Applications of Experimental Mechanics to Electronic Packaging
Subtitle: Presented at the 1995 Asme International Mechanical Engineering Congress and Expositio (Eep)
Publisher: American Society of Mechanical Engineers
Published: January 1995
Language: eng
Format: Hardcover
Number of pages: 124
ISBN-13: 9780791817391
Subjects: Electronics engineering; Industrial Design - Packaging; Technology & Industrial Arts