New Technology in Electronic Packaging
Subtitle: Proceedings of Asm International's 3rd Electronic Materials and Processing Congress San Francisco, Californi
Contributors: M.D. Nagarkar (Editor)
Publisher: Asm Intl
Published: December 1990
Language: eng
Format: Hardcover
Number of pages: 380
ISBN-13: 9780871703965
Subjects: Science/Mathematics; Congresses; Circuits & components; Microelectronics; Corrosion; Electronic Circuits; Electronic packaging; Microelectronic packaging