Inside WorldCom
Subtitle: building a major telecom player
By: by Steven R. Harper.
Edition: 1st ed.
Publisher: Telecom Pub. Group
Published: 1998
Place of publication: Washington, D.C. (2115 Ward Court, N.W., Washington, D.C. 20037)
Language: eng
Number of pages: 174
Subjects: MCI WorldCom.; Telecommunication -- United States.; Telecommunication.