Proceedings 2003
Subtitle: International Symposium on Microelectronics : IMAPS : November 18-20, 2003, Hynes Convention Center, Boston, MA
By: sponsored by IMAPS, International Microelectronics and Packaging Society ; [endorsed by ACerS--the American Ceramic Society ; published in cooperation with SPIE--the International Society for Optical Engineering ; Ken Gilleo, IMAPS 2003 symposium technical program chair].
Contributors: Gilleo, Ken.; International Microelectronics and Packaging Society.; American Ceramic Society.; Society of Photo-optical Instrumentation Engineers.
Series: SPIE -- v. 5288; Proceedings of SPIE--the International Society for Optical Engineering -- v. 5288.
Publisher: IMAPS; SPIE
Published: 2003
Place of publication: Washington, D.C; [Bellingham, Wash.]
Language: eng
Number of pages: 1013
Subjects: Electronic packaging -- Congresses; Thick films -- Congresses; Electronic ceramics -- Congresses; Microelectromechanical systems -- Congresses
Genres: Congresses.
Other titles: 2003 International Symposium on Microelectronic; IMAPS; International Symposium on Microelectronics; Microelectronics
Notes: Includes bibliographical references and author index.