Application of Fracture Mechanics in Electronic Packaging and Materials
Subtitle: Presented at the 1995 Asme International Mechanical Engineering Congress and Exposition ... Francisco, California (Eep (Series), V. 11.)
Contributors: Tien Y. Wu (Editor); William T. Chen (Editor); Raymond A. Pearson (Editor); D. T. Read (Editor)
Publisher: American Society of Mechanical Engineers
Published: June 1995
Language: eng
Format: Paperback
Number of pages: 271
ISBN-13: 9780791817360
Subjects: Electronics engineering; Mechanics of solids; Electronics - General; Technology & Industrial Arts; Electronic packaging; Fracture mechanics; Congresses