Worldwide developments in MCP integration
Subtitle: markets & trends
By: [authors, E. Jan Vardaman, Frank Bachner, and Phil Spletter ; graphics and production, Charles Kroger ; contributor, Roger Perales]
Contributors: Bachner, Frank; Spletter, Phil; TechSearch International
Publisher: TechSearch International
Published: 1998
Place of publication: Austin, Tex
Language: eng
Number of pages: 122
Subjects: Multichip modules (Microelectronics); Integrated circuits industry; Market surveys; Microelectronic packaging