JTEC panel report on electronic manufacturing and packaging in Japan
By: Michael J. Kelly ... [et al.].
Contributors: Kelly, Michael J.; United States. National Aeronautics and Space Administration.
Series: NASA contractor report -- NASA CR-197830.
Publisher: International Technology Research Institute, Loyola College in Maryland; National Aeronautics and Space Administration; National Technical Information Service, distributor
Published: 1995
Place of publication: Baltimore, Md; [Washington, DC; Springfield, Va
Language: eng
Format: Microform
Subjects: Assembly.; Automation.; Ceramics.; Consistency.; Consumers.; Cost effectiveness.; Design analysis.; Electronic equipment.; Electronic packaging.; Industrial plants.; Industries.; Japan.; Low cost.; Manufacturing.; Market research.; Microelectronics.; Miniaturization.; Molding materials.; Plastics.; Product development.; Quality control.; Reliability.; Research and development.; Technology utilization.
Other titles: Electronic manufacturing and packaging in Japan.
Notes: Distributed to depository libraries in microfiche.

Shipping list no.: 95-0749-M.

Microfiche. [Washington, D.C. : National Aeronautics and Space Administration, 1995] 3 microfiches.