Cae - CAD Application to Electronic Packaging
Subtitle: 1994 International Mechanical Engineering Congress & Exposition, Chicago, Illinois - November 6-11, 199 (Eep -)
Publisher: American Society of Mechanical Engineers
Published: December 1994
Language: eng
Format: Hardcover
Number of pages: 96
ISBN-13: 9780791814604
Subjects: Electronics engineering; CAD-CAM - General; Computers - General Information