Chemical mechanical planarization V
Subtitle: proceedings of the International Symposium
By: editors, S. Seal ... [et al.]
Contributors: Seal, Sudipta.; Electrochemical Society. Dielectric Science and Technology Division.; Electrochemical Society. Electronics Division.; Electrochemical Society. Meeting
Series: Proceedings ;; v. 2002-1.; Proceedings (Electrochemical Society) ;; v. 2002-1.
Publisher: Electrochemical Society, Inc.
Published: 2002
Place of publication: Pennington, NJ
Language: eng
Number of pages: 274
Subjects: Microelectronics -- Materials -- Congresses.; Grinding and polishing -- Congresses.; Metals -- Pickling -- Congresses.; Integrated circuits -- Materials -- Congresses.
Genres: Congresses.
Notes: Includes bibliographical references and indexes.
"Proceedings of the Fifth International Symposium on Chemical Mechanical Planarization (CMP) in Integrated Circuit Device Manufacturing held at the 201st Meeting of the Electrochemical Society in Philadelphia, Pennsylvania from May 12th to 17th, 2002"--Pref.
"Sponsoring Divisions, Dielectric Science and Technology and Electronics."