Medical device materials III
Subtitle: proceedings from the Materials & Processes for Medical Devices Conference 2005, November 14-16, 2005, Boston, Massachusetts, USA
By: edited by Ramakrishna Venugopalan, Ming Wu.
Publisher: ASM International
Published: 2007
Place of publication: Materials Park, OH
Language: eng
Number of pages: 250
ISBN-13: 9780871708458