Electronic and photonic packaging, electrical systems and photonic design, and nanotechnology
Subtitle: presented at the 2003 ASME International Mechanical Engineering Congress : November 15-21, 2003, Washington, D.C.
By: sponsored by the Electronic and Photonic Packaging Division, ASME ; organized by Ricky Lee ... [et al.].
Contributors: Lee, S. W. Ricky; American Society of Mechanical Engineers. Electronic and Photonic Packaging Division.; International Mechanical Engineering Congress and Exposition (2003 : Washington, D.C.)
Series: EPP ;; vol. 3; EPP (Series) ;; v. 3.
Publisher: American Society of Mechanical Engineers
Published: 2003
Place of publication: New York, N.Y
Language: eng
Number of pages: 893
Subjects: Electronic packaging -- Congresses.; Photonics -- Congresses.; Nanotechnology -- Congresses.; Microelectronic packaging -- Congresses.; Surface mount technology -- Congresses.; Microelectromechanical systems -- Congresses.; Integrated circuits -- Wafer-scale integration -- Congresses.
Genres: Congresses.
Notes: Includes bibliographical references and index.