Proceedings 1999 International Symposium on Microelectronics
Subtitle: October 26-28, 1999, Chicago Hilton & Towers, Chicago, Illinois
By: sponsored by IMAPS--International Microelectronics and Packaging Society ; [Dick Gehman, IMAPS 1999 symposium technical chair].
Contributors: Gehman, Dick.; International Microelectronics and Packaging Society.; Society of Photo-optical Instrumentation Engineers.
Series: SPIE -- v. 3906.; Proceedings of SPIE--the International Society for Optical Engineering -- v. 3906.
Publisher: IMAPS; Published in cooperation with SPIE--the International Society for Optical Engineering
Published: 1999
Place of publication: Reston, Va., U.S.A; [Bellingham, Wash.]
Language: eng
Number of pages: 806
ISBN-13: 9780930815585
Subjects: Multichip modules (Microelectronics) -- Congresses; Thick films -- Congresses; Electronic ceramics -- Congresses; Electronic packaging -- Congresses
Genres: Congresses.
Other titles: 1999 International Symposium on Microelectronics.; International Symposium on Microelectronics.; Microelectronics.
Notes: Includes bibliographical references and index.