9th IEEE Workshop on Signal Propagation on Interconnects
Subtitle: proceedings : May 10-13, 2005, Hotel "Dorint", Garmisch-Partenkirchen, Germany
By: co-sponsored by IEEE Components, Packaging and Manufacturing Technology (CPMT) Society, Technical Committee on Electrical Design, Modeling and Simulation (TC-EDMS) and by IEEE Computer Society Tect Technology Technical Council (TTTC).
Contributors: Components, Packaging & Manufacturing Technology Society. Technical Committee on Electrical Design, Modeling and Simulation.; IEEE Computer Society. Technical Council on Test Technology.; IEEE Xplore (Online service)
Publisher: IEEE
Published: 2005
Place of publication: Piscataway, N.J
Language: eng
Format: Electronic resource
Number of pages: 218
Subjects: Printed circuits -- Congresses.; Signal theory (Telecommunication) -- Congresses.
Genres: Congresses.
Other titles: SPI 2005; Signal Propagation on Interconnects, 2005, proceedings, 9th IEEE Workshop on.
Notes: "IEEE Cat No: 05EX1048".

Includes bibliographical references.

Electronic reproduction. New York, N.Y. : IEEE, c2005. System requirements: Adobe Acrobat Reader. Mode of access: World Wide Web. Made available through IEEE Xplore under title: Signal Propagation on Interconnects, 2005, proceedings, 9th IEEE Workshop on.