Advances in electronic circuit packaging
Subtitle: proceedings.
By: Edited by Michael A. Marrese.
Contributors: Marrese, Michael A., ed.; University of Colorado (Boulder campus)
Publisher: Cahners Pub. Co.; distributed by Plenum Press, New York
Published: 1964
Place of publication: [Englewood, Colo.]
Language: eng
Number of pages: 490
Subjects: Electronic packaging -- Congresses.
Other titles: Electrical design news.; Design news.
Notes: Includes bibliographical references.
"Sponsored by the University of Colorado, EDN (Electrical design news), and Design news."