Temperature distribution and thermally induced stresses in electronic packages
By: by Andrei Sapsai, Jr
Contributors: Salinas, David
Publisher: Naval Postgraduate School; Available from the National Technical Information Service
Published: 1992
Place of publication: Monterey, Calif; Springfield, Va
Language: eng
Number of pages: 97
Notes: Thesis advisor, David Salinas.

Thesis (M.S. in Mechanical Engineering) Naval Postgraduate School, Sept. 1992.

Includes bibliographical references.