Copper interconnect technology
By: Christoph Steinbruchel and Barry L. Chin.
Contributors: Chin, Barry.
Series: Tutorial texts in optical engineering -- v. TT 46
Publisher: SPIE Press
Published: 2001
Place of publication: Bellingham, Wash
Language: eng
Number of pages: 122
Subjects: Electronic packaging; Semiconductors -- Junctions; Microelectronic packaging; Copper
Description: viii, 122 p. : 26 cm
Notes: Includes bibliographical references (p. 103-117) and index.