Photoelastic and experimental analog procedures
By: by W. T. Moody and H. B. Phillips.
Contributors: Phillips, H. Boyd, joint author.
Series: United States. Bureau of Reclamation. Engineering; monograph no. 23
Publisher: Technical Information Branch, Denver Federal Center
Published: 1955
Place of publication: Denver
Language: eng
Number of pages: 100
Subjects: Strains and stresses.; Photoelasticity.; Structural frames -- Models.
Notes: Bibliography: p. 98-100.