Studies on via coupling on multilayer printed circuit boards
By: Timo Tarvainen
Contributors: Oulun yliopisto
Series: Acta Universitatis Ouluensis. C, Technica -- 134; Acta Universitatis Ouluensis -- no. 134
Publisher: Oulun yliopisto
Published: 1999
Place of publication: Oulu
Language: eng
Number of pages: 87
Subjects: Printed circuits; Design and construction; Electronic circuits
Notes: Thesis (doctoral)--University of Oulu, 1999.

Includes bibliographical references (p. [86]-87)