Medical device materials III
Subtitle: proceedings from the Materials & Processes for Medical Devices Conference 2005, November 14-16, 2005, Boston, Massachusetts, USA
By: edited by Ramakrishna Venugopalan, Ming Wu  ; sponsored by ASM International.
Contributors: Venugopalan, Ramakrishna.; Wu, Ming Hsiung.
Publisher: ASM International
Published: 2006
Place of publication: Materials Park, OH
Language: eng
Number of pages: 250
ISBN-13: 9780871708458
Subjects: Biomedical materials -- Congresses
Genres: Congresses.
Notes: "SAN 204-7586"--T.p. verso.