Heat transfer in electronic systems, 1994
Subtitle: presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6-11, 1994
By: sponsored by the Heat Transfer Division, ASME ; edited by R.A. Wirtz.
Contributors: Wirtz, R. A.; American Society of Mechanical Engineers. Heat Transfer Division.; International Mechanical Engineering Congress and Exposition (1994 : Chicago, Ill.)
Series: HTD (Series) ;; v. 292.
Publisher: American Society of Mechanical Engineers
Published: 1994
Place of publication: New York
Language: eng
Number of pages: 153
Subjects: Electronic packaging -- Congresses.; Heat -- Transmission -- Congresses.; Electronic apparatus and appliances -- Cooling -- Congresses.
Notes: Includes bibliographical references and index.