Components, packaging and manufacturing technology
Subtitle: selected, peer reviewed paper from 2010 International Conference on Components, Packaging and Manufacturing Technology (ICCPMT 2010), Sanya, China, December 9-10, 2010
By: edited by Yanwen Wu
Contributors: Wu, Yanwen
Series: Key engineering materials -- v. 460-461; Key engineering materials -- v. 460/461.
Publisher: Trans Tech Publications
Published: 2011
Place of publication: Stafa-Zurich, Switzerland; Enfield, NH
Language: eng
Number of pages: 852
ISBN-13: 9780878492138
Subjects: Microelectronic packaging; Congresses; Electronic apparatus and appliances; Manufacturing processes; Electronic packaging
Other titles: Components, Packaging and Manufacturing Technology; ICCPMT 2010
Notes: Includes bibliographical references and index.