MEMS packaging
By: edited by Tai-Ran Hsu.
Contributors: Hsu, Tai-Ran.; INSPEC.
Series: EMIS processing series -- no. 3.
Publisher: INSPEC
Published: 2004
Place of publication: London
Language: eng
Number of pages: 275
Subjects: Microelectromechanical systems; Microelectronic packaging
Notes: Includes bibliographical references and index.