1996 International Conference on Simulation of Semiconductor Processes and Devices
Subtitle: SISPAD '96, September 2-4, 1996, Toyo University, Hakusan Campus, Tokyo, Japan
Publisher: Copies available at IEEE Service Center
Published: 1996
Language: eng
Format: Unknown Binding
Number of pages: 184
ISBN-13: 9780780327467
Subjects: Congresses; Mathematical models; Semiconductors