Chemical mechanical planarization of microelectronic materials
By: Joseph M. Steigerwald, Shyam P. Murarka, Ronald J. Gutmann.
Contributors: Murarka, S. P.; Gutmann, Ronald J.
Publisher: J. Wiley
Published: 1997
Place of publication: New York
Language: eng
Number of pages: 324
Subjects: Microelectronics -- Materials.; Grinding and polishing.
Description: Chemical Mechanical Planarization of Microelectronic Materials provides engineers and scientists working in the microelectronics industry with unified coverage of both the fundamental mechanisms and engineering applications of CMP.

Authors Steigerwald, Murarka, and Gutmann - all leading CMP pioneers - provide a historical overview of CMP, explain the various chemical and mechanical concepts involved, describe CMP materials and processes, review the latest scientific data on CMP worldwide, and offer examples of its uses in the microelectronics industry. They provide detailed coverage of the CMP of various materials used in the making of microcircuitry: tungsten, aluminum, copper, polysilicon, and various dielectric materials, including polymers.

The concluding chapter describes post-CMP cleaning techniques, and most chapters feature problem sets to assist readers in developing a more practical understanding of CMP. The only comprehensive reference to one of the fastest growing integrated circuit manufacturing technologies, Chemical Mechanical Planarization of Microelectronic Materials is an important resource for research scientists and engineers working in the microelectronics industry.
Notes: Includes bibliographical references and index.