Proceedings of the Fourth International Symposium on Semiconductor Wafer Bonding
Subtitle: science, technology, and applications
By: editors, Ulrich Gösele ... [et al.] ; Electronics Division [of the Electrochemical Society].
Contributors: Gösele, U.; Electrochemical Society. Electronics Division.
Series: Proceedings / Electrochemical Society ;; v. 97-36; Proceedings (Electrochemical Society) ;; v. 97-36.
Publisher: Electrochemical Society
Published: 1998
Place of publication: Pennington, NJ
Language: eng
Number of pages: 618
Subjects: Semiconductors -- Bonding -- Congresses.; Semiconductor wafers -- Congresses.; Microelectromechanical systems -- Design and construction -- Congresses.
Other titles: Semiconductor wafer bonding : science, technology, and applications
Notes: Includes bibliographical references and indexes.
"The Fourth International Symposium on Wafer Bonding [was] held at Paris [France] in summer 1997 ... "--Preface.