9th International Symposium on Advanced Packaging Materials
Subtitle: processes, properties and interfaces : 2004 proceedings, March 24-26, 2004, Atlanta, GA, USA
By: sponsors, IEEE Components, Packaging, and Manufacturing Technology (CPMT) Society, Packaging Research Center at Georgia Tech (GT-RRC) ; technical sponsor, Fraunhofer IZM, Germany ; general chair Petri Savolainen.
Contributors: Savolainen, Petri.; Components, Packaging & Manufacturing Technology Society.; Georgia Institute of Technology. Packaging Research Center.; Fraunhofer IZM.
Publisher: IEEE
Published: 2004
Place of publication: Piscataway, N.J
Language: eng
Number of pages: 281
Subjects: Electronic packaging -- Materials -- Congresses
Genres: Congresses.
Other titles: 2004 9th International Advanced Packaging Materials Symposium; Advanced Packaging Materials, rocesses, properties, interfaces; Processes, properties and interfaces
Notes: Also available via the World Wide Web.
Includes bibliographical references.