Advances in electronic packaging, 1993
Subtitle: proceedings of the 1993 ASME International Electronics Packaging Conference : presented at the ASME International Electronics Packaging Conference, Binghamton, New York, September 29-October 2, 1993
By: sponsored by the American Society of Mechanical Engineers ; edited by Peter A. Engel, William T. Chen.
Contributors: Engel, Peter A.; Chen, William T.; American Society of Mechanical Engineers.
Series: EEP ;; vol. 4; EEP (Series) ;; vol. 4.
Publisher: American Society of Mechanical Engineers
Published: 1993
Place of publication: New York
Language: eng
Number of pages: 1200
Subjects: Electronic packaging -- Congresses.
Notes: Includes bibliographical references and indexes.
Table of contents: title: v. 1. Structural analysis, materials and processes, design, reliability; title: v. 2. Thermal management, solder technology, optoelectronics packaging.