Proceedings of the Symposium on Packaging of Electronic Devices
By: edited by P. Bindra, R.A. Susko ; [sponsored by] Dielectrics and Insulation, Electrodeposition, and Electronics Divisions.
Contributors: Bindra, P.; Susko, R. A.; Electrochemical Society. Dielectrics and Insulation Division.; Electrochemical Society. Electrodeposition Division.; Electrochemical Society. Electronics Division.
Series: Proceedings / the Electrochemical Society, Inc. ;; v. 89-3; Proceedings (Electrochemical Society) ;; v. 89-3.
Publisher: Electrochemical Society
Published: 1989
Place of publication: Pennington, NJ (10 S. Main St., Pennington, 08534-2896)
Language: eng
Number of pages: 249
Subjects: Electronic packaging -- Congresses.
Other titles: Packaging of electronic devices.
Notes: Includes bibliographical references.
Spine title: Packaging of electronic devices.
Symposium held May 17-18, 1988, in Atlanta, Ga.