The U.S.-Japan seed war
Subtitle: a new aspect of friction in a high-tech area
By: Yoshikazu Niwa
Series: USJP occasional paper -- 87-09
Publisher: Harvard University, Program on U.S.-Japan Relations, Center for International Affairs and the Reischauer Institute of Japanese Studies
Published: 1987
Place of publication: Cambridge, Mass.
Language: eng
Number of pages: 18
Subjects: Seed industry and trade; Seeds; Development; Nontarrif trade barriers; Foreign economic relations
Other titles: United States-Japan seed war.; US-Japan seed war
Notes: Includes bibliographical references (leaf 18).