In the matter of certain plastic encapsulated integrated circuits
Subtitle: investigation no. 337-TA-315.
Series: USITC publication -- 2574.
Publisher: U.S. International Trade Commission
Published: 1992
Place of publication: Washington, DC
Language: eng
Format: Microform
Subjects: Integrated circuits.; Integrated circuits industry.; Molding (Chemical technology); Plastics.
Other titles: Certain plastic encapsulated integrated circuits.
Notes: Cover title.

Distributed to depository libraries in microfiche.

Shipping list no.: 94-0322-M.

"November 1992."

Includes bibliographical references.

Microfiche. [Washington, D.C.?] : Supt. of Docs., U.S. G.P.O., [1994] 4 microfiches : negative.