Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies
Edition: 1 edition
Publisher: McGraw-Hill Professional
Published: February 8, 2000
Language: eng
Format: Hardcover
Number of pages: 585
ISBN-13: 9780071351416
Subjects: Electronics engineering; Printing, packaging & reprographic industry; Technology & Industrial Arts; Microelectronics; Very-Large-Scale Integration (Vlsi); Technology; Reference; Multichip modules (Microelectr; Electronics - Circuits - Integrated; Electronics - Microelectronics; Engineering - Electrical & Electronic; Technology / Engineering / Electrical; Electronics - General; Design and construction; Flip chip technology; Multichip modules (Microelectronics)
First sentence: The electronics industry is one of the most dynamic, fascinating, and important areas of manufacturing.