Microelectronic interconnection bonding with ribbon wire
By: H.K. Kessler and A.H. Sher
Contributors: Sher, A. H; United States. Advanced Research Projects Agency
Series: NBS technical note -- 767
Publisher: U.S. National Bureau of Standards; For sale by the Supt. of Docs., U.S. Govt. Print. Off.
Published: 1973
Place of publication: Washington
Language: eng
Number of pages: 24
Subjects: Miniature electronic equipment -- Welding; Ultrasonic welding
Notes: Supported by the Advanced Research Projects Agency of the Dept. of Defense under ARPA order 1889

Includes bibliographical references (p. 23-24)