Materials, technology and reliability of low-k dielectrics and copper interconnects
Subtitle: symposium held April 18-21, 2006, San Francisco, California, U.S.A.
By: editors Ting Y. Tsui [and others]
Series: Materials Research Society symposium proceedings -- v. 914; Materials Research Society symposia proceedings -- v. 914.
Publisher: Materials Research Society
Published: 2006
Place of publication: Warrendale, Pennsylvania
Language: eng
Number of pages: 462
Subjects: Semiconductors; Congresses; Junctions; Dielectric films; Integrated circuits; Materials; Reliability
Notes: Includes bibliographical references and indexes.