Low and high dielectric constant materials
Subtitle: materials science, processing, and reliability issues : proceedings of the fourth international symposium : and, thin film materials for advanced packaging technologies : proceedings of the second international symposium
By: editors: R. Singh ... [et al.].
Contributors: Singh, Rajendra, 1946-; Electrochemical Society. Dielectric Science and Technology Division.; Electrochemical Society. Electronics Division.; International Symposium on Low and High Dielectric Constant Materials: Materials Science, Processing, and Reliability Issues (4th : 1999 : Seattle, Wash.); International Symposium on Thin Film Materials for Advanced Packaging (2nd : 1999 : Seattle, Wash.)
Series: Proceedings ;; v. 99-7; Proceedings (Electrochemical Society) ;; v. 99-7.
Publisher: Electrochemical Society, Inc.
Published: 2000
Place of publication: Pennington , NJ
Language: eng
Number of pages: 226
Subjects: Dielectric devices -- Congresses.; Dielectrics -- Congresses.; Thin films -- Congresses.; Electronic packaging -- Materials -- Congresses.
Genres: Congresses.
Other titles: Thin film materials for advanced packaging technologies
Notes: Includes bibliographical references and index.
"Dielectric Science and Technology and Electronics Divisions."
"Proceedings of the Fourth International Symposium on Low and High Dielectric Constant Materials and the Proceedings of the Second International Symposium on Thin Film Materials for Advanced Packaging ... held in Seattle ... May 2-7, 1999"--p. iii.