Proceedings of the 3rd International Conference on Properties and Applications of Dielectric Materials
Subtitle: Tokyo, Japan, July 8-12, 1991
By: sponsored by IEEE Dielectrics and Electrical Insulation Society, Institute of Electrical Engineers of Japan, Waseda University.
Contributors: IEEE Dielectrics and Electrical Insulation Society.; Denki Gakkai (1888); Waseda Daigaku.
Publisher: IEEE
Published: 1991
Place of publication: New York
Language: eng
Number of pages: 1276
Subjects: Dielectrics -- Congresses.; Electric insulators and insulation -- Congresses.
Other titles: Proceedings of the Third International Conference on Properties and Applications of Dielectric Materials.
Notes: Includes bibliographical references and indexes.
"91CH2937-1."