Force sensors for microelectronic packaging applications
By: J. Schwizer, M. Mayer, O. Brand.
Contributors: Mayer, M.; Brand, Oliver, 1964-
Series: Microtechnology and MEMS
Publisher: Springer
Published: 2005
Place of publication: Berlin; London
Language: eng
Number of pages: 178
Subjects: Microelectronic packaging.
Notes: Includes bibliographical references and index.