Micro- and opto-electronic materials and structures
Subtitle: physics, mechanics, design, reliability, packaging
By: edited by E. Suhir, Y.C. Lee, C.P. Wong.
Contributors: Suhir, Ephraim.; Lee, Y. C.; Wong, C. P., 1947-
Publisher: Springer
Published: 2007
Place of publication: New York
Language: eng
ISBN-13: 9780387279749
Subjects: Microelectronics; Optoelectronics
Table of contents: title: v.1. Materials physics/Materials mechanics; title: v.2. Physical design/Reliability and packaging.