Manufacturing aspects in electronic packaging 1993
Subtitle: presented at the 1993 ASME Winter Annual Meeting, New Orleans, Louisiana, November 28-December 3, 1993
By: sponsored by the Production Engineering Division and the Electrical and Electronic Packaging Division, ASME ; edited by Y.C. Lee, W.T. Chen, Y. Yih.
Contributors: Lee, Yung-Cheng.; Chen, William T.; Yih, Y.; American Society of Mechanical Engineers. Winter Meeting; American Society of Mechanical Engineers. Production Engineering Division.; American Society of Mechanical Engineers. Electrical and Electronic Packaging Division.
Series: PED ;; vol. 65; EEP ;; vol. 5; PED (Series) ;; vol. 65.; EEP (Series) ;; vol. 5.
Publisher: American Society of Mechanical Engineers
Published: 1993
Place of publication: New York
Language: eng
Number of pages: 125
Subjects: Electronic packaging -- Congresses.; Manufacturing processes -- Congresses.; Production management -- Congresses.
Notes: Includes bibliographical references and index.