Flip chip technologies
By: John H. Lau, editor.
Contributors: Lau, John H.
Series: Electronic packaging and interconnection series
Publisher: McGraw-Hill
Published: 1996
Place of publication: Boston, Mass
Language: eng
Number of pages: 565
Subjects: Integrated circuits -- Very large scale integration -- Design and construction.; Flip chip technology.; Multichip modules (Microelectronics) -- Design and construction.
Notes: Includes bibliographical references and index.