Future trends in wafer scale integration
By: Richard O. Carlson and C.A. Neugebauer.
Contributors: Neugebauer, C. A.
Publisher: Institute of Electrical and Electronics Engineers
Place of publication: New York
Language: eng
Number of pages: 12
Other titles: Proceedings of the IEEE.
Notes: Photocopy of an article in Proceedings of the IEEE, vol. 74, no. 12, Dec. 1986, pp. 1741-1752.