Thermal challenges in next generation electronic systems
Subtitle: proceedings of the International Conference THERMES 2002, Santa Fe, New Mexico, USA, 13-16 January 2002
By: edited by Yogendra K. Joshi, Suresh V. Garimella.
Contributors: Joshi, Yogendra K.; Garimella, S. V.
Publisher: Millpress
Published: 2002
Place of publication: Rotterdam
Language: eng
Number of pages: 404
Subjects: Microelectronics -- Materials -- Thermal properties.; Electronic apparatus and appliances -- Thermal properties -- Congresses.
Genres: Congresses.
Other titles: THERMES 2002
Notes: Includes bibliographical references and indexes.