Flip chip markets and infrastructure developments
By: [authors, E. Jan Vardaman ... [et al.]]
Contributors: TechSearch International
Publisher: TechSearch International
Published: 2001
Place of publication: Austin, Tex
Language: eng
Number of pages: 207
Subjects: Electronic industries; Technological innovations; Electronic packaging; Flip chip technology
Notes: Cover title.

"May, 2001."

Includes bibliographical references (p. 205-207).