Electronic packaging strategies for the 80s
By: editor, William I. Srauss ; illustration editor, Helen I. Pitcher ; prepared by Integrated Circuit Engineering Corporation.
Contributors: Strauss, William I.; Integrated Circuit Engineering Corporation.
Publisher: ICE
Published: 1982
Place of publication: Scottsdale, Ariz. (15022 North 75th St., Scottsdale 85260)
Language: eng
Subjects: Microelectronic packaging.
Notes: Includes bibliographies.
Table of contents: title: v. 1. Summary for executives; title: v. 2. Application oriented considerations; title: v. 3. Design considerations; title: v. 4. Density & speed considerations; title: v. 5. Thermal considerations; title: v. 6. Quality assurance, reliability and testing; title: v. 7. Cost & cost considerations.