Proceedings
Subtitle: 1999 International Conference on High Density Packaging and MCMs, April 6-9, 1999, the Adam's Mark Hotel, Denver, Colorado
By: sponsored by IMAPS ; [assembled and edited by the Technical Program Committee and the IMAPS staff].
Contributors: International Microelectronics and Packaging Society.; Society of Photo-optical Instrumentation Engineers.
Series: SPIE proceedings series -- v. 3830; Proceedings of SPIE--the International Society for Optical Engineering -- v. 3830.
Publisher: IMAPS; Published in cooperation with SPIE]
Published: 1999
Place of publication: Reston, VA; [Bellingham, Wash
Language: eng
Number of pages: 456
Subjects: Microelectronic packaging -- Congresses
Genres: Congresses.
Other titles: Proceedings, 1999 International Conference on High Density Packaging and MCMs; 1999 International Conference on High Density Packaging and MCMs; High density packaging and MCMs
Notes: Includes bibliographical references and author index.