Thermal stress analysis of space shuttle orbiter wing skin panel and thermal protection system
By: William L. Ko and Jerald M. Jenkins.
Contributors: Jenkins, Jerald M.; Dryden Flight Research Facility.
Series: NASA technical memorandum -- 88276.
Publisher: National Aeronautics and Space Administration, Ames Researach Center, Dryden Flight Research Facility; For sale by the National Technical Information Service]
Published: 1987
Place of publication: Edwards, Calif; [Springfield, Va
Language: eng
Format: Microform
Subjects: Space shuttles.; Thermal stresses.
Notes: Distributed to depository libraries in microfiche.

Microfiche. [Washington, D.C.? : National Aeronautics and Space Administration], 1987. 1 microfiche.