11th International Congress Molded Interconnect Devices - Scientific Proceedings
Subtitle: Selected, Peer Reviewed Papers from the 11th International Congress ... Fuerth, Germany
Publisher: Trans Tech Pubn
Published: Nov 30, 2014
Format: paperback
Number of pages: 124
ISBN-13: 9783038352525
Notes: Source title: 11th International Congress Molded Interconnect Devices - Scientific Proceedings: Selected, Peer Reviewed Papers from the 11th International Congress ... Fuerth, Germany (Advanced Materials Research)