Copper interconnects, new contact metallurgies/structures, and low-k interlevel dielectrics II
Subtitle: proceedings of the international symposium
By: editor, G.S. Mathad ; assistant editors, V. Bakshi ...[et al.]
Contributors: Mathad, G. S.; Bakshi, V.; Electrochemical Society. Dielectric Science and Technology Division; Electrochemical Society. Electronics Division.; Electrochemical Society. Electrodeposition Division.; Electrochemical Society. Meeting.
Series: Proceedings ;; v. 2003-10; Proceedings (Electrochemical Society); v. 2003-10.
Publisher: Electrochemical Society
Published: 2003
Place of publication: Pennington, N.J
Language: eng
Number of pages: 276
Subjects: Integrated circuits -- Materials -- Congresses.; Electroplating -- Congresses.; Copper -- Congresses.; Dielectric films -- Congresses.
Genres: Congresses.
Notes: Includes bibliographical references and indexes.
"Sponsoring Divisions: Dielectric Science and Technology, Electronics, Electrodeposition."
" ... papers presented at the International Symposium on Copper Interconnects, Low-k Inter-level Dielectrics and New Contact Metallurgies/Structures, ... was held as part of the 204th Meeting of The Electrochemical Society, Inc., in Orlando, FL, October 12-17, 2003"-- Preface.