Proceedings of the symposia on interconnects, contact metallization, and multilevel metallization and reliability for semiconductor devices, interconnects, and thin insulator materials
By: edited by T. O. Herndon ... [et al.].
Contributors: Herndon, T. O.; Electrochemical Society. Dielectric Science and Technology Division.; Electrochemical Society. Electronics Division.; Electrochemical Society. Meeting; International Symposium on Interconnects, Contact Metallization, and Multilevel Metallization (3rd : 1993 : Honolulu, Hawaii); Symposium on Reliability of Semiconductor Devices, Interconnects, and Thin Insulators Materials (1993 : Honolulu, Hawaii)
Series: Proceedings ;; v. 93-25; Proceedings (Electrochemical Society) ;; v. 93-25.
Publisher: Electrochemical Society
Published: 1993
Place of publication: Pennington, NJ
Language: eng
Number of pages: 494
Subjects: Electronic packaging -- Congresses.; Semiconductors -- Congresses.; Metallizing -- Congresses.
Other titles: Interconnects, contact metallization, and multilevel metallization/reliability for semiconductor devices, interconnects, and thin insulator materials.
Notes: Includes bibliographical references and indexes.
"Dielectric Science and Technology and Electronics Divisions."
Papers presented at two symposia, the Third International Symposium on Interconnects, Contact Metallization, and Multilevel Metallization and the Symposium on Reliability of Semiconductor Devices, Interconnects, and Thin Insulators Materials, held during the 183rd Meeting of the Electrochemical Society in Honolulu, Hawaii, May 16-21, 1993.
Spine title:  Interconnects, contact metallization, and multilevel metallization/reliability for semiconductor devices, interconnects, and thin insulator materials.