Multichip modules
By: edited by Ernest S. Kuh.
Contributors: Kuh, Ernest S.
Publisher: World Scientific; World Scientific Publishing Company
Published: 1992
Place of publication: Singapore; River Edge, NJ
Language: eng
Number of pages: 353
Subjects: Multichip modules (Microelectronics); Microelectronic packaging.; Electronic circuits -- Design and construction.
Notes: Includes bibliographical references.