Multichip packaging and bare chip systems
By: Brent J. Knipfer, project analyst.
Contributors: Business Communications Co.
Series: Business opportunity report ;; GB-138R
Publisher: Business Communications Co.
Published: 1994
Place of publication: Norwalk, CT
Language: eng
Number of pages: 257
Subjects: Integrated circuits industry.; Multichip modules (Microelectronics); Microelectronic packaging.; Market surveys.
Notes: Includes bibliographical references.