Computerized thermophysical property packages
Subtitle: presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, Anaheim, California, November 8-13, 1992
By: sponsored by the Heat Transfer Division, ASME ; edited by S.G. Penoncello.
Contributors: Penoncello, S. G.; American Society of Mechanical Engineers. Heat Transfer Division.
Series: HTD ;; vol. 225; HTD (Series) ;; v. 225.
Publisher: American Society of Mechanical Engineers
Published: 1992
Place of publication: New York, N.Y
Language: eng
Number of pages: 35
Subjects: Heat-transfer media -- Thermal properties -- Computer programs -- Congresses.
Notes: Includes bibliographical references.