Design, test, integration and packaging of MEMS/MOEMS 2003
Subtitle: DTIP 2003 : 5-7 May, 2003, Cannes, France
By: Keren Bergman ... [et al.] chairs/editors ; sponsored by CNRS-INPG-UJF ... [et al.].
Contributors: Bergman, Keren.; Centre national de la recherche scientifique (France); Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (5th : 2003 : Cannes, France)
Publisher: IEEE
Published: 2003
Place of publication: Piscataway, N.J
Language: eng
Number of pages: 411
Subjects: Microelectromechanical systems -- Congresses.; Optoelectronic devices -- Congresses.; Micromachining -- Congresses.; Microelectronic packaging -- Congresses.
Genres: Congresses.
Other titles: DTIP 2003
Notes: Includes bibliographical references and partial author index.
"IEEE Catalog Number 03EX713"--T.p. verso.
"2003 proceedings, Fifth Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS"--T.p. verso.