Tin and solder plating in the semiconductor industry
Subtitle: a technical guide
By: A.C. Tan.
Edition: 1st ed.
Publisher: Chapman & Hall
Published: 1993
Place of publication: London; New York
Language: eng
Number of pages: 326
Subjects: Semiconductors -- Design and construction.; Electroplating.; Lead-tin alloys.; Tin.
Notes: Includes bibliographical references and index.