Advances in electronic packaging, 1995
Subtitle: proceedings of the International Intersociety Electronic Packaging Conference--INTERpack '95 : presented at the International Intersociety Electronic Packaging Conference, March 26-30, 1995, Lahaina, Maui, Hawaii
By: sponsored by the Electrical and Electronic Packaging Division, ASME ; the Japan Society of Mechanical Engineers ; edited by Tai Ran Hsu, Avram Bar-Cohen, Wataru Nakayama.
Contributors: Hsu, Tai-Ran.; Bar-Cohen, Avram, 1946-; Nakayama, Wataru.; American Society of Mechanical Engineers.; Nihon Kikai Gakkai.; International Intersociety Electronic Packaging Conference--INTERpack (1995 : Lahaina, Maui, Hawaii)
Series: EEP -- vol. 10.; EEP (Series) -- vol. 10.
Publisher: American Society of Mechanical Engineers
Published: 1995
Place of publication: New York
Language: eng
Subjects: Electronic packaging -- Congresses.
Notes: Includes bibliographical references and indexes.