Materials and processes for wireless communications
By: edited by T. Negas, H. Ling.
Contributors: Negas, T.; Ling, Hung C.; American Ceramic Society. Electronics Division. Meeting; International Society for Hybrid Microelectronics.; Symposium on Materials and Processes for Wireless Communication (1994 : Boston, Mass.)
Series: Ceramic transactions,; v. 53
Publisher: American Ceramic Society
Published: 1995
Place of publication: Westerville, Ohio
Language: eng
Number of pages: 230
Subjects: Electronic ceramics -- Congresses.; Wireless communication systems -- Equipment and supplies -- Congresses.
Notes: Includes bibliographical references and index.
"Proceedings of the Symposium on Materials and Processes for Wireless Communication, held at the American Ceramic Society, Electronics Division Meeting with the International Society for Hybrid Microelectronics, November 15-17, 1994, in Boston, MA"--T.p. verso.