Mechanics and materials for electronic packaging
Subtitle: presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6-11, 1994
By: co-sponsored by the Applied Mechanics ... [et al.] Divisions, ASME, Materials and Mechanics, and Computational Mechanics Divisions, JSME.
Contributors: American Society of Mechanical Engineers. Applied Mechanics Division.; International Mechanical Engineering Congress and Exposition (1994 : Chicago, Ill.)
Series: AMD ;; vol. 187, 193, 195 (v. 1); AMD (Series) ;; v. 187, etc.
Publisher: American Society of Mechanical Engineers
Published: 1994
Place of publication: New York
Language: eng
Subjects: Electronic packaging -- Congresses.; Electronic packaging -- Materials -- Congresses.
Notes: Includes bibliographical references and indexes.
Table of contents: title: v. 1. Design and process issues in electronic packaging / edited by William T. Shen, Luu T. Nguyen, Walter L. Winterbottom; title: v. 2. Thermal and mechanical behavior and modeling / edited by Michael A. Schen, H. Abe, Ephraim Suhir; title: v. 3. Coupled field behavior in materials / edited by M.L. Dunn, M. Taya, M. Saka.