Failure Modes and Mechanisms in Electronic Packages
By: by Puligandla Viswanadham, Pratap Singh
Contributors: Singh, Pratap
Publisher: Springer US
Published: 1998
Place of publication: Boston, MA
Language: eng
Format: [electronic resource] /
Number of pages: 370
ISBN-13: 9781461377634; 9781461560296
Subjects: Systems engineering; Computer engineering; Microprogramming; Engineering; Machinery
Description: With the proliferation of packaging technology, failure and reliability have become serious concerns. This invaluable reference details processes that enable detection, analysis and the prevention of failures. It provides a comprehensive account of the failures of device packages, discrete component connectors, PCB carriers, and PCB assemblies.
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