Advanced adhesives in electronics
Subtitle: materials, properties and applications
By: edited by M.O. Alam and C. Bailey
Series: Woodhead Publishing in materials
Publisher: Woodhead
Published: 2011
Place of publication: Sawston
Language: eng
Number of pages: 280
ISBN-13: 9781845695767
Subjects: Semiconductors; Materials; Congresses; Integrated circuits; Electronic packaging