Microelectronic interconnects and packaging, optical and electrical technologies
By: Gnanalingam Arjavalingam, James Pazaris, conference chairs/editors.
Contributors: Arjavalingam, Gnanalingam.; Pazaris, James.; Society of Photo-optical Instrumentation Engineers.; International Symposium on Advances in Interconnection and Packaging (1990 : Boston, Mass.)
Series: International Symposium on Advances in Interconnection and Packaging ;; bk. 1; Proceedings / SPIE--the International Society for Optical Engineering ;; v. 1389; Proceedings of SPIE--the International Society for Optical Engineering ;; v. 1389.
Publisher: SPIE
Published: 1991
Place of publication: Bellingham, Wash., USA
Language: eng
Number of pages: 674
Subjects: Microelectronic packaging -- Congresses.
Notes: Includes bibliographical references and index.
Papers from the International Symposium on Advances in Interconnection and Packaging, held 5-9 Nov. 1990, in Boston, Mass.