4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing ; proceedings
Subtitle: presented at Adhesives in Electronics 2000, Espoo, Finland, June 18-21, 2000
By: conference chair Jorma Kivilahti ; proceedings editor, Marika Hyytiäien ; sponsored by NOKIA ... [et al.].
Contributors: Kivilahti, Jorma.; Hyytiäinen, Marika.; Nokia (Firm); Adhesives 2000 (2000 : Espoo, Finland)
Publisher: IEEE
Published: 2000
Place of publication: Piscataway, New Jersey
Language: eng
Number of pages: 319
Subjects: Electronic packaging -- Congresses.; Electronic packaging -- Materials -- Congresses.; Adhesive joints -- Congresses.; Coating processes -- Congresses.; Multichip modules (Microelectronics) -- Design and construction -- Congresses.
Genres: Congresses.
Other titles: Adhesive Joining and Coating Technology in Electronics Manufacturing 2000; Fourth International Conference on Adhesive Joining & Coating Technology in Electronics Manufacturing; Adhesives in Electronics 2000
Notes: Includes bibliographical references.

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