High temperature tension-compression fatigue behavior of a tungsten copper composite
By: Michael J. Verrilli and Timothy P. Gabb..
Contributors: Gabb, Timothy Paul, 1958-; Lewis Research Center.
Series: NASA technical memorandum -- 104370.
Publisher: National Aeronautics and Space Administration, Lewis Research Center; For sale by the National Technical Information Service
Published: 1991
Place of publication: [Cleveland, Ohio; Springfield, Va
Language: eng
Format: Microform
Subjects: Compressibility.; Copper.; Failure analysis.; Fiber composites.; High temperature.; Metal matrix composites.; Thermal fatigue.; Tungsten.
Notes: Also available via Internet from the NASA Technical Report Server web site. Address as of 4/13/05: http://ntrs.nasa.gov/archive/nasa/casi.ntrs.nasa.gov/19910015047%5F1991015047.pdf; current access is available via PURL.

Microfiche. [Washington, D.C. : National Aeronautics and Space Administration, 1991]. 1 microfiche.