Thermal conductivity 25
Subtitle: thermal expansion 13 : joint conferences, June 13-16, 1999, Ann Arbor, Michigan, USA
By: Ctirad Uher, editor of proceedings ; Donald Morelli, co-editor of proceedings ; conference host, University of Michigan, Ann Arbor, Michigan, USA.
Contributors: Uher, Ctirad.; Morelli, Donald; International Thermal Conductivity Conference (25th : 1999 : Ann Arbor, Mich.); International Thermal Expansion Symposium (13th : 1999 : Ann Arbor, Mich.)
Publisher: Technomic Pub. Co.
Published: 2000
Place of publication: Lancaster, Pa
Language: eng
Number of pages: 391
Subjects: Thermal conductivity -- Congresses.; Materials -- Thermal properties -- Congresses.; Expansion (Heat) -- Congresses.
Genres: Congresses.
Other titles: Thermal expansion 13; Thermal conductivity 25, thermal expansion 13; Thermal conductivity twenty-five; Thermal expansion thirteen; Proceedings of the Twenty-fifth International Thermal Conductivity Conference; Proceedings of the Thirteenth International Thermal Expansion Symposium
Notes: Includes bibliographical references and indexes.