Proceeding of the sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP'04)
Subtitle: June 30-July 3, 2004, Bao Long Hotel, Shanghai, China
By: IEEE CPMT ... [et al.].
Contributors: Components, Packaging & Manufacturing Technology Society.
Publisher: IEEE
Published: 2004
Place of publication: Piscataway, N.J
Language: eng
Number of pages: 393
Subjects: Integrated circuits -- Design and construction -- Congresses.; Electronic packaging -- Congresses.; Microelectromechanical systems -- Congresses.
Genres: Congresses.
Other titles: High density microsystem design and packaging and component failure analysis; HDP '04; Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP'04), proceedings
Notes: Includes bibliographical references and author index.
"IEEE Catalog Number 04EX905 Softbound Edition ; 04EX905C CD-ROM Edition"--T.p. verso.