2002 International Conference on Simulation of Semiconductor Processes and Devices
Subtitle: SISPAD 2002 : September 4-6, 2002, International Conference Center Kobe, Kobe, Japan
By: co-sponsored by Japan Society of Applied Physics, IEEE Electron Devices Society ; in cooperation with the Institute of Electronics, Information and Communication Engineers ... [et al.].
Contributors: Ōyō Butsuri Gakkai.; IEEE Electron Devices Society.; Denshi Jōhō Tsūshin Gakkai (Japan)
Publisher: Business Center for Academic Societies, Japan
Published: 2002
Place of publication: Tokyo, Japan
Language: eng
Number of pages: 284
Subjects: Semiconductors -- Mathematical models -- Congresses.
Genres: Congresses.
Other titles: Simulation of semiconductor processes and devices; SISPAD 2002
Notes: Includes bibliographical references and author index.
"JSAP Catalog Number. AP21232 ; IEEE Catalog Number. 02TH8621"--T.p. verso.
Also available via the World Wide Web with additional title: Simulation of semiconductor processes and devices, 2002, SISPAD 2002, International Conference on.