Proceedings of the First International Symposium on Semiconductor Wafer Bonding
Subtitle: Science, Technology, and Applications (Electronics and Dielectric S)
Contributors: Jan Haisma (Contributor)
Publisher: Electrochemical Society
Published: March 1992
Language: eng
Format: Paperback
Number of pages: 498
ISBN-13: 9781566770088
Subjects: Bonding; Congresses; Science/Mathematics; Semiconductor wafers; Semiconductors