Thermal Stresses 2005
Subtitle: proceedings of the Sixth International Congress on Thermal Stresses, 26-29 May 2005, Vienna, Austria
By: editors, Franz Ziegler, Rudolf Heuer,  and Christoph Adam..
Series: Schriftenreihe der Technischen Universität Wien
Publisher: Technische Universität
Published: 2005
Place of publication: Vienna
Language: ger
Number of pages: 802
Subjects: Thermal stresses; Congresses; Materials; Thermal properties
Notes: Includes bibliographical references and index.