Reflow soldering processes and troubleshooting
Subtitle: SMT, BGA, CSP and flip chip technologies
By: Ning-Cheng Lee.
Publisher: Newnes
Published: 2002
Place of publication: Boston
Language: eng
Number of pages: 270
Subjects: Electronic apparatus and appliances -- Design and construction; Solder and soldering; Electronic packaging; Electric connectors
Notes: Includes bibliographical references and index.