ASME 2015 13th International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, Volume 2
Subtitle: Advanced Electronics and Photonics, Packaging Materials and Processing, Interconnect and Reliability, Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales
Publisher: American Society of Mechanical Engineers, The
Published: 2015
Language: eng
ISBN-13: 9780791856895
Subjects: Electronic packaging