manufacturing Technology Society (CPMT), Technical Committee on Electrical Design, Modeling and Simulation (TC-EMDS) [i.e. TC-EDMS], and by IEEE Computer Society, Test Technology Technical Council (TTTC).
Contributors: Components, Packaging & Manufacturing Technology Society. Technical Committee on Electrical Design, Modeling and Simulation.; IEEE Computer Society. Technical Council on Test Technology.
Publisher: IEEE
Published: 2006
Place of publication: Piscataway, N.J
Language: eng
Number of pages: 289
Subjects: Printed circuits -- Congresses; Interconnects (Integrated circuit technology) -- Congresses; Signal theory (Telecommunication) -- Congresses
Genres: Congresses.
Other titles: IEEE Workshop on Signal Propagation on Interconnects; SPI 2006 proceedings
Notes: "IEEE Cat No: 06EX1412."

Includes bibliographical references and index.