Manufacturing Challenges in Electronic Packaging
By: by Y. C. Lee, W. T. Chen
Contributors: Chen, W. T.
Publisher: Springer US
Published: 1998
Place of publication: Boston, MA
Language: eng
Format: [electronic resource] /
Number of pages: 261
ISBN-13: 9781461376590; 9781461558033
Subjects: Engineering; Machinery
Description: This book provides a single source reference that addresses both advanced packaging and manufacturing activities, enhanced by reviews and in-depth analysis. The common theme throughout the book is how to manufacture with only one defective package in a million escaping undetected. The book will become the most important reference for professionals who need to meet this goal through their design and manufacturing activities.
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Mode of access: World Wide Web.