Designing TSVs for 3D Integrated Circuits
By: by Nauman Khan, Soha Hassoun
Contributors: Hassoun, Soha; SpringerLink (Online service)
Series: SpringerBriefs in Electrical and Computer Engineering
Publisher: Springer New York; Imprint: Springer
Published: 2013
Place of publication: New York, NY
Language: eng
Format: [electronic resource] /
ISBN-13: 9781461455080
Subjects: Systems engineering; Engineering; Processor Architectures; Circuits and Systems; Electronics; Instrumentation Electronics and Microelectronics; Computer science