Foldable Flex and Thinned Silicon Multichip Packaging Technology (Emerging Technology in Advanced Packaging)
Edition: 1 edition
Publisher: Springer
Published: January 31, 2003
Language: eng
Format: Hardcover
Number of pages: 360
ISBN-13: 9780792376767
Subjects: Electronics engineering; Industrial Chemistry & Manufacturing Technologies; Technology & Industrial Arts; Microelectronic packaging; Flexible printed circuits; Technology; Science/Mathematics; Multichip modules (Microelectr; Electronics - General; Engineering - Industrial; General; Technology / Engineering / Industrial; Material Science; Chip scale packaging; Multichip modules (Microelectronics)
First sentence: In the quest for high density packaging of electronic circuits, there is no question that stacking the Integrated Circuit chips provides more capability for a given area of the mother board or substance.