Electronic assembly fabrication
Subtitle: chips, circuit boards, packages, and components
By: Charles A. Harper, editor-in-chief.
Contributors: Harper, Charles A.
Edition: 1st ed.
Series: McGraw-Hill professional engineering; Electronic packaging and interconnection series
Publisher: McGraw-Hill
Published: 2002
Place of publication: New York
Language: eng
Number of pages: 672
Subjects: Electronic apparatus and appliances -- Design and construction
Notes: Includes bibliographical references and index.