International Symposium on Electronic Materials and Packaging (EMAP2000)
Subtitle: November 30-December 2, 2000, Hong Kong
By: organized by Hong Kong University of Science and Technology, Department of Mechanical Engineering & EPACK LAB ; in collaboration with Institute of Electrical and Electronics Engineres, IEEE Component, Packaging & Manufacturing Technology, Hong Kong Chapter.
Contributors: Hong Kong University of Science and Technology. Dept. of Mechanical Engineering.; EPACK LAB.; Institute of Electrical and Electronics Engineers.; Components, Packaging & Manufacturing Technology Society. Hong Kong Chapter.
Publisher: IEEE
Published: 2000
Place of publication: Piscataway, New Jersey
Language: eng
Number of pages: 478
Subjects: Electronic packaging -- Congresses.
Genres: Congresses.
Other titles: EMAP2000; Electronic materials and packaging
Notes: Includes bibliographic references.