Adhesives technology for electronic applications
Subtitle: materials, processing, reliability
By: James J. Licari and Dale W. Swanson
Contributors: Swanson, Dale W.
Edition: 2nd ed.
Series: Materials and processes for electronic applications series
Publisher: William Andrew Pub.
Published: 2011
Place of publication: Amsterdam; Boston
Language: eng
Number of pages: 403
ISBN-13: 9781437778892
Subjects: Adhesives; Electronics; Materials; Electronic packaging
Notes: Includes bibliographical references and index.