Encyclopedia of Packaging Materials, Processes, and Mechanics - Set 1
Subtitle: Die-Attach and Wafer Bonding Technology
Publisher: World Scientific Publishing Company
Published: Oct 18, 2019
Format: hardcover
Number of pages: 1080
ISBN-13: 9789811201110
Notes: Source title: Encyclopedia of Packaging Materials, Processes, and Mechanics - Set 1: Die-Attach and Wafer Bonding Technology (a 4-Volume Set)