Stress-induced phenomena in metallization
Subtitle: Ninth International Workshop on Stress-Induced Phenomena in Metallization, Kyoto, Japan  4 - 6 April 2007
By: editors, Shinichi Ogawa, Paul S. Ho, Ehrenfried Zschech.
Contributors: Ogawa, Shinʼichi.; Ho, P. S.; Zschech, Ehrenfried.
Series: AIP conference proceedings -- 945; AIP conference proceedings -- no. 945.
Publisher: American Institute of Physics
Published: 2007
Place of publication: Melville, N.Y
Language: eng
Number of pages: 204
ISBN-13: 9780735404595
Subjects: Interconnects (Integrated circuit technology) -- Defects -- Congresses; Metal-metal bonds -- Congresses; Strength of materials -- Congresses; Nanostructured materials -- Congresses; Semiconductors -- Congresses; Copper -- Electric properties -- Congresses
Genres: Congresses.
Other titles: Ninth International Workshop on Stress-Induced Phenomena in Metallization; International Workshop on Stress-Induced Phenomena in Metallization
Notes: Includes bibliographical references and indexes.