Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys®
By: by Erdogan Madenci, Ibrahim Guven, Bahattin Kilic
Contributors: Guven, Ibrahim; Kilic, Bahattin
Series: The Springer International Series in Engineering and Computer Science -- 719; International series in engineering and computer science -- 719.
Publisher: Springer US
Published: 2003
Place of publication: Boston, MA
Language: eng
Format: [electronic resource] /
Number of pages: 185
ISBN-13: 9781461349891; 9781461502555
Subjects: Computer engineering; Optical materials; Engineering; Machinery
Description: Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS® describes the method in great detail starting from the theoretical basis. The reader is supplied with an add-on software package to ANSYS® that is designed for solder joint fatigue reliability analysis of electronic packages. Specific steps of the analysis method are discussed through examples without leaving any room for confusion. The add-on package along with the examples make it possible for an engineer with a working knowledge of ANSYS® to perform solder joint reliability analysis. Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS® allows the engineers to conduct fatigue reliability analysis of solder joints in electronic packages.
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