Proceeding of the Sixth IEEE Cpmt Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (Hdp '04)
Subtitle: June 30-July 3
Publisher: Institute of Electrical & Electronics Enginee
Published: January 2004
Language: eng
Format: Audio CD
ISBN-13: 9780780386211
Subjects: Electronics - Circuits - General; Unabridged Audio - Misc.Nonfiction