Techniques and challenges for 300 mm silicon
Subtitle: processing, characterization, modelling and equipment : proceedings of Symposium F on Techniques and Challenges for 300 mm Silicon of the E-MRS 1998 Spring Conference, Strasbourg, France, 16-19 June 1998
By: edited by H. Richter, P. Wagner, G. Ritter.
Contributors: Richter, H., 1940-; Wagner, P.; Ritter, G.; European Materials Research Society. Meeting
Series: European Materials Research Society symposia proceedings ;; vol. 81; European Materials Research Society symposia proceedings ;; v. 81.
Publisher: Elsevier
Published: 1999
Place of publication: Amsterdam; New York
Language: eng
Number of pages: 297
Subjects: Semiconductor wafers -- Congresses.
Genres: Congresses.
Other titles: Techniques and challenges for three hundred mm silicon
Notes: Includes bibliographical references.
"Reprinted from Microelectronic engineering, vol. 45/2-3"--T.p. verso.