Multilayer ceramic substrate-technology for VLSI package/multichip module
By: K. Otsuka.
Edition: English language ed.
Series: Ceramic research and development in Japan
Publisher: Elsevier Applied Science
Published: 1993
Place of publication: London; New York
Language: eng
Number of pages: 242
Subjects: Electronic ceramics; Electronic packaging -- Materials; Integrated circuits -- Very large scale integration -- Design and construction; Aluminum oxide
Notes: Includes bibliographical references (p. 223-231) and index.
Translation of: Seramikku tasō haisen kiban.