Computer aided design in electronic packaging
By: presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, Anaheim, California, November 8-13, 1992 ; sponsored by the Electrionic Packaging Division, ASME ; edited by Dereje Agonafer, Robert E. Fulton.
Contributors: Agonafer, D.; Fulton, Robert E.; American Society of Mechanical Engineers. Electrical and Electronic Packaging Division.
Series: EEP ;; vol. 3; EEP (Series) ;; vol. 3.
Publisher: American Society of Mechanical Engineers
Published: 1992
Place of publication: New York
Language: eng
Number of pages: 83
Subjects: Electronic packaging -- Design -- Data processing -- Congresses.; Computer-aided design -- Congresses.
Notes: Includes bibliographical references and index.