Advances in electronic packaging, 2003
Subtitle: presented at 2003 International Electronic Packaging Technical Conference and Exhibition : July 6-11, 2003, Maui, Hawaii
By: sponsored by the Electronic and Photonic Packaging Division, ASME.
Contributors: American Society of Mechanical Engineers. Electronic and Photonic Packaging Division.; International Electronic Packaging Technical Conference and Exhibition (2003 : Maui, Hawaii)
Publisher: American Society of Mechanical Engineers
Published: 2003
Place of publication: New York, N.Y
Language: eng
Subjects: Electronic packaging -- Congresses.
Genres: Congresses.
Notes: Includes bibliographical references and author indexes.