Wire bonding in microelectronics
Subtitle: materials, processes, reliability, and yield
By: George G. Harmon.
Contributors: Harman, George G.
Edition: 2nd ed.
Series: Electronic packaging and interconnection series
Publisher: McGraw-Hill
Published: 1997
Place of publication: New York
Language: eng
Number of pages: 290
Subjects: Wire bonding (Electronic packaging) -- Production control.; Electronic packaging -- Reliability.; Electronic packaging -- Defects.; Semiconductors -- Failure.
Notes: Includes bibliographical references and index.
Rev. ed. of: Reliability and yield problems of wire bonding in microelectronics. 1989.