Integrated circuit, hybrid, and multichip module package design guidelines
Subtitle: a focus on reliability
By: [edited by] Michael Pecht.
Contributors: Pecht, Michael.
Publisher: Wiley
Published: 1994
Place of publication: New York
Language: eng
Number of pages: 426
Subjects: Electronic packaging -- Design.; Hybrid integrated circuits -- Design and construction.; Multichip modules (Microelectronics) -- Design and construction.
Description: Circuit designers, packaging engineers, printed board fabricators, and procurement personnel will find this book's microelectronic package design-for-reliability guidelines and approaches essential for achieving their life-cycle, cost-effectiveness, and on-time delivery goals.

Its uniquely organized, time-phased approach to design, development, qualification, manufacture, and in-service management shows you step-by-step how to define realistic system requirements in terms of mission profile, operating life, performance expectations, size, weight, and cost; define the system usage environment so that all operating, shipping, and storage conditions, including electrical, thermal, radiation, and mechanical loads, are assessed using realistic data; identify potential failure modes, sites, mechanisms, and architecture-stress interactions - PLUS appropriate measures you can take to reduce, eliminate, or accommodate expected failures; characterize materials and processes by the key controllable factors, such as types and levels of defects, variations in material properties and dimensions, and the manufacturing and assembly processes involved; and use experiment, step-stress, and accelerated methods to ensure optimum design before production begins.
Notes: Includes bibliographical references and index.
"A Wiley-Interscience publication."