Electronics packaging forum
By: edited by James E. Morris.
Contributors: Morris, James E., 1944-; State University of New York at Binghamton. T.J. Watson School of Engineering, Applied Science, and Technology. Continuing Education Division.
Publisher: Van Nostrand Reinhold
Published: 1990
Place of publication: New York, N.Y
Language: eng
Subjects: Electronic packaging -- Congresses.
Notes: Based on the annual Electronics Packaging Symposium, which is run at the State University of New York at Binghamton by the Continuing Education Division of the T.J. Watson School of Engineering, Applied Science, and Technology.