Proceedings of the 4th International Symposium on Electronic Materials and Packaging
Subtitle: December 4-6, 2002, Kaohsiung, Taiwan
By: organized by I-Shou University ; in collaboration with IEEE Component, Packaging & Manufacturing Technology, Taipei Chapter.
Contributors: I-Shou University (Taiwan); IEEE Reliability/CPMT/ED Taipei Chapter.
Publisher: IEEE
Published: 2002
Place of publication: Piscataway, N.J
Language: eng
Number of pages: 498
Subjects: Electronic packaging -- Congresses.
Genres: Congresses.
Other titles: EMAP 2002; Electronic materials and packaging
Notes: "IEEE Catalog Number 02EX634"--verso of T.p.

Includes bibliographical references.

Also available via the World Wide Web.