Electronic packaging materials science III
Subtitle: symposium held November30-December 4, 1987, Boston, Massachusetts, U.S.A.
By: editors, Ralph Jaccodine, Kenneth A. Jackson, Robert C. Sundahl.
Contributors: Jaccodine, Ralph.; Jackson, Kenneth A.; Sundahl, Robert C.
Series: Materials Research Society symposium proceedings -- v.108
Publisher: Materials Research Society
Published: 1988
Place of publication: Pittsburgh, Pa
Language: eng
Number of pages: 479
Subjects: Electronic packaging -- Congresses.; Electronic packaging -- Materials -- Congresses.
Notes: Includes bibliographies and indexes.