Proceedings
By: 1998 International Conference on Multichip Modules and High Density Packaging, April 15-17, 1998, The Adam's Mark Hotel, Denver, Colorado ; sponsored by IMAPS ... [et al.].
Contributors: International Microelectronics and Packaging Society.
Publisher: Institute of Electrical and Electronics Engineers
Published: 1998
Place of publication: [New York]
Language: eng
Number of pages: 547
Subjects: Multichip modules (Microelectronics) -- Congresses.; Microelectronic packaging -- Congresses.
Other titles: Multichip modules and high density packaging
Notes: Includes bibliographical references and index.
"IEEE catalog number: 98EX154"--T.p. verso.