Multichip module technologies and alternatives
Subtitle: the basics
By: edited by Daryl Ann Doane, Paul D. Franzon.
Contributors: Doane, Daryl Ann.; Franzon, Paul D.
Publisher: Van Nostrand Reinhold
Published: 1993
Place of publication: New York
Language: eng
Number of pages: 875
Subjects: Microelectronic packaging; Integrated circuits -- Very large scale integration -- Design and construction
Notes: Includes bibliographical references and index.