Force sensors for microelectronic packaging applications
By: J. Schwizer, M. Mayer, O. Brand.
Contributors: Mayer, M. 1971-; Brand, Oliver, 1964-
Series: Microtechnology and MEMS
Publisher: Springer
Published: 2004
Place of publication: Berlin; New York
Language: eng
Number of pages: 178
Subjects: Microelectronic packaging; Wire bonding (Electronic packaging)
Notes: Includes bibliographical references (p. [165]-174) and index.