I-THERM V
Subtitle: May 29-June 1, 1996, Buena Vista Palace Hotel, Orlando, FL, U.S.A.
By: co-sponsored by ... the K-16 Committee on Heat Transfer in Electronic Equipment, Heat Transfer Division, American Society of Mechanical Engineers (ASME) ... [et al.].
Contributors: American Society of Mechanical Engineers. K-16 Committee on Heat Transfer in Electronic Equipment.
Publisher: Institute of Electrical and Electronics Engineers; IEEE Service Center [distributor]
Published: 1996
Place of publication: [New York]; Piscataway, NJ
Language: eng
Number of pages: 407
Subjects: Electronic apparatus and appliances -- Thermal properties -- Congresses.; Heat sinks (Electronics) -- Congresses.; Ball grid array technology -- Congresses.
Other titles: I-THERM 5.; I-THERM five.; 1996 Intersociety Conference on Thermal Phenomena in Electronic Systems.; 1996 proceedings 5th Intersociety Conference on Thermal Phenomena in Electronic Systems.
Notes: "This symposium is a trans-disciplinary forum for exploring the progress made in understanding, analyzing, and modeling thermal transport processes and thermally-induced failures in the fabrication, assembly, and use of semiconductors, data-storage devices, and electronic systems."

"IEEE catalog number: 96CH35940" -- T.p. verso.

Includes bibliographical references.