Structural analysis in microelectronic and fiber optic systems
Subtitle: presented at the 1995 ASME International Mechanical Engineering Congress and Exposition, November 12-17, 1995, San Francisco, California
By: sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by Ephraim Suhir.
Contributors: Suhir, Ephraim.; American Society of Mechanical Engineers. Electrical and Electronic Packaging Division.; International Mechanical Engineering Congress and Exposition (1995 : San Francisco, Calif.)
Series: EEP ;; vol. 12; EEP (Series) ;; vol. 12.
Publisher: American Society of Mechanical Engineers
Published: 1995
Place of publication: New York
Language: eng
Number of pages: 195
Subjects: Microelectronics -- Congresses.; Fiber optics -- Congresses.; Structural analysis (Engineering) -- Congresses.
Notes: Includes bibliographical references and index.