Microelectronic system interconnections
Subtitle: performance and modeling
By: edited by Stuart K. Tewksbury.
Contributors: Tewksbury, Stuart K.
Publisher: IEEE Press
Published: 1994
Place of publication: New York
Language: eng
Number of pages: 513
Subjects: Microelectronic packaging -- Mathematical models.; Optical fibers -- Joints -- Mathematical models.; Multichip modules (Microelectronics) -- Mathematical models.; Integrated circuits -- Very large scale integration -- Mathematical models.; Semiconductors -- Junctions -- Computer simulation.
Notes: Includes bibliographical references and indexes.
"A Selected reprint volume."
"IEEE Solid-State Circuits Council, sponsor."