Proceedings of the Third International Symposium on Semiconductor Wafer Bonding
Subtitle: physics and applications
By: organizers/editors, C.E. Hunt ... [et al.]
Contributors: Hunt, C. E.; Electrochemical Society.
Series: Proceedings / Electrochemical Society ;; v. 95-7
Publisher: Electrochemical Society
Published: 1995
Place of publication: Pennington, NJ
Language: eng
Number of pages: 610
Subjects: Semiconductors -- Bonding -- Congresses; Semiconductor wafers -- Congresses
Notes: Includes bibliographical references and index.
"The Third International Symposium on Wafer Bonding was held at Reno in Spring, 1995"--Preface.