Reliability, packaging, testing, and characterization of MEMS/MOEMS VII
Subtitle: 21-22 January 2008, San Jose, California, USA
By: Allyson L. Hartzell, Rajeshuni Ramesham, editors ; sponsored by SPIE ; cosponsored by the Photonics Center at Boston University (USA)
Contributors: Society of Photo-optical Instrumentation Engineers; Boston University. Photonics Center
Series: Proceedings of SPIE -- v. 6884; Proceedings of SPIE--the International Society for Optical Engineering -- v. 6884.
Publisher: SPIE
Published: 2008
Place of publication: Bellingham, Wash
Language: eng
ISBN-13: 9780819470591
Subjects: Reliability; Microelectromechanical systems; Testing; Congresses; Microelectronic packaging
Other titles: Reliability, testing and characterization of MEMS/MOEMS VI.
Notes: Some previous conferences entitled: Reliability, testing, and characterization of MEMS/MOEMS

Includes bibliographical references and author index.