A numerical study of the thermal performance for surface mounted and through-hole mounted integrated circuits
By: by Jyi-Ren Wang.
Published: 1994
Language: eng
Number of pages: 81
Subjects: Integrated circuits -- Evaluation.; Semiconductors -- Thermal properties.; Integrated circuits -- Design and construction.
Notes: Typescript (photocopy)

Thesis (M.S.)--Oregon State University, 1995.

Includes bibliographical references (leaves 75-76).

BNA Gap Tape Re-edit 9/98.