The future envelope 2
Subtitle: architecture, climate, skin
By: edited by Ulrich Knaack & Tillmann Klein
Series: Research in architectural engineering series -- v. 9; Research in architectural engineering series -- v. 9.
Publisher: IOS Press
Published: 2009
Place of publication: Amsterdam
Language: eng
Number of pages: 142
ISBN-13: 9781607500261
Other titles: Future envelope two
Notes: Based on the contributions to The Future Envelope symposium held June 5, 2008 in Delft.

Includes bibliographical references.