Heat transfer in electronic equipment
Subtitle: presented at the winter annual meeting of the American Society of Mechanical Engineers, Washington, D.C., November 15-20, 1981
By: sponsored by the K-12 Committee on Aircraft and Astronautical Heat Transfer, the Heat Transfer Division, ASME ; edited by Matthew D. Kelleher, M. Michael Yovanovich.
Contributors: Kelleher, Matthew D.; Yovanovich, M. Michael; American Society of Mechanical Engineers.; American Society of Mechanical Engineers. K-12 Committee on Aircraft and Astronautical Heat Transfer.
Publisher: ASME
Published: 1981
Place of publication: New York, N.Y. (345 E. 47th St., New York 10017)
Language: eng
Number of pages: 64
Subjects: Electronic apparatus and appliances -- Cooling -- Congresses.; Heat -- Transmission -- Congresses.
Notes: Includes bibliographical references.
"HTD-vol. 20."
Table of contents: title: Thermal considerations in the packaging of electrical and electronic components / A. Bar-Cohen and A. Kraus; title: Thermally optimum spacing of vertical, natural convection cooled, parallel plates / A. Bar-Cohen and W.M. Rohsenow; title: Experimental investigations on the temperature rise of printed circuit boards in open cabinets with natural ventilation / H. Birnbreier; title: Evaluation of surface heat transfer coefficients for electronic module packages / M.L. Buller and R.F. Kilburn; title: Cooling techniques and thermal analysis of circuit board mounted electronic equipment / C.J. Feldmanis; title: Microelectronic device thermal resistance / R.J. Hannemann; title: Predicting performance of forced air cooled heat sinks / F. Wenthen; title: Boiling heat transfer of silicon integrated-circuit chips mounted on a substrate / U.P. Hwang and K.P. Moran; title: Heat transfer performance of a heat pipe radiator for a 1,000 ampere thyristor with air cooling / M.D. Xin ... [et al.]